Mechanisms of radical production in CF3Cl, CF3Br, and related plasma etching gases: The role of added oxidants

1981 ◽  
Vol 1 (1) ◽  
pp. 37-52 ◽  
Author(s):  
Daniel L. Flamm
1980 ◽  
Vol 19 (7) ◽  
pp. 1371-1376 ◽  
Author(s):  
Teruhiko Yamazaki ◽  
Yoshiki Suzuki ◽  
Jun Uno ◽  
Hidefumi Nakata

1983 ◽  
Vol 38 (4) ◽  
pp. 387-393
Author(s):  
A. A. Goncharenko ◽  
D. I. Slovetskii ◽  
E. F. Shelykhmanov
Keyword(s):  

1993 ◽  
Vol 62 (9) ◽  
pp. 958-960 ◽  
Author(s):  
O. O. Awadelkarim ◽  
T. Gu ◽  
P. I. Mikulan ◽  
R. A. Ditizio ◽  
S. J. Fonash ◽  
...  

1992 ◽  
Vol 279 ◽  
Author(s):  
M. Rahman ◽  
M. A. Foad ◽  
S. Hicks ◽  
M. C. Holland ◽  
C. D. W. Wilkinson

ABSTRACTDry etching can introduce defects into the material being etched. Simple expressions for both sidewall and top surface defect distributions may be obtained by assuming that the defects are introduced according to a phenomenological source function. Calculations of conductance based on these expressions are found to describe very well measurements on dry-etched wires and epilayers. Mechanisms by which defects can penetrate into the sample are discussed. The role of sample heating and defect diffusion is examined. In-situ measurements of sample temperature during a dry-etch run indicate that simple diffusion is insufficient to account entirely for the observed damage. Instead, dry-etch damage may arise from other mechanisms such as by knock-on replacement collisions, or via a channeling effect. A more complex form of diffusion may also affect the final damage distribution.


2009 ◽  
Vol 282 (1) ◽  
pp. 63-76 ◽  
Author(s):  
Pawel Mroz ◽  
Jayeeta Bhaumik ◽  
Dilek K. Dogutan ◽  
Zarmeneh Aly ◽  
Zahra Kamal ◽  
...  

1991 ◽  
Vol 13 (6) ◽  
pp. 749
Author(s):  
M. Nishikawa ◽  
T. Sakane ◽  
M. Kogure ◽  
T. Sato ◽  
C. Higuchi ◽  
...  

1982 ◽  
Vol 51 (1) ◽  
pp. 53-64 ◽  
Author(s):  
Antti Zitting ◽  
Grażyna Szumańska ◽  
Juha Nickels ◽  
Heikki Savolainen

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