Insight into the Reaction Scheme of SiO2 Film Deposition at Atmospheric Pressure

2013 ◽  
Vol 10 (12) ◽  
pp. 1061-1073 ◽  
Author(s):  
Katja Rügner ◽  
Rüdiger Reuter ◽  
Dirk Ellerweg ◽  
Teresa de los Arcos ◽  
Achim von Keudell ◽  
...  
Keyword(s):  
Atmospheric Pressure ◽  
Reaction Scheme ◽  
Sio2 Film ◽  
Film Deposition ◽  
Insight Into

SiO2 film deposition by XeCl laser ablation of fused silica

1995 ◽  
Vol 86 (1-4) ◽  
pp. 128-133 ◽  
Author(s):  
P. Baeri ◽  
R. Reitano ◽  
N. Marino
Keyword(s):  
Laser Ablation ◽  
Sio2 Film ◽  
Fused Silica ◽  
Film Deposition ◽  
Xecl Laser

scholarly journals Insight on Solution Plasma in Aqueous Solution and Their Application in Modification of Chitin and Chitosan

2021 ◽  
Vol 22 (9) ◽  
pp. 4308
Author(s):  
Chayanaphat Chokradjaroen ◽  
Jiangqi Niu ◽  
Gasidit Panomsuwan ◽  
Nagahiro Saito
Keyword(s):  
Aqueous Solutions ◽  
Atmospheric Pressure ◽  
Scientific Progress ◽  
Biological Properties ◽  
Environmental Concerns ◽  
Plasma Process ◽  
Renewable Materials ◽  
Chemical Structures ◽  
Chitin And Chitosan ◽  
Insight Into

Sustainability and environmental concerns have persuaded researchers to explore renewable materials, such as nature-derived polysaccharides, and add value by changing chemical structures with the aim to possess specific properties, like biological properties. Meanwhile, finding methods and strategies that can lower hazardous chemicals, simplify production steps, reduce time consumption, and acquire high-purified products is an important task that requires attention. To break through these issues, electrical discharging in aqueous solutions at atmospheric pressure and room temperature, referred to as the “solution plasma process”, has been introduced as a novel process for modification of nature-derived polysaccharides like chitin and chitosan. This review reveals insight into the electrical discharge in aqueous solutions and scientific progress on their application in a modification of chitin and chitosan, including degradation and deacetylation. The influencing parameters in the plasma process are intensively explained in order to provide a guideline for the modification of not only chitin and chitosan but also other nature-derived polysaccharides, aiming to address economic aspects and environmental concerns.

Atmospheric Pressure Low Temperature Direct Plasma Technology: Status and Challenges for Thin Film Deposition

2012 ◽  
Vol 9 (11-12) ◽  
pp. 1041-1073 ◽  
Author(s):  
Francoise Massines ◽  
Christian Sarra-Bournet ◽  
Fiorenza Fanelli ◽  
Nicolas Naudé ◽  
Nicolas Gherardi
Keyword(s):  
Thin Film ◽  
Low Temperature ◽  
Atmospheric Pressure ◽  
Thin Film Deposition ◽  
Film Deposition ◽  
Plasma Technology

Radio frequency expanding plasmas at low, intermediate, and atmospheric pressure and their applications

2008 ◽  
Vol 80 (9) ◽  
pp. 1919-1930 ◽  
Author(s):  
Gheorghe Dinescu ◽  
Eusebiu R. Ionita
Keyword(s):  
Radio Frequency ◽  
Atmospheric Pressure ◽  
Thin Film Deposition ◽  
Plasma Jets ◽  
Film Deposition ◽  
High Mass ◽  
Rf Plasma ◽  
Temperature Sensitive ◽  
Large Size ◽  
Wide Range

We report on the operation and characteristics of radio frequency (RF) plasma beam sources based on the expansion of the discharge outside of limited spaces with small interelectrode gaps. The appropriate electrode configuration, combined with high mass flow values and appropriate power levels, leads to small- or large-size plasma jets, working stably at low, intermediate, and atmospheric pressures. The sources are promising tools for a wide range of applications in thin film deposition, surface modification, and cleaning, including the case of temperature-sensitive substrates.

scholarly journals The Role Played in the Improvement of the SiO2/SiC Interface by a Thin SiO2 Film Thermally Grown Prior to Oxide Film Deposition

2012 ◽  
Vol 2 (1) ◽  
pp. P8-P10 ◽  
Author(s):  
E. Pitthan ◽  
R. Palmieri ◽  
S. A. Correa ◽  
G. V. Soares ◽  
H. I. Boudinov ◽  
...  
Keyword(s):  
Oxide Film ◽  
Sio2 Film ◽  
Film Deposition ◽  
Thermally Grown

scholarly journals Thin Film Deposition by Atmospheric Pressure Dielectric Barrier Discharges Containing Eugenol: Discharge and Coating Characterizations

Polymers ◽  
2020 ◽  
Vol 12 (11) ◽  
pp. 2692
Author(s):  
Tsegaye Gashaw Getnet ◽  
Milton E. Kayama ◽  
Elidiane C. Rangel ◽  
Nilson C. Cruz
Keyword(s):  
Atmospheric Pressure ◽  
Gas Flow ◽  
Steel Substrate ◽  
Ambient Air ◽  
Thin Film Deposition ◽  
Film Structure ◽  
Film Deposition ◽  
Maximum Plasma ◽  
Peak Voltage ◽  
Dielectric Barrier

Eugenol (4-Allyl-2-methoxyphenol) is the main constituent of clove oil. In addition to being widely used as a condiment, it has been recognized as a powerful bactericide. Owing to that, Eugenol has been used in several applications including odontology and as a conservative for food products. Aiming at the development of natural bactericide coatings, in this work, using an atmospheric pressure plasma in a dielectric barrier discharge (DBD) reactor Eugenol was deposited on stainless steel substrate, with argon as a carrier gas. The discharge power supply was a transformer at 14.4 kV peak-to-peak voltage and 60 Hz frequency. Operating with a gas flow rate at 4 L/min, the active power was around 1.2 W. The maximum plasma electron temperature of the plasma with monomers was about 1.5 eV, estimated by visible emission spectroscopy using a local thermodynamic equilibrium approach. The study also comprehended the analysis of the film structure, aging, and thermal stability using infrared reflectance spectroscopy, and its thicknesses and roughness by profilometry. The thickness of the films was in the range of 1000 to 2400 nm with a roughness of up to 800 nm with good adhesion on the substrate. The FTIR result shows a stable coating with a chemical structure similar to that of the monomer. Aging analysis showed that the film does not degrade, even after exposing the film for 120 days in ambient air and for 1.0 h under a high thermal UV-lamp.

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