Thermal Properties Evaluation of Thin Films, Wafers And Substrates

1990 ◽  
Vol 203 ◽  
Author(s):  
R.P. Tye ◽  
A. Maesono
Keyword(s):  
Thin Films ◽  
Thermal Properties ◽  
Steady State ◽  
Thermal Performance ◽  
Thermophysical Properties ◽  
Emerging Technologies ◽  
Layered Structures ◽  
Current Transient ◽  
Performance Characteristics ◽  
Transient And Steady State

ABSTRACTMaterials in use or under consideration for many applications in new and emerging technologies are often available only in small quantities and many times in the form of thin films, wafers and sheets. Such size and form limitations present a number of challenges to those wishing to evaluate thermal performance characteristics. This has resulted in a need to develop totally new transient or modify current transient and steady state techniques significantly. Various new or modified techniques to measure thermophysical properties are described. Illustrations of, applications to and results on semiconductors, superconductors, diamonds, polymers, composites and layered structures will be discussed.

The Effects of Variations in Manufacturing on PCB Thermal Properties

2011 ◽  
Author(s):  
John F. Maddox ◽  
Roy W. Knight ◽  
Sushil H. Bhavnani
Keyword(s):  
Thermal Properties ◽  
Steady State ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Manufacturing Process ◽  
Printed Circuit Board ◽  
Electronic Device ◽  
Circuit Board ◽  
Printed Circuit

The thermal performance of an electronic device is heavily dependent on the properties of the printed circuit board (PCB) to which it is attached. However, even small variations in the process used to fabricate a PCB can have drastic effects on its thermal properties. Therefore, it is necessary to experimentally verify that each stage in the manufacturing process is producing the desired result. Steady state thermal resistance measurements, taken with a comparative cut bar apparatus based on ASTM D 5470-06, were used to compare PCBs manufactured from the same design by different vendors and the effects of vias filled with epoxy versus unfilled vias on the thermal resistance of a PCB. It was found that the thermal resistance of the PCBs varied by as much as 30% between vendors and that the PCBs with epoxy filled vias had a higher thermal resistance than those with unfilled vias, possibly due to the order in which the manufacturing steps were taken.

scholarly journals Measurement of the thermophysical properties of self-suspended thin films based on steady-state thermography

2020 ◽  
Vol 28 (10) ◽  
pp. 14560
Author(s):  
Xin Wang ◽  
Qian Zhao ◽  
Zhuo Li ◽  
Suhui Yang ◽  
Jinying Zhang
Keyword(s):  
Thin Films ◽  
Steady State ◽  
Thermophysical Properties
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