2003 5th International Conference on ASIC. Proceedings (IEEE Cat. No.03TH8690)
Latest Publications

TOTAL DOCUMENTS

120

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Published By IEEE

0780378946

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

In-house reclaim of test wafers

2003 5th International Conference on ASIC. Proceedings (IEEE Cat. No.03TH8690) ◽

10.1109/issm.2003.1243324 ◽

2004 ◽

Author(s):

R. Moser ◽

J. Priest

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Simulation of circuit speed and leakage current in the presence of imperfect lithography

2003 5th International Conference on ASIC. Proceedings (IEEE Cat. No.03TH8690) ◽

10.1109/issm.2003.1243338 ◽

2004 ◽

Author(s):

L. Milor ◽

M. Choi ◽

L. Capodieci

Keyword(s):

Leakage Current

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Adsorption of residual trace impurities in UPW onto wafer surface

2003 5th International Conference on ASIC. Proceedings (IEEE Cat. No.03TH8690) ◽

10.1109/issm.2003.1243329 ◽

2004 ◽

Author(s):

M. Kogure ◽

T. Yonehara ◽

T. Sakurai ◽

T. Ohmi

Keyword(s):

Wafer Surface ◽

Trace Impurities

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Removal of particles from wafer stage using wafer-formed cleaning material (cleaning wafer)

2003 5th International Conference on ASIC. Proceedings (IEEE Cat. No.03TH8690) ◽

10.1109/issm.2003.1243309 ◽

2004 ◽

Author(s):

H. Yamauchi ◽

M. Shimajiri ◽

K. Imaoka ◽

H. Takahashi ◽

M. Namikawa ◽

...

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Riding the relational power wave to enhance the command, control & prompt reduction of monitoring wafer usage

2003 5th International Conference on ASIC. Proceedings (IEEE Cat. No.03TH8690) ◽

10.1109/issm.2003.1243326 ◽

2004 ◽

Author(s):

Ang Chee Teck ◽

Ko Chen Pin ◽

K. Teo ◽

F. Huang ◽

J. Wang

Keyword(s):

Relational Power ◽

Power Wave

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Monitoring and qualification using comprehensive surface haze information

2003 5th International Conference on ASIC. Proceedings (IEEE Cat. No.03TH8690) ◽

10.1109/issm.2003.1243307 ◽

2004 ◽

Author(s):

F. Holsteyns ◽

J. Roels ◽

K. Kenis ◽

Q. Toan Le ◽

P.W. Mertens

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A decision support system of real time dispatching in semiconductor wafer fabrication with shortest process time in wet bench

2003 5th International Conference on ASIC. Proceedings (IEEE Cat. No.03TH8690) ◽

10.1109/issm.2003.1243287 ◽

2004 ◽

Cited By ~ 1

Author(s):

M.D. Hsieh ◽

Amos Lin ◽

Kenley Kuo ◽

H.L. Wang

Keyword(s):

Decision Support ◽

Decision Support System ◽

Real Time ◽

Support System ◽

Wafer Fabrication ◽

Process Time ◽

Semiconductor Wafer ◽

Semiconductor Wafer Fabrication

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Tactical advanced process control

2003 5th International Conference on ASIC. Proceedings (IEEE Cat. No.03TH8690) ◽

10.1109/issm.2003.1243301 ◽

2004 ◽

Cited By ~ 1

Author(s):

M. Dorough ◽

C. Jensen ◽

D. Do ◽

M. Hensen ◽

E. Standley

Keyword(s):

Process Control ◽

Advanced Process Control

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Effective particle removal on post polish cleaning by pH control of HF solution

2003 5th International Conference on ASIC. Proceedings (IEEE Cat. No.03TH8690) ◽

10.1109/issm.2003.1243328 ◽

2004 ◽

Author(s):

A. Ishida ◽

T. Nagashima ◽

D. Takeda ◽

T. Kajita ◽

T. Muneta ◽

...

Keyword(s):

Ph Control ◽

Particle Removal ◽

Effective Particle

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Build-up technology of a new ultrapure water supplying system

2003 5th International Conference on ASIC. Proceedings (IEEE Cat. No.03TH8690) ◽

10.1109/issm.2003.1243330 ◽

2004 ◽

Author(s):

M. Okumura ◽

H. Haeno ◽

I. Yokoi ◽

T. Ohmi

Keyword(s):

Ultrapure Water

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2003 5th International Conference on ASIC. Proceedings (IEEE Cat. No.03TH8690)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

In-house reclaim of test wafers

Simulation of circuit speed and leakage current in the presence of imperfect lithography

Adsorption of residual trace impurities in UPW onto wafer surface

Removal of particles from wafer stage using wafer-formed cleaning material (cleaning wafer)

Riding the relational power wave to enhance the command, control & prompt reduction of monitoring wafer usage

Monitoring and qualification using comprehensive surface haze information

A decision support system of real time dispatching in semiconductor wafer fabrication with shortest process time in wet bench

Tactical advanced process control

Effective particle removal on post polish cleaning by pH control of HF solution

Build-up technology of a new ultrapure water supplying system

2003 5th International Conference on ASIC. Proceedings (IEEE Cat. No.03TH8690)
Latest Publications