Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)
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Published By IEEE Comput. Soc. Press

0818669705

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Application of capacitive coupling to switch fabrics

Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) ◽

10.1109/mcmc.1995.512026 ◽

2002 ◽

Cited By ~ 4

Author(s):

D. Salzman ◽

T. Knight ◽

P. Franzon

Keyword(s):

Capacitive Coupling ◽

Switch Fabrics

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Sensitivity analysis of interconnect networks based on S-parameter macromodel

Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) ◽

10.1109/mcmc.1995.512009 ◽

2002 ◽

Author(s):

Yanhua Sun ◽

Wayne Wei-Ming Dai

Keyword(s):

Sensitivity Analysis ◽

S Parameter ◽

Interconnect Networks

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Experimental characterization of simultaneous switching noise for multichip module

Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) ◽

10.1109/mcmc.1995.512030 ◽

2002 ◽

Author(s):

K. Ito ◽

K. Kato ◽

N. Hirano ◽

T. Sudo

Keyword(s):

Multichip Module ◽

Switching Noise ◽

Experimental Characterization ◽

Simultaneous Switching Noise ◽

Simultaneous Switching

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Moment models of general transmission lines with application to MCM interconnect analysis

Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) ◽

10.1109/mcmc.1995.512020 ◽

2002 ◽

Author(s):

Qingjian Yu ◽

E.S. Kuh

Keyword(s):

Transmission Lines ◽

Moment Models

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A novel 2-sided multi-chip-module used to create a 50,000 gate programmable logic device

Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) ◽

10.1109/mcmc.1995.512004 ◽

2002 ◽

Cited By ~ 2

Author(s):

R. Terrill

Keyword(s):

Programmable Logic ◽

Logic Device ◽

Programmable Logic Device

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High temperature Cu-Sn joints manufactured by a 250°C fluxless bonding process

Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) ◽

10.1109/mcmc.1995.512028 ◽

2002 ◽

Author(s):

Yi-Chia Chen ◽

S.J. Lee ◽

C.C. Lee

Keyword(s):

High Temperature ◽

Bonding Process ◽

Fluxless Bonding

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Design considerations for implementing a modularly configured attached processor in a multi chip module

Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) ◽

10.1109/mcmc.1995.512005 ◽

2002 ◽

Author(s):

J.S. Singh ◽

B.W. Gremel ◽

V.P. Singh ◽

G.A. Gibson

Keyword(s):

Design Considerations

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Electrical and thermal study of membrane multi-chip module systems

Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) ◽

10.1109/mcmc.1995.512006 ◽

2002 ◽

Author(s):

Wheling Cheng ◽

S.S. Wong

Keyword(s):

Thermal Study ◽

Module Systems

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A low-cost MCM design topology-the interconnected mesh power system (IMPS)

Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) ◽

10.1109/mcmc.1995.512027 ◽

2002 ◽

Cited By ~ 3

Author(s):

Y.L. Low ◽

L.W. Schaper ◽

S.S. Ang

Keyword(s):

Power System ◽

Low Cost

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Design and characterization of three-dimensional aluminum nitride multichip modules

Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) ◽

10.1109/mcmc.1995.512023 ◽

2002 ◽

Author(s):

S.L. Palmquist ◽

R.J. Jensen ◽

W.F. Jacobsen ◽

R.K. Spielberger

Keyword(s):

Aluminum Nitride ◽

Three Dimensional ◽

Multichip Modules

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Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE Comput. Soc. Press

Application of capacitive coupling to switch fabrics

Sensitivity analysis of interconnect networks based on S-parameter macromodel

Experimental characterization of simultaneous switching noise for multichip module

Moment models of general transmission lines with application to MCM interconnect analysis

A novel 2-sided multi-chip-module used to create a 50,000 gate programmable logic device

High temperature Cu-Sn joints manufactured by a 250°C fluxless bonding process

Design considerations for implementing a modularly configured attached processor in a multi chip module

Electrical and thermal study of membrane multi-chip module systems

A low-cost MCM design topology-the interconnected mesh power system (IMPS)

Design and characterization of three-dimensional aluminum nitride multichip modules

Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)
Latest Publications