Mass‐to‐charge ion composition of plasma in a magnetron discharge with reactive sputtering of titanium target

2020 ◽  
Author(s):  
Andrey V. Tyunkov ◽  
Victor A. Burdovitsin ◽  
Efim M. Oks ◽  
Maxim V. Shandrikov ◽  
Yury G. Yushkov ◽  
...  
Keyword(s):  
Reactive Sputtering ◽  
Ion Composition ◽  
Magnetron Discharge ◽  
Titanium Target

Generation of Positive and Negative Oxygen Ions in Magnetron Discharge During Reactive Sputtering of Alumina

2010 ◽  
Vol 7 (11) ◽  
pp. 910-914 ◽  
Author(s):  
Petr Pokorný ◽  
Jiří Bulíř ◽  
Ján Lančok ◽  
Jindřich Musil ◽  
Michal Novotný
Keyword(s):  
Reactive Sputtering ◽  
Magnetron Discharge ◽  
Oxygen Ions

scholarly journals Thermal processes during reactive sputtering of hot titanium target

2017 ◽  
Vol 857 ◽  
pp. 012031
Author(s):  
E A Minzhulina ◽  
V I Shapovalov ◽  
V V Smirnov ◽  
A V Zav’aylov ◽  
V S Levitskiy
Keyword(s):  
Reactive Sputtering ◽  
Thermal Processes ◽  
Titanium Target

Surface nitridation processes and non-linear behaviour of the reactive magnetron discharge with titanium target

Vacuum ◽  
2001 ◽  
Vol 61 (2-4) ◽  
pp. 163-167 ◽  
Author(s):  
D Luca ◽  
A.W Denier van der Gon ◽  
V Anita ◽  
M.W.G Ponjee ◽  
H.H Brongersma ◽  
...  
Keyword(s):  
Reactive Magnetron ◽  
Magnetron Discharge ◽  
Titanium Target ◽  
Non Linear ◽  
Linear Behaviour

Effect of the Plasma Deposition Parameters on the Properties of Ti/TiC Multilayers for Hard Coatings Applications

2011 ◽  
Vol 227 ◽  
pp. 156-159 ◽  
Author(s):  
Nadia Saoula ◽  
Karim Henda ◽  
Rafika Kesri
Keyword(s):  
Plasma Deposition ◽  
Lower Layer ◽  
High Hardness ◽  
Reactive Sputtering ◽  
Hard Coatings ◽  
Gas Mixture ◽  
Silicon Substrates ◽  
Deposition Parameters ◽  
Titanium Target ◽  
Measurement Results

Titanium carbide (TiC) hard coatings have been obtained on steel and silicon substrates by r.f. magnetron sputtering process. Two layer coatings have been deposited in order to improve adhesion on steel. The lower layer was titanium metal and the upper TiC layer was obtained by reactive sputtering of the titanium target in Ar and methane gas mixture. The study confirmed that the TiC layer composition depends on the reactive sputtering gas composition. Film microhardness was measured by microindentation. Measurement results showed that high hardness coatings can be prepared at a relative low concentration of methane in gas mixture and that good adhesion on steel is achieved with the two layer coating.

Study on reactive sputtering of titanium in the linear magnetron discharge

2006 ◽  
Vol 201 (6) ◽  
pp. 3571-3576 ◽  
Author(s):  
B. Kułakowska-Pawlak ◽  
J. Walkowicz
Keyword(s):  
Reactive Sputtering ◽  
Magnetron Discharge

Preparation and characterization of thin films of carbon nitride

1995 ◽  
Vol 53 ◽  
pp. 104-105
Author(s):  
L. Wan ◽  
R. F. Egerton
Keyword(s):  
Carbon Nitride ◽  
Arc Discharge ◽  
Ion Beam ◽  
Chemical Vapor ◽  
Reactive Sputtering ◽  
Vacuum Arc ◽  
Specimen Preparation ◽  
Bonding Structure ◽  
Electron Energy Loss

INTRODUCTION Recently, a new compound carbon nitride (CNx) has captured the attention of materials scientists, resulting from the prediction of a metastable crystal structure β-C3N4. Calculations showed that the mechanical properties of β-C3N4 are close to those of diamond. Various methods, including high pressure synthesis, ion beam deposition, chemical vapor deposition, plasma enhanced evaporation, and reactive sputtering, have been used in an attempt to make this compound. In this paper, we present the results of electron energy loss spectroscopy (EELS) analysis of composition and bonding structure of CNX films deposited by two different methods.SPECIMEN PREPARATION Specimens were prepared by arc-discharge evaporation and reactive sputtering. The apparatus for evaporation is similar to the traditional setup of vacuum arc-discharge evaporation, but working in a 0.05 torr ambient of nitrogen or ammonia. A bias was applied between the carbon source and the substrate in order to generate more ions and electrons and change their energy. During deposition, this bias causes a secondary discharge between the source and the substrate.

Sign in / Sign up

Export Citation Format

Share Document