Reliability testing of solder joints in surface mounted assembly using real-time holographic interferometry

2002 ◽  
Author(s):  
W.N. Wang ◽  
K.M. Leung
Keyword(s):  
Real Time ◽  
Holographic Interferometry ◽  
Solder Joints ◽  
Reliability Testing

Real-time resonant holographic interferometry for combustion and plasma environments

1995 ◽  
Author(s):  
N Brock ◽  
M Brown ◽  
P DeBarber ◽  
M Millard ◽  
J Millerd ◽  
...  
Keyword(s):  
Real Time ◽  
Holographic Interferometry

Electromigration in solder joints: A cross-sectioned model system for real-time observation

2021 ◽  
Vol 119 ◽  
pp. 114068
Author(s):  
Mostafa AbdelAziz ◽  
Di Erick Xu ◽  
Guotao Wang ◽  
Michael Mayer
Keyword(s):  
Real Time ◽  
Solder Joints ◽  
Model System ◽  
Time Observation ◽  
Real Time Observation

Real Time Acoustic Imaging by Holographic Interferometry

1980 ◽  
Vol 2 (4) ◽  
pp. 313-323 ◽  
Author(s):  
Amin Hanafy ◽  
Mauro Zambuto
Keyword(s):  
Real Time ◽  
Holographic Interferometry ◽  
Vibration Amplitude ◽  
Imaging System ◽  
Mechanical Vibration ◽  
Visual Image ◽  
Acoustic Imaging ◽  
Acoustic Image ◽  
Vibration Pattern ◽  
Amplitude Amplification

A two-step real time acoustic imaging system is presented. The system incorporates a novel acoustic image coupler which transfers an acoustical interference pattern from a water-bounded to an air-bounded surface with vibration amplitude amplification. An original technique termed step-biased real time holographic interferometry is used to convert the amplified mechanical vibration pattern, which carries all information about the insonified object, into a visual image with improved sensitivity.

In-Situ Tem Study of Copper-Tin Intermetallic Formation

1993 ◽  
Vol 323 ◽  
Author(s):  
Yujing Wu ◽  
Elizabeth G. Jacobs ◽  
Cyrus Pouraghabagher ◽  
Russell F. Pinizzotto
Keyword(s):  
Thin Films ◽  
Real Time ◽  
Diffusion Barrier ◽  
Solder Joints ◽  
Effective Diffusion ◽  
Copper Substrate ◽  
In Situ Tem ◽  
Intermetallic Formation ◽  
Intermetallic Growth

AbstractThe formation and growth of Cu6Sn5 and Cu3Sn at the interface of Sn-Pb solder/copper substrate are factors which affect the solderability and reliability of electronic solder joints. The addition of particles such as Ni to eutectic Sn-Pb solder drastically affects the activation energies of formation for both intermetallics. This study was performed to understand the mechanisms of intermetallic formation and the effects of Ni on intermetallic growth. Cu/Sn and Cu/Sn/Ni thin films were deposited by evaporation and observed in the TEM in real time using a hot stage. The diffusion of Sn through Cu6Sn5 and Cu3Sn followed by reaction with Cu must occur for intermetallic formation and growth to take place. Ni is an effective diffusion barrier which prevents Sn from diffusing into Cu.

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