Integrated Circuits and Systems - Wafer Level 3-D ICs Process Technology
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9780387765327, 9780387765341
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An SOI-Based 3D Circuit Integration Technology

2008 ◽  
pp. 1-26
Author(s):  
James Burns ◽  
Brian Aull ◽  
Robert Berger ◽  
Nisha Checka ◽  
Chang-Lee Chen ◽  
...  
Keyword(s):  
Integration Technology ◽  
Circuit Integration

Cu Wafer Bonding for 3D IC Applications

2008 ◽  
pp. 1-14 ◽  
Author(s):  
Kuan-Neng Chen ◽  
Chuan Seng Tan ◽  
Andy Fan ◽  
L. Rafael Reif
Keyword(s):  
Wafer Bonding ◽  
3D Ic

Through-Silicon Via Fabrication, Backgrind, and Handle Wafer Technologies

2008 ◽  
pp. 1-32 ◽  
Author(s):  
Sharath Hosali ◽  
Greg Smith ◽  
Larry Smith ◽  
Susan Vitkavage ◽  
Sitaram Arkalgud
Keyword(s):  
Through Silicon Via

Direct Hybrid Bonding

2008 ◽  
pp. 1-11 ◽  
Author(s):  
Bart Swinnen ◽  
Anne Jourdain ◽  
Piet De Moor ◽  
Eric Beyne

3D Fabrication Options for High-Performance CMOS Technology

2008 ◽  
pp. 1-21 ◽  
Author(s):  
Anna W. Topol ◽  
Steven J. Koester ◽  
Douglas C. La Tulipe ◽  
Albert M. Young
Keyword(s):  
High Performance ◽  
Cmos Technology ◽  
3D Fabrication
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