Papers on Soldering (1962)
Latest Publications

TOTAL DOCUMENTS

7

(FIVE YEARS 0)

H-INDEX

1

(FIVE YEARS 0)

Published By ASTM International

9780803165977

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Tin Transformation Of Tinned Copper Wire

Papers on Soldering (1962) ◽

10.1520/stp45810s ◽

2009 ◽

pp. 83-83-10

Author(s):

Jack Spergel

Keyword(s):

Copper Wire

Download Full-text

Mechanism of Wetting During Solder Joint Formation

Papers on Soldering (1962) ◽

10.1520/stp45807s ◽

2009 ◽

pp. 20-20-9

Author(s):

Howard H. Manko

Keyword(s):

Solder Joint ◽

Joint Formation

Download Full-text

Printed Wiring Surface Preparation Methods—Elimination of Gold Plating as a Surface Preparation for Printed Circuits and Development of a Contamination-Free Surface

Papers on Soldering (1962) ◽

10.1520/stp45805s ◽

2009 ◽

pp. 3-3-10 ◽

Cited By ~ 1

Author(s):

J. D. Keller

Keyword(s):

Free Surface ◽

Surface Preparation ◽

Gold Plating ◽

Preparation Methods ◽

Printed Circuits

Download Full-text

Effect of Impurities on Some Properties of Lead-Tin Alloys

Papers on Soldering (1962) ◽

10.1520/stp45808s ◽

2009 ◽

pp. 29-29-10

Author(s):

Max F. W. Heberlein

Keyword(s):

Tin Alloys ◽

Effect Of Impurities

Download Full-text

Embrittlement of Solder by Gold from Plated Surfaces

Papers on Soldering (1962) ◽

10.1520/stp45806s ◽

2009 ◽

pp. 13-13-7 ◽

Cited By ~ 6

Author(s):

F. Gordon Foster

Download Full-text

Introduction

Papers on Soldering (1962) ◽

10.1520/stp45804s ◽

2009 ◽

pp. 1-1-1

Author(s):

P. R. White

Download Full-text

Factors Affecting Quality of Soft Soldered Joints in Copper Water Tube

Papers on Soldering (1962) ◽

10.1520/stp45809s ◽

2009 ◽

pp. 39-39-44

Author(s):

J. M. Keyes

Keyword(s):

Factors Affecting ◽

Water Tube ◽

Copper Water

Download Full-text