electromigration lifetime Latest Research Papers

Enhancement of Electromigration Lifetime of Copper Lines by Eliminating Nanoscale Grains in Highly -oriented Nanotwinned Structures

Journal of Materials Research and Technology ◽

10.1016/j.jmrt.2021.11.111 ◽

2021 ◽

Author(s):

Dinh-Phuc Tran ◽

Hung-Hsuan Li ◽

I-Hsin Tseng ◽

Chih Chen

Keyword(s):

Electromigration Lifetime

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Low Resistance And High Electromigration Lifetime Of Cu-To-Cu Joints Using (111)-Oriented Nanotwinned Copper

Advanced Materials Letters ◽

10.5185/amlett.2021.081654 ◽

2021 ◽

Vol 12 (08) ◽

pp. 21081654-21081654

Author(s):

Jing-Ye Juang

Keyword(s):

Low Resistance ◽

Electromigration Lifetime

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Copper Oxide Passivation Effect on Electromigration Lifetime of Plasma Etched Copper Lines

ECS Meeting Abstracts ◽

10.1149/ma2020-02141383mtgabs ◽

2020 ◽

Vol MA2020-02 (14) ◽

pp. 1383-1383

Author(s):

Jia Quan Su ◽

Yue Kuo

Keyword(s):

Copper Oxide ◽

Electromigration Lifetime

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Copper Oxide Passivation Effect on Electromigration Lifetime of Plasma Etched Copper Lines

ECS Transactions ◽

10.1149/09803.0099ecst ◽

2020 ◽

Vol 98 (3) ◽

pp. 99-105

Author(s):

Jia Quan Su ◽

Yue Kuo

Keyword(s):

Copper Oxide ◽

Electromigration Lifetime

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Black equation of the electromigration lifetime for ceramic package with lead bumps and plastic package with lead-free bump

2020 21st International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept50128.2020.9202871 ◽

2020 ◽

Author(s):

Si Chen ◽

Qiushi Wu ◽

Zhiwei Fu ◽

Yun Huang ◽

Bin Yao ◽

...

Keyword(s):

Lead Free ◽

Plastic Package ◽

Electromigration Lifetime

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Prediction of electromigration lifetime of copper pillar bumps in ceramic packaging device

2020 21st International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept50128.2020.9202568 ◽

2020 ◽

Author(s):

Fangzhou Chen ◽

Si Chen ◽

Zhiwei Fu ◽

Yun Huang ◽

Fei Qin ◽

...

Keyword(s):

Electromigration Lifetime

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A Study of Low Temperature Al Sputter Process Electromigration Lifetime

2020 China Semiconductor Technology International Conference (CSTIC) ◽

10.1109/cstic49141.2020.9282554 ◽

2020 ◽

Author(s):

Jun Liu ◽

Lei Zhang ◽

Jianmin Wang ◽

Qinghua Liu ◽

Di Lou

Keyword(s):

Low Temperature ◽

Electromigration Lifetime

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A Simple Prediction Method for Chip-Level Electromigration Lifetime Using Generalized Gamma Distribution

2019 IEEE International Reliability Physics Symposium (IRPS) ◽

10.1109/irps.2019.8720404 ◽

2019 ◽

Author(s):

Shinji Yokogawa ◽

Kyosuke Kunii

Keyword(s):

Gamma Distribution ◽

Prediction Method ◽

Generalized Gamma Distribution ◽

Generalized Gamma ◽

Electromigration Lifetime

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Effects of graphene oxide on the electromigration lifetime of lead-free solder joints

Journal of Materials Science Materials in Electronics ◽

10.1007/s10854-018-0506-y ◽

2018 ◽

Vol 30 (3) ◽

pp. 2334-2341

Author(s):

Yong-Ho Ko ◽

Kirak Son ◽

Gahui Kim ◽

Young-Bae Park ◽

Dong-Yurl Yu ◽

...

Keyword(s):

Graphene Oxide ◽

Solder Joints ◽

Lead Free ◽

Lead Free Solder ◽

Electromigration Lifetime ◽

Free Solder

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Electromigration Lifetime Improvement of WLCSP by Using Different Structure of UBM

2018 IEEE CPMT Symposium Japan (ICSJ) ◽

10.1109/icsj.2018.8602573 ◽

2018 ◽

Author(s):

Y.S. Lin ◽

H.Y. Kung ◽

S.H. Lee ◽

M.H. Chen ◽

T.C. Lin ◽

...

Keyword(s):

Electromigration Lifetime

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electromigration lifetime
Recently Published Documents

TOTAL DOCUMENTS

H-INDEX

Enhancement of Electromigration Lifetime of Copper Lines by Eliminating Nanoscale Grains in Highly -oriented Nanotwinned Structures

Low Resistance And High Electromigration Lifetime Of Cu-To-Cu Joints Using (111)-Oriented Nanotwinned Copper

Copper Oxide Passivation Effect on Electromigration Lifetime of Plasma Etched Copper Lines

Copper Oxide Passivation Effect on Electromigration Lifetime of Plasma Etched Copper Lines

Black equation of the electromigration lifetime for ceramic package with lead bumps and plastic package with lead-free bump

Prediction of electromigration lifetime of copper pillar bumps in ceramic packaging device

A Study of Low Temperature Al Sputter Process Electromigration Lifetime

A Simple Prediction Method for Chip-Level Electromigration Lifetime Using Generalized Gamma Distribution

Effects of graphene oxide on the electromigration lifetime of lead-free solder joints

Electromigration Lifetime Improvement of WLCSP by Using Different Structure of UBM

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electromigration lifetimeRecently Published Documents

TOTAL DOCUMENTS

H-INDEX

Enhancement of Electromigration Lifetime of Copper Lines by Eliminating Nanoscale Grains in Highly -oriented Nanotwinned Structures

Low Resistance And High Electromigration Lifetime Of Cu-To-Cu Joints Using (111)-Oriented Nanotwinned Copper

Copper Oxide Passivation Effect on Electromigration Lifetime of Plasma Etched Copper Lines

Copper Oxide Passivation Effect on Electromigration Lifetime of Plasma Etched Copper Lines

Black equation of the electromigration lifetime for ceramic package with lead bumps and plastic package with lead-free bump

Prediction of electromigration lifetime of copper pillar bumps in ceramic packaging device

A Study of Low Temperature Al Sputter Process Electromigration Lifetime

A Simple Prediction Method for Chip-Level Electromigration Lifetime Using Generalized Gamma Distribution

Effects of graphene oxide on the electromigration lifetime of lead-free solder joints

Electromigration Lifetime Improvement of WLCSP by Using Different Structure of UBM

electromigration lifetime
Recently Published Documents