Modeling of steady-state and transient thermal performance of a Li-ion cell with an axial fluidic channel for cooling

2014 ◽  
Vol 39 (4) ◽  
pp. 573-584 ◽  
Author(s):  
K. Shah ◽  
A. Jain
Keyword(s):  
Steady State ◽  
Thermal Performance ◽  
Fluidic Channel ◽  
Li Ion ◽  
Transient Thermal

Steady-State and Transient Thermal Performance of Subsea Hardware

1998 ◽  
Vol 13 (02) ◽  
pp. 108-113 ◽  
Author(s):  
G.J. Zabaras ◽  
Jianfeng Zhang
Keyword(s):  
Steady State ◽  
Thermal Performance ◽  
Transient Thermal

scholarly journals Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules

2020 ◽  
Vol 142 (4) ◽  
Author(s):  
Emre Gurpinar ◽  
Burak Ozpineci ◽  
Shajjad Chowdhury
Keyword(s):  
Steady State ◽  
Thermal Performance ◽  
High Power ◽  
Coefficient Of Thermal Expansion ◽  
Wide Bandgap ◽  
Design Analysis ◽  
Dielectric Thickness ◽  
Metal Substrates ◽  
Power Modules ◽  
Transient Thermal

Abstract Direct bonded copper (DBC) substrates used in power modules have limited heat spreading and manufacturing capability due to ceramic properties and manufacturing technology. The ceramic and copper bonding is also subject to high mechanical stress due to coefficient of thermal expansion mismatch between the copper and the ceramic. For wide-bandgap (WBG) devices, it is of interest exploring new substrate technologies that can overcome some of the challenges of direct bonded copper substrates. In this technical paper, the design, analysis, and comparison of insulated metal substrates (IMSs) for high-power wide-bandgap semiconductor-based power modules are discussed. This paper starts with technical description and discussion of state-of-the-art DBC substrates with different ceramic insulators such as aluminum nitride (AlN), Al2O3, and Si3N4. Next, an introduction of IMSs and their material properties, and a design approach for SiC (silicon carbide) metal-oxide-semiconductor field-effect transistor (MOSFET)-based power modules for high-power applications is provided. The influence of dielectric thickness on the power handling capability of the substrate are also discussed. The designed IMS and DBC substrates were characterized in terms of steady-state and transient thermal performance using finite element simulation. Finally, the performance of the IMS and DBC are validated in an experimental setup under different loading and cooling temperature conditions. The simulation and experimental results showed that the IMS can provide high steady-state thermal performance for high-power modules based on SiC MOSFETs. Furthermore, the IMS provided enhanced transient thermal performance, which provided a reduced junction temperature when the module is operated at low fundamental output frequencies in traction drive systems.

Thermal Performance Evaluation of New Power QFN (Quad Flat No Lead) Packages for Automotive Applications

2004 ◽  
Author(s):  
Victor Chiriac ◽  
Tien-Yu Tom Lee
Keyword(s):  
Steady State ◽  
Thermal Performance ◽  
Numerical Study ◽  
Peak Temperature ◽  
Junction Temperature ◽  
Automotive Applications ◽  
Isothermal Boundary ◽  
Die Attach ◽  
Transient Thermal ◽  
The Impact

An extensive 3-D conjugate numerical study is conducted to assess the thermal performance of the novel Power Quad Flat No Lead (PQFN) packages for automotive applications. Several PQFN packages are investigated, ranging from smaller die/flag size to larger ones, single or multiple heat sources, operating under various powering and boundary conditions. The steady state and transient thermal performance are compared to those of the classical packages, and the impact of the thicker lead frame and die attach material on the overall thermal behavior is also evaluated. Under one steady state (1W) operating scenario, the PQFN package reaches a peak temperature of ~106.3°C, while under 37W@40ms of transient powering, the peak temperature reached by the corner FET is ~260.8°C. With an isothermal boundary (85°C) attached to the board backside, the junction temperature does not change, as the PCB has no significant thermal impact. However, when the isothermal boundary is attached to package bottom, it leads to a drop in by almost 20% after 40 ms. Additional transient cases are evaluated, with an emphasis on the superior thermal performance of this new class of power packages for automotive applications.

Steady-State and Transient Thermal Performance Optimization of Power Automotive Modules

2009 ◽  
Author(s):  
Victor Chiriac
Keyword(s):  
Steady State ◽  
Thermal Performance ◽  
Numerical Study ◽  
Peak Temperature ◽  
System Level ◽  
Main Concern ◽  
Thermal Impact ◽  
Automotive Applications ◽  
Isothermal Boundary ◽  
Transient Thermal

An extensive 3-D conjugate numerical study is conducted to assess the thermal performance of power packages for automotive applications. The automotive industry deals on a daily basis with various package and module-level thermal issues when managing the routing of very high current. The study provides a better understanding of the strengths and weaknesses of IC incorporation into a system module, for present and future product development. Several packages are investigated, ranging from smaller die/flag size to larger ones, single or multiple heat sources, operating under various powering and boundary conditions. The steady state and transient thermal impact of the thicker lead frame and die attach material on the overall thermal behavior is evaluated. The main concern is exceeding the thermal budget at an external ambient temperature of 85°C, specific for the relatively extreme automotive operating environments. Under one steady state (1W) operating scenario, the PQFN package reaches a peak temperature of ∼106.3°C, while under 37W@40ms of transient powering, the peak temperature reached by the corner FET is ∼260.8°C. With an isothermal boundary (85°C) attached to the board backside, the junction temperature does not change, as the PCB has no significant thermal impact. When the isothermal boundary is attached to package bottom, peak temperature drops by 20% after 40 ms. Additional system level with multiple optimized packages placed on a custom PCB is evaluated numerically and experimentally, placing an emphasis on the superior thermal performance of this new class of power packages for automotive applications. The optimized numerical model approximates closely the empirical results (121–126°C vs. 127.5°C), within 1–2%.

