High-aspect-ratio silicon dioxide pillars

2005 ◽  
Vol 202 (8) ◽  
pp. 1634-1638 ◽  
Author(s):  
T. Trifonov ◽  
A. Rodríguez ◽  
F. Servera ◽  
L. F. Marsal ◽  
J. Pallarès ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
Silicon Dioxide ◽  
High Aspect Ratio

High Aspect Ratio Silicon Dioxide-Coated Single-Walled Carbon Nanotube Scanning Probe Nanoelectrodes

2009 ◽  
Vol 113 (16) ◽  
pp. 6815-6820 ◽  
Author(s):  
Yoshie Narui ◽  
Donato M. Ceres ◽  
Jinyu Chen ◽  
Konstantinos P. Giapis ◽  
C. Patrick Collier
Keyword(s):  
Carbon Nanotube ◽  
Aspect Ratio ◽  
Silicon Dioxide ◽  
High Aspect Ratio ◽  
Scanning Probe ◽  
Single Walled Carbon Nanotube ◽  
Single Walled Carbon

Fabrication of Dual-Damascene Structures in Low Dielectric Constant Polymers for Multilevel Interconnects

1996 ◽  
Vol 427 ◽  
Author(s):  
R. Tacito ◽  
C. Steinbrüchel
Keyword(s):  
Dielectric Constant ◽  
Aspect Ratio ◽  
Silicon Dioxide ◽  
High Aspect Ratio ◽  
Reactive Ion Etching ◽  
Low Dielectric Constant ◽  
Ion Etching ◽  
Fine Line ◽  
Dual Damascene ◽  
Low Dielectric

AbstractParylene-n (pa-n) and benzocyclobutene (BCB) are novel candidate materials for interlevel dielectrics in future multilevel interconnects, due to their dielectric constant being much lower than that of silicon dioxide. We describe the fine line patterning of these materials by reactive ion etching in O2/CF4 plasmas. Examples of high aspect ratio trenches and dual damascene structures are presented involving processes with single and double hardmasks.

Single High Aspect Ratio Pillar Support Structures: Multi-Scale Chip Integrated Conformal Structures

2004 ◽  
Author(s):  
M. T. Northen ◽  
K. L. Turner
Keyword(s):  
Aspect Ratio ◽  
Silicon Dioxide ◽  
High Aspect Ratio ◽  
Single Crystal Silicon ◽  
Fiber Surface ◽  
Processing Technique ◽  
Crystal Silicon ◽  
Nano Fiber ◽  
Titanium Surfaces ◽  
Conformal Structures

This paper describes the realization of the integration of micro and nanoscale conformal structures. A new dry processing technique is used to create structures supported by a single high aspect ratio pillar support (SHARPS), creating submicron single crystal silicon features, with tight geometric control, attached to much larger (10–200μm) silicon dioxide platforms. The platforms have lithographically defined two dimensional shapes. The curvature of the platforms is adjusted through metal deposition and subsequent processing. The flexibility of the structures allows them to conform to meso and microscale roughness. To account for nanoscale conformance stochastic arrays of vertically aligned titania nanofibers are created on the platform surface. The application of the system as a passive microadhesive is investigated using a nanoindenter. Results show that the titania nano fiber surface offers significant increase in adhesion over smooth silicon dioxide or titanium surfaces. However when used in conjunction with the SHARPS structures the fibers are too stiff to allow for conformance to the surface prior to larger scale conformation, thus the combination does not increase the overall adhesion.

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