Barrier inhomogeneities and electrical characteristics of Ni/Ti bilayer Schottky contacts on 4H-SiC after high temperature treatments

2005 ◽  
Vol 202 (4) ◽  
pp. 692-697 ◽  
Author(s):  
R. Pérez ◽  
N. Mestres ◽  
J. Montserrat ◽  
D. Tournier ◽  
P. Godignon
2004 ◽  
Vol 831 ◽  
Author(s):  
E. Kaminska ◽  
A. Piotrowska ◽  
K. Golaszewska ◽  
R. Lukasiewicz ◽  
A. Szczesny ◽  
...  

ABSTRACTWe have developed the deposition and studied the electrical characteristics and thermal reliability of Ru-based contacts on n- type GaN as well as on AlGaN/GaN heterostructure. Amorphous, conducting and transparent RuSiO4 contacts with their extremely low reverse currents and thermal stability up to 900°C, show great potential for use as Schottky contacts to n-type GaN and gate electrodes for AlGaN/GaN HEMT in high temperature, high power applications as well as in UV detectors.


1985 ◽  
Vol 54 ◽  
Author(s):  
N. Yokoyama ◽  
T. Ohnishi ◽  
T. Nakamura ◽  
H. Nishi

ABSTRACTRefractory suicides form high temperature stable Schottky contacts to GaAs. This finding enabled us to develop self-aligned GaAs MESFETs, thereby enabling the development of today's GaAs ICs. This paper reviews electrical and metallurgical studies on refractory-metal/GaAs and refractory-metal-si licide/GaAs interfaces. We emphasize the fact that W5Si3/GaAs contacts have extremely stable electrical properties even after annealing at temperatures up to 850°C. Crystallographical properties of the W5S3 film on GaAs, investigated by x-ray and TEM measurement techiques, are also covered. We found that the Schottky electrical characteristics are not affected by whether the film is amorphous or crystalline.


2006 ◽  
Vol 100 (10) ◽  
pp. 104502 ◽  
Author(s):  
C. P. Chen ◽  
Y. J. Lee ◽  
Y. C. Chang ◽  
Z. K. Yang ◽  
M. Hong ◽  
...  

2000 ◽  
Vol 39 (Part 2, No. 4B) ◽  
pp. L351-L353 ◽  
Author(s):  
Subramaniam Arulkumaran ◽  
Takashi Egawa ◽  
Guang-Yuan Zhao ◽  
Hiroyasu Ishikawa ◽  
Takashi Jimbo ◽  
...  

2018 ◽  
Vol 924 ◽  
pp. 440-443
Author(s):  
Yeganeh Bonyadi ◽  
Peter M. Gammon ◽  
Olayiwola Alatise ◽  
Roozbeh Bonyadi ◽  
Philip A. Mawby

In this paper, the application of a high temperature thermal oxidation and annealing process to 4H-SiC PiN diodes with 35 μm thick drift regions is explored, the aim of which was to increase the carrier lifetime in the 4H-SiC. Diodes were fabricated using 4H-SiC material and underwent a thermal oxidation in dry pure O2 at 1550◦C followed by an argon anneal at the same temperature. Reverse recovery tests indicated a carrier lifetime increase of around 42% which is due to increase of excessive minority carriers in the drift region. The switching results illustrate that the use of this process is a highly effective and efficient way of enhancing the electrical characteristics of high voltage 4H-SiC bipolar devices.


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