IWIPP Proceedings IEEE International Workshop on Integrated Power Packaging (Cat No 98EX203) IWIPP-98
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225 C high temperature silicon-on-insulator (SOI) ASICs for harsh environments

IWIPP Proceedings IEEE International Workshop on Integrated Power Packaging (Cat No 98EX203) IWIPP-98 ◽

10.1109/iwipp.1998.722239 ◽

2002 ◽

Cited By ~ 6

Author(s):

J.M. O'Connor ◽

J.C. Tsang ◽

J.B. McKitterick

Keyword(s):

High Temperature ◽

Silicon On Insulator ◽

Harsh Environments

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Screen-printed copper superthick-films for power hybrids

IWIPP Proceedings IEEE International Workshop on Integrated Power Packaging (Cat No 98EX203) IWIPP-98 ◽

10.1109/iwipp.1998.722257 ◽

2002 ◽

Author(s):

C. Lucat ◽

F. Meni ◽

M.O. Rachidi ◽

C. Zardini ◽

C.S. Bontemps ◽

...

Keyword(s):

Screen Printed

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Development of a state-of-the-art power actuation and switching module

IWIPP Proceedings IEEE International Workshop on Integrated Power Packaging (Cat No 98EX203) IWIPP-98 ◽

10.1109/iwipp.1998.722307 ◽

2002 ◽

Author(s):

J. Mulvey ◽

A. Salim ◽

G. Carr

Keyword(s):

State Of The Art

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Thermal management and power packaging for spacecraft of the next millennium

IWIPP Proceedings IEEE International Workshop on Integrated Power Packaging (Cat No 98EX203) IWIPP-98 ◽

10.1109/iwipp.1998.722242 ◽

2002 ◽

Author(s):

C.P. Minning

Keyword(s):

Thermal Management

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A 3D electrothermal simulation tool for integrated power modules

IWIPP Proceedings IEEE International Workshop on Integrated Power Packaging (Cat No 98EX203) IWIPP-98 ◽

10.1109/iwipp.1998.722247 ◽

2002 ◽

Author(s):

C. Gillot ◽

C. Schaeffer

Keyword(s):

Simulation Tool ◽

Power Modules ◽

Electrothermal Simulation

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STATPEP-current status of power electronic packaging for power supplies-methodology

IWIPP Proceedings IEEE International Workshop on Integrated Power Packaging (Cat No 98EX203) IWIPP-98 ◽

10.1109/iwipp.1998.722306 ◽

2002 ◽

Author(s):

M. Meinhardt ◽

S. Eckert ◽

J. Flannery ◽

S. Cian O Mathuna ◽

P. Cheasty ◽

...

Keyword(s):

Electronic Packaging ◽

Power Supplies ◽

Current Status ◽

Power Electronic

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On-module power converter incorporating embedded inductors

IWIPP Proceedings IEEE International Workshop on Integrated Power Packaging (Cat No 98EX203) IWIPP-98 ◽

10.1109/iwipp.1998.722241 ◽

2002 ◽

Author(s):

M. Brand

Keyword(s):

Power Converter

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Challenges in high power converter packaging

IWIPP Proceedings IEEE International Workshop on Integrated Power Packaging (Cat No 98EX203) IWIPP-98 ◽

10.1109/iwipp.1998.722244 ◽

2002 ◽

Author(s):

R.W. Zehringer ◽

P. Joerg ◽

A. Stuck

Keyword(s):

High Power ◽

Power Converter

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On-state transient electrothermal modeling of large area power components and multichip power modules

IWIPP Proceedings IEEE International Workshop on Integrated Power Packaging (Cat No 98EX203) IWIPP-98 ◽

10.1109/iwipp.1998.722246 ◽

2002 ◽

Author(s):

K. Bellil ◽

P. Tounsi ◽

J.-M. Dorkel

Keyword(s):

Large Area ◽

Power Modules

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Thermal management using interleaved CVD diamond layers for high power 3D chip stacks

IWIPP Proceedings IEEE International Workshop on Integrated Power Packaging (Cat No 98EX203) IWIPP-98 ◽

10.1109/iwipp.1998.722309 ◽

2002 ◽

Cited By ~ 1

Author(s):

V. Ozguz ◽

D. Albert ◽

A. Camien ◽

D. Ludwig ◽

S. Patra

Keyword(s):

Thermal Management ◽

High Power ◽

Cvd Diamond

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IWIPP Proceedings IEEE International Workshop on Integrated Power Packaging (Cat No 98EX203) IWIPP-98Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

225 C high temperature silicon-on-insulator (SOI) ASICs for harsh environments

Screen-printed copper superthick-films for power hybrids

Development of a state-of-the-art power actuation and switching module

Thermal management and power packaging for spacecraft of the next millennium

A 3D electrothermal simulation tool for integrated power modules

STATPEP-current status of power electronic packaging for power supplies-methodology

On-module power converter incorporating embedded inductors

Challenges in high power converter packaging

On-state transient electrothermal modeling of large area power components and multichip power modules

Thermal management using interleaved CVD diamond layers for high power 3D chip stacks

IWIPP Proceedings IEEE International Workshop on Integrated Power Packaging (Cat No 98EX203) IWIPP-98
Latest Publications