31st Annual Proceedings Reliability Physics 1993
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Published By IEEE

0780307828

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Via hole-related simultaneous stress-induced extrusion and void formation in Al interconnects

31st Annual Proceedings Reliability Physics 1993 ◽

10.1109/relphy.1993.283278 ◽

1993 ◽

Cited By ~ 8

Author(s):

H. Shibata ◽

T. Matsuno ◽

K. Hashimoto

Keyword(s):

Void Formation ◽

Via Hole

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Novel self-stressing test structures for realistic high-frequency reliability characterization

31st Annual Proceedings Reliability Physics 1993 ◽

10.1109/relphy.1993.283301 ◽

1993 ◽

Cited By ~ 18

Author(s):

E.S. Snyder ◽

D.V. Campbell ◽

S.E. Swanson ◽

D.G. Pierce

Keyword(s):

High Frequency

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AC electromigration characterization and modeling of multilayered interconnects

31st Annual Proceedings Reliability Physics 1993 ◽

10.1109/relphy.1993.283282 ◽

1993 ◽

Cited By ~ 50

Author(s):

L.M. Ting ◽

J.S. May ◽

W.R. Hunter ◽

J.W. McPherson

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Parameter extraction guidelines for hot-electron reliability simulation

31st Annual Proceedings Reliability Physics 1993 ◽

10.1109/relphy.1993.283306 ◽

1993 ◽

Cited By ~ 8

Author(s):

V.-H. Chan ◽

J.S. Kim ◽

J.E. Chung

Keyword(s):

Parameter Extraction ◽

Hot Electron

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Surface related failure mechanisms in polyimide passivated L-band MMICs

31st Annual Proceedings Reliability Physics 1993 ◽

10.1109/relphy.1993.283272 ◽

1993 ◽

Cited By ~ 1

Author(s):

G. Halkias ◽

A. Christou ◽

K. Huang ◽

J. Li ◽

N. Papanicolaou

Keyword(s):

Failure Mechanisms ◽

L Band

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The hot-carrier induced degradation mechanisms of 0.8 mu m LDD p-MOSFET with 850 degrees C wet gate oxidation

31st Annual Proceedings Reliability Physics 1993 ◽

10.1109/relphy.1993.283304 ◽

1993 ◽

Cited By ~ 2

Author(s):

Y. Pan

Keyword(s):

Degradation Mechanisms ◽

Hot Carrier

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Dependence of electromigration lifetime on the square of current density

31st Annual Proceedings Reliability Physics 1993 ◽

10.1109/relphy.1993.283281 ◽

1993 ◽

Cited By ~ 4

Author(s):

K. Hinode ◽

T. Furusawa ◽

Y. Homma

Keyword(s):

Current Density ◽

Electromigration Lifetime

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Laser stimulated electron-beam prober for 15 ps resolution internal waveform measurements of a 5 Gb/s ECL circuit

31st Annual Proceedings Reliability Physics 1993 ◽

10.1109/relphy.1993.283324 ◽

1993 ◽

Cited By ~ 1

Author(s):

A.J. Fixl ◽

K.A. Jenkins ◽

K.R. Wilsher ◽

M.J. Immediato ◽

L. Perincheril ◽

...

Keyword(s):

Electron Beam ◽

Ecl Circuit

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New method for making Al single crystal interconnections on amorphous insulators

31st Annual Proceedings Reliability Physics 1993 ◽

10.1109/relphy.1993.283299 ◽

1993 ◽

Author(s):

J. Wada ◽

K. Suguro ◽

N. Hayasaka ◽

H. Okano

Keyword(s):

Single Crystal ◽

New Method

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3D finite element simulation of the delamination behaviour of a PLCC package in the temperature cycling test

31st Annual Proceedings Reliability Physics 1993 ◽

10.1109/relphy.1993.283293 ◽

1993 ◽

Cited By ~ 2

Author(s):

R. van Gestel ◽

H. Schellekens

Keyword(s):

Finite Element ◽

Finite Element Simulation ◽

Temperature Cycling ◽

3D Finite Element ◽

Cycling Test ◽

Element Simulation ◽

Temperature Cycling Test

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31st Annual Proceedings Reliability Physics 1993Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Via hole-related simultaneous stress-induced extrusion and void formation in Al interconnects

Novel self-stressing test structures for realistic high-frequency reliability characterization

AC electromigration characterization and modeling of multilayered interconnects

Parameter extraction guidelines for hot-electron reliability simulation

Surface related failure mechanisms in polyimide passivated L-band MMICs

The hot-carrier induced degradation mechanisms of 0.8 mu m LDD p-MOSFET with 850 degrees C wet gate oxidation

Dependence of electromigration lifetime on the square of current density

Laser stimulated electron-beam prober for 15 ps resolution internal waveform measurements of a 5 Gb/s ECL circuit

New method for making Al single crystal interconnections on amorphous insulators

3D finite element simulation of the delamination behaviour of a PLCC package in the temperature cycling test

31st Annual Proceedings Reliability Physics 1993
Latest Publications