Barrier height enhancement in WSi x /GaAs Schottky diodes by rapid thermal annealing

Author(s):  
J. Osvald ◽  
T. Lalinsk�
1989 ◽  
Vol 160 ◽  
Author(s):  
Larry P. Sadwick ◽  
Dwight C. Streit

AbstractIn this work we have studied the effects of silicon planar doping on the electrical and optical properties of GaAs, and the effects of rapid thermal annealing on AIGaAs planar-doped structures. MBE-grown GaAs epilayers with multiple planar-doped layers displayed a 1.2 eV photoluminescence peak, presumably due to gallium vacancy - donor complexes, for samples with nominal silicon sheet densities much greater than measured charge densities. The Hall mobilities of these samples were also reduced compared to both uniformly-doped and planar-doped structures whose silicon areal densities were more nearly equal to measured sheet charge densities, although X-Ray rocking curves were nearly identical in all cases. Planar-doped AIGaAs Schottky diodes had nearly ideal electrical characteristics. Rapid thermal annealing of the planar-doped structures before fabrication increased the diode ideality factor from n=1.06 to n=1.60, seriously degraded the saturation current and breakdown voltage, and increased the doping profile FWHM from 60Å to 170Å.


1993 ◽  
Vol 320 ◽  
Author(s):  
V. Aubry ◽  
F. Meyer ◽  
R. Laval ◽  
C. Clerc ◽  
P. Warren ◽  
...  

ABSTRACTThermal reaction of W with Si1−xGex films epitaxially grown by Rapid Thermal Chemical Vapor Deposition was investigated in the temperature range 500°C - 1000°C. The samples were annealed either in a Rapid Thermal Annealing (RTA) system or in a conventional furnace, both in flowing nitrogen. The reaction products were investigated by Rutherford Backscattering Spectroscopy (RBS), Energy Dispersive Spectrometry (EDS) and X-ray diffraction (XRD). Sheet resistance measurements were also performed to follow the progress of the reaction. The reaction of W with Si0.67Ge0.33 is similar to that of W with silicon. W reacts with silicon to form tetragonal WSi2. The Ge-content in the silicide is lower than that of the asdeposited alloy. It is shown that an oxygen contamination occurs during conventional annealing and leads to the formation of non homogeneous Si1−x Gex unreacted alloy below the silicide film. Rapid thermal annealing prevents this parasitic effect and the unreacted film remains homogeneous although a slight decrease in the Ge-content is observed. These results are correlated with Schottky barrier height measurements on p-Si0.83Ge0.17 partially strained films. We observed an increase of the barrier height with increasing the temperature for annealing from 500°C to 1000°C. This trend may be explained either by strain relaxation or (and) Ge-content decrease in the unreacted alloy.


1994 ◽  
Vol 246 (1-2) ◽  
pp. 172-176 ◽  
Author(s):  
J. Perez-Rigueiro ◽  
C. Jimenez ◽  
R. Perez-Casero ◽  
J.M. Martinez-Duart

2015 ◽  
Vol 107 (9) ◽  
pp. 093502 ◽  
Author(s):  
Ashutosh Kumar ◽  
M. Latzel ◽  
S. Christiansen ◽  
V. Kumar ◽  
R. Singh

2013 ◽  
Vol 47 (1) ◽  
pp. 81-84 ◽  
Author(s):  
P. A. Ivanov ◽  
N. D. Il’inskaya ◽  
A. S. Potapov ◽  
T. P. Samsonova ◽  
A. V. Afanas’ev ◽  
...  

2021 ◽  
Vol 68 (3) ◽  
pp. 1176-1180
Author(s):  
Juan Wang ◽  
Dan Zhao ◽  
Guoqing Shao ◽  
Zhangcheng Liu ◽  
Xiaohui Chang ◽  
...  

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