An Investigation of the Effect of interrupted fin arrangements on the Thermal Performance of a Heat Sink under a Free Convection Condition

2019 ◽  
Vol 7 (1) ◽  
pp. 43-53
Author(s):  
Abbas Jassem Jubear ◽  
Ali Hameed Abd
Keyword(s):  
Heat Transfer ◽  
Steady State ◽  
Natural Convection ◽  
Thermal Performance ◽  
Heat Sink ◽  
Numerical Study ◽  
Ansys Fluent ◽  
Fluent Software ◽  
Steady State Heat ◽  
Steady State Heat Transfer

The heat sink with vertically rectangular interrupted fins was investigated numerically in a natural convection field, with steady-state heat transfer. A numerical study has been conducted using ANSYS Fluent software (R16.1) in order to develop a 3-D numerical model.  The dimensions of the fins are (305 mm length, 100 mm width, 17 mm height, and 9.5 mm space between fins. The number of fins used on the surface is eight. In this study, the heat input was used as follows: 20, 40, 60, 80, 100, and 120 watts. This study focused on interrupted rectangular fins with a different arrangement and angle of the fins. Results show that the addition of interruption in fins in various arrangements will improve the thermal performance of the heat sink, and through the results, a better interruption rate as an equation can be obtained.

Finite Element Analysis of a Gasketed Flange Joint Under Combined Internal Pressure and Thermal Transient Loading

2007 ◽  
Author(s):  
Muhammad Abid ◽  
Javed A. Chattha ◽  
Kamran A. Khan
Keyword(s):  
Finite Element Analysis ◽  
Steady State ◽  
Internal Pressure ◽  
Thermal Loading ◽  
Flange Joint ◽  
Element Analysis ◽  
Transient Loading ◽  
Thermal Transient ◽  
Transient Thermal ◽  
Bolted Flange

Performance of a bolted flange joint is characterized mainly by its ‘strength’ and ‘sealing capability’. A number of analytical and experimental studies have been conducted to study these characteristics only under internal pressure loading. In the available published work, thermal behavior of the pipe flange joints is discussed under steady state loading with and without internal pressure and under transient loading condition without internal pressure. The present design codes also do not address the effects of steady state and thermal transient loading on the structural integrity and sealing ability. It is realized that due to the ignorance of any applied transient thermal loading, the optimized performance of the bolted flange joint can not be achieved. In this paper, in order to investigate gasketed joint’s performance i.e. joint strength and sealing capability under combined internal pressure and transient thermal loading, an extensive nonlinear finite element analysis is carried out and its behavior is discussed.

Model and Algorithm for Thermal Performance Calculation of Power Station Boiler Based on Process Steady-State Simulation Theory

2013 ◽  
Vol 483 ◽  
pp. 587-593
Author(s):  
Hong Kai Liao ◽  
Yue Xi Yu ◽  
Yan Ling Wu ◽  
Wei Zhong
Keyword(s):  
Steady State ◽  
Thermal Performance ◽  
Simulation Theory ◽  
General Purpose ◽  
Thermal Calculation ◽  
Process Unit ◽  
Power Station ◽  
Steady State Simulation ◽  
Power Station Boiler ◽  
Performance Calculation

Thermal performance calculation is the core task of designing power station boiler. By abstracting generalized components and generalized fluid nodes, and defining the process unit and process section at the logic level, the universal physical model of boiler was built in a particular form of flowsheet. Meanwhile, a sequential modular approach was proposed as the main algorithm for boiler thermal calculation based on process system steady-state simulation theory. Two key problems in the algorithm, i.e., module calculations and the logics of calling the modules calculations were explained. Finally, a practically developed system BESS, which has excellent flexibility and extensibility was presented. It turns out that the model and algorithm can be successfully employed in developing the general-purpose software for boiler thermal calculation.

Thermal Properties Evaluation of Thin Films, Wafers And Substrates

1990 ◽  
Vol 203 ◽  
Author(s):  
R.P. Tye ◽  
A. Maesono
Keyword(s):  
Thin Films ◽  
Thermal Properties ◽  
Steady State ◽  
Thermal Performance ◽  
Thermophysical Properties ◽  
Emerging Technologies ◽  
Layered Structures ◽  
Current Transient ◽  
Performance Characteristics ◽  
Transient And Steady State

ABSTRACTMaterials in use or under consideration for many applications in new and emerging technologies are often available only in small quantities and many times in the form of thin films, wafers and sheets. Such size and form limitations present a number of challenges to those wishing to evaluate thermal performance characteristics. This has resulted in a need to develop totally new transient or modify current transient and steady state techniques significantly. Various new or modified techniques to measure thermophysical properties are described. Illustrations of, applications to and results on semiconductors, superconductors, diamonds, polymers, composites and layered structures will be discussed.

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