2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM)

Feature Extractions from a High-dimension Low-samples Data for Multi-dimension Virtual Metrology

2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM) ◽

10.23919/emdc/issm48219.2019.9052136 ◽

2019 ◽

Author(s):

Sumika Arima ◽

Huizhen Bu ◽

Yuto Onuma ◽

Kotaro Handa ◽

Takuya Nagata

Keyword(s):

High Dimension ◽

Virtual Metrology

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IC Test Quality Enhancement by Introducing Machine Learning

2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM) ◽

10.23919/emdc/issm48219.2019.9052135 ◽

2019 ◽

Author(s):

B.C. Wu

Keyword(s):

Machine Learning ◽

Quality Enhancement ◽

Test Quality ◽

Ic Test

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Author index

2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM) ◽

10.23919/emdc/issm48219.2019.9052111 ◽

2019 ◽

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Chemical-mechanical polishing (CMP) process of STI and DTI- Ching-Yu Hsieh

2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM) ◽

10.23919/emdc/issm48219.2019.9052083 ◽

2019 ◽

Author(s):

Shih-Ping Lee ◽

Tzu-Hsuan Tseng ◽

Chih-Hao Chuang ◽

Chien-Ying Chuang ◽

Cheng-Hung Cheng ◽

...

Keyword(s):

Chemical Mechanical Polishing ◽

Mechanical Polishing

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Process Control Technique to Dramatically Reduce Voids in Phosphorus-Doped Poly-Silicon for Trench Field-Plate MOSFETs

2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM) ◽

10.23919/emdc/issm48219.2019.9052086 ◽

2019 ◽

Author(s):

Saya Shimomura ◽

Hiroaki Kato ◽

Tatsuya Shiraishi ◽

Tetsuya Ohno ◽

Toshifumi Nishiguchi ◽

...

Keyword(s):

Process Control ◽

Control Technique ◽

Field Plate ◽

Poly Silicon ◽

Phosphorus Doped ◽

Process Control Technique

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Electrical failure analysis using SEM Automated Process Inspection (API) System

2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM) ◽

10.23919/emdc/issm48219.2019.9052084 ◽

2019 ◽

Author(s):

Yu-Chi Chen ◽

Shih-Ping Lee ◽

Bo-An Tsai ◽

Chun-I Chan

Keyword(s):

Failure Analysis ◽

Electrical Failure ◽

Automated Process

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[Copyright notice]

2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM) ◽

10.23919/emdc/issm48219.2019.9052082 ◽

2019 ◽

Keyword(s):

Copyright Notice

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A Measurement System Analysis Research Framework for Measurement System and Empirical Study with Automation Time-Domain Measurements

2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM) ◽

10.23919/emdc/issm48219.2019.9052134 ◽

2019 ◽

Author(s):

Yu Mei Ling ◽

Ying-Jen Chen ◽

Chen-Fu Chien

Keyword(s):

Empirical Study ◽

Measurement System ◽

Time Domain ◽

System Analysis ◽

Research Framework ◽

Measurement System Analysis

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Tungsten Gate Replacement Process Optimization in 3D NAND Memory

2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM) ◽

10.23919/emdc/issm48219.2019.9052087 ◽

2019 ◽

Author(s):

Tuung Luoh ◽

YuKai Huang ◽

Chi-Min Chen ◽

Yung-Tai Hung ◽

Lin-Wuu Yang ◽

...

Keyword(s):

Process Optimization ◽

Replacement Process

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Novel Manufacturing Process for Si Superjunction Power MOSFETs with Air-Gap and Insulating Cap Layer

2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM) ◽

10.23919/emdc/issm48219.2019.9052133 ◽

2019 ◽

Author(s):

Yuhki Fujino ◽

Noboru Yokoyama ◽

Takuya Yamaguchi ◽

Hideki Okumura

Keyword(s):

Manufacturing Process ◽

Air Gap ◽

Power Mosfets ◽

Cap Layer

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2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Feature Extractions from a High-dimension Low-samples Data for Multi-dimension Virtual Metrology

IC Test Quality Enhancement by Introducing Machine Learning

Author index

Chemical-mechanical polishing (CMP) process of STI and DTI- Ching-Yu Hsieh

Process Control Technique to Dramatically Reduce Voids in Phosphorus-Doped Poly-Silicon for Trench Field-Plate MOSFETs

Electrical failure analysis using SEM Automated Process Inspection (API) System

[Copyright notice]

A Measurement System Analysis Research Framework for Measurement System and Empirical Study with Automation Time-Domain Measurements

Tungsten Gate Replacement Process Optimization in 3D NAND Memory

Novel Manufacturing Process for Si Superjunction Power MOSFETs with Air-Gap and Insulating Cap Layer

Export Citation Format

2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Feature Extractions from a High-dimension Low-samples Data for Multi-dimension Virtual Metrology

IC Test Quality Enhancement by Introducing Machine Learning

Author index

Chemical-mechanical polishing (CMP) process of STI and DTI- Ching-Yu Hsieh

Process Control Technique to Dramatically Reduce Voids in Phosphorus-Doped Poly-Silicon for Trench Field-Plate MOSFETs

Electrical failure analysis using SEM Automated Process Inspection (API) System

[Copyright notice]

A Measurement System Analysis Research Framework for Measurement System and Empirical Study with Automation Time-Domain Measurements

Tungsten Gate Replacement Process Optimization in 3D NAND Memory

Novel Manufacturing Process for Si Superjunction Power MOSFETs with Air-Gap and Insulating Cap Layer

2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM)
Latest Publications