Schottky Barrier Height Modification on n-Type Silicon by Wet Chemical Etching

1989 ◽  
Vol 111 (1) ◽  
pp. K31-K35 ◽  
Author(s):  
G. A. Adegboyega
1989 ◽  
Vol 48 (4) ◽  
pp. 391-395 ◽  
Author(s):  
G. A. Adegboyega ◽  
A. Poggi ◽  
E. Susi ◽  
A. Castaldini ◽  
A. Cavallini

2018 ◽  
Vol 15 (11) ◽  
pp. 803-809
Author(s):  
Doldet TANTRAVIWAT ◽  
Wittawat YAMWONG ◽  
Udom TECHAKIJKAJORN ◽  
Kazuo IMAI ◽  
Burapat INCEESUNGVORN

Herein, boron implantation technique was employed to engineer the Schottky barrier height (SBH) of Ti/n-type silicon junction (Ti/n-Si). The Ti/n-Si Schottky diodes with boron doses of 4, 5.4 and 6.6´1012 cm-2 at the energy of 25 keV were fabricated with improved rectification and their effective SBHs increased from 0.49 to 0.95. The tuning of the effective SBH is mainly attributed to the presence of shallow p-layer, which modifies the energy band at Ti/n-Si interface. This work clearly shows that the ability to precisely control the SBH, regardless of the metal work function, would facilitate the implementation of Schottky diode into various semiconductor structures, such as MPS (Merged PiN Schottky) diode, in order to improve performance without major modification on the existing metal line process.


2002 ◽  
Vol 36 (3) ◽  
pp. 282-285 ◽  
Author(s):  
O. V. Feklisova ◽  
E. B. Yakimov ◽  
N. A. Yarykin

1981 ◽  
Vol 38 (11) ◽  
pp. 865-866 ◽  
Author(s):  
H. Norde ◽  
J. de Sousa Pires ◽  
F. d’Heurle ◽  
F. Pesavento ◽  
S. Petersson ◽  
...  

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