STATPEP-current status of power electronic packaging for power supplies-methodology

IWIPP Proceedings IEEE International Workshop on Integrated Power Packaging (Cat No 98EX203) IWIPP-98 ◽

10.1109/iwipp.1998.722306 ◽

2002 ◽

Author(s):

M. Meinhardt ◽

S. Eckert ◽

J. Flannery ◽

S. Cian O Mathuna ◽

P. Cheasty ◽

...

Keyword(s):

Electronic Packaging ◽

Power Supplies ◽

Current Status ◽

Power Electronic

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STATPEP-current status of power electronic packaging for power supplies-methodology

APEC '99. Fourteenth Annual Applied Power Electronics Conference and Exposition. 1999 Conference Proceedings (Cat. No.99CH36285) ◽

10.1109/apec.1999.749484 ◽

1999 ◽

Cited By ~ 5

Author(s):

M. Meinhardt ◽

A. Alderman ◽

J. Flannery ◽

P. Cheasty ◽

S. Eckert ◽

...

Keyword(s):

Electronic Packaging ◽

Power Supplies ◽

Current Status ◽

Power Electronic

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StatPEP-current status of power electronic packaging for DC/DC and AC/DC converters

2000 IEEE 31st Annual Power Electronics Specialists Conference. Conference Proceedings (Cat. No.00CH37018) ◽

10.1109/pesc.2000.878798 ◽

2002 ◽

Author(s):

J. Flannery ◽

P. Cheasty ◽

M. Meinhardt ◽

M. Ludwig ◽

V. Leonavicius ◽

...

Keyword(s):

Electronic Packaging ◽

Current Status ◽

Power Electronic

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Failure modes and FEM analysis of power electronic packaging

Finite Elements in Analysis and Design ◽

10.1016/s0168-874x(01)00094-4 ◽

2002 ◽

Vol 38 (7) ◽

pp. 601-612 ◽

Cited By ~ 96

Author(s):

Hua Ye ◽

Minghui Lin ◽

Cemal Basaran

Keyword(s):

Electronic Packaging ◽

Failure Modes ◽

Fem Analysis ◽

Power Electronic

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Advanced multiphysics simulation for high performance power electronic packaging design

2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) ◽

10.1109/3dpeim.2016.7570563 ◽

2016 ◽

Cited By ~ 2

Author(s):

Xin Zhao ◽

Yang Xu ◽

Douglas C. Hopkins

Keyword(s):

Electronic Packaging ◽

High Performance ◽

Power Electronic ◽

Multiphysics Simulation ◽

Packaging Design

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Advanced multi-physics simulation for high performance power electronic packaging design

2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) ◽

10.1109/3dpeim.2016.8048203 ◽

2016 ◽

Author(s):

Xin Zhao ◽

Yang Xu ◽

Douglas C. Hopkins

Keyword(s):

Electronic Packaging ◽

High Performance ◽

Power Electronic ◽

Packaging Design ◽

Physics Simulation

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Overview of Digital Design and Finite-Element Analysis in Modern Power Electronic Packaging

IEEE Transactions on Power Electronics ◽

10.1109/tpel.2020.2978584 ◽

2020 ◽

Vol 35 (10) ◽

pp. 10892-10905 ◽

Cited By ~ 1

Author(s):

Asger Bjorn Jorgensen ◽

Stig Munk-Nielsen ◽

Christian Uhrenfeldt

Keyword(s):

Finite Element Analysis ◽

Finite Element ◽

Electronic Packaging ◽

Digital Design ◽

Power Electronic ◽

Element Analysis

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Trends of Power Electronic Packaging and Modeling

2008 10th Electronics Packaging Technology Conference ◽

10.1109/eptc.2008.4763404 ◽

2008 ◽

Cited By ~ 17

Author(s):

Yong Liu ◽

Scott Irving ◽

Timwah Luk ◽

Dan Kinzer

Keyword(s):

Electronic Packaging ◽

Power Electronic

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Current Status of Collaboration between Industry and Academic Institutions in Electronic Packaging

Journal of the Society of Mechanical Engineers ◽

10.1299/jsmemag.103.978_310 ◽

2000 ◽

Vol 103 (978) ◽

pp. 310-313

Author(s):

Tadatomo SUGA

Keyword(s):

Electronic Packaging ◽

Current Status ◽

Academic Institutions

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Electrochemical migration of sintered nanosilver under chloride-containing thin electrolyte layer for power electronic packaging

CORROSION ◽

10.5006/1909 ◽

2015 ◽

Author(s):

Yana Zheng ◽

Yunhui Mei ◽

Chaoyi Yan ◽

Guo-Quan Lu

Keyword(s):

Electronic Packaging ◽

Electrochemical Migration ◽

Power Electronic ◽

Electrolyte Layer ◽

Thin Electrolyte Layer

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Bonding 1200 V, 150 A IGBT chips (13.5 mm × 13.5 mm) with DBC substrate by pressureless sintering nanosilver paste for power electronic packaging

2014 15th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2014.6922606 ◽

2014 ◽

Cited By ~ 4

Author(s):

Shancan Fu ◽

Yunhui Mei ◽

Xin Li ◽

Guo-Quan Lu

Keyword(s):

Electronic Packaging ◽

Pressureless Sintering ◽

Power Electronic ◽

Nanosilver Paste

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