2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)
Latest Publications

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Published By IEEE

9781479962570

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Fast and accurate technique to decompose jitter for very long pattern length waveform

2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) ◽

10.1109/edaps.2014.7030815 ◽

2014 ◽

Cited By ~ 1

Author(s):

Joseph Kho ◽

Tan Yih Ling

Keyword(s):

Pattern Length

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A case study of BGA package for high speed channel with non-ideal ground induced resonance conditions

2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) ◽

10.1109/edaps.2014.7030809 ◽

2014 ◽

Author(s):

Vijay Kumar Singh ◽

Raj Kumar Nagpal ◽

Jai Narayan Tripathi

Keyword(s):

High Speed ◽

Bga Package

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Null field preconditioner for fast 3D full-wave MoM package-board extraction

2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) ◽

10.1109/edaps.2014.7030822 ◽

2014 ◽

Cited By ~ 1

Author(s):

Yoginder Kumar Negi ◽

N. Balakrishnan ◽

Sadasiva M. Rao ◽

Dipanjan Gope

Keyword(s):

Null Field ◽

Full Wave

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Fast incremental 3D full-wave analysis for package-board design iterations via eigen-GCR

2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) ◽

10.1109/edaps.2014.7030806 ◽

2014 ◽

Cited By ~ 1

Author(s):

Gourav Chatterjee ◽

Arkaprovo Das ◽

Dipanjan Gope

Keyword(s):

Wave Analysis ◽

Full Wave ◽

Full Wave Analysis

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Silicon-package power delivery co-simulation with Fully Integrated Voltage Regulators on microprocessors

2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) ◽

10.1109/edaps.2014.7030828 ◽

2014 ◽

Cited By ~ 4

Author(s):

Srinivasan Govindan ◽

Srikrishnan Venkataraman

Keyword(s):

Power Delivery ◽

Voltage Regulators ◽

Fully Integrated

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Eye-height/width prediction from S-Parameters using bounded size training set for ANN

2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) ◽

10.1109/edaps.2014.7030804 ◽

2014 ◽

Cited By ~ 3

Author(s):

Nikita Ambasana ◽

Dipanjan Gope ◽

Bhyrav Mutnury ◽

Gowri Anand

Keyword(s):

Training Set ◽

S Parameters ◽

Bounded Size

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Indirect contact probing method for characterizing via arrays in electronic packaging

2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) ◽

10.1109/edaps.2014.7030805 ◽

2014 ◽

Cited By ~ 2

Author(s):

JongWoo Jeong ◽

Jingook Kim ◽

Ki Jin Han ◽

No-Weon Kang

Keyword(s):

Electronic Packaging ◽

Indirect Contact

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Impact of sockets in Package-On-Package electrical validation & design considerations

2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) ◽

10.1109/edaps.2014.7030824 ◽

2014 ◽

Author(s):

Ramaswamy Parthasarathy ◽

Shanto Alex Thomas ◽

Murali Mohan Repala

Keyword(s):

Design Considerations

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High-speed data transmission system using half mode substrate integrated waveguide

2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) ◽

10.1109/edaps.2014.7030826 ◽

2014 ◽

Cited By ~ 2

Author(s):

Xi-Wang Yuan ◽

Xiao-Chun Li ◽

Ning Wang ◽

Xiao-Jian Ma ◽

Yan Shao ◽

...

Keyword(s):

Data Transmission ◽

High Speed ◽

Transmission System ◽

Substrate Integrated Waveguide ◽

High Speed Data ◽

Data Transmission System ◽

Speed Data Transmission

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Resonant power supply noise reduction using on-die decoupling capacitors embedded in organic interposer

2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) ◽

10.1109/edaps.2014.7030823 ◽

2014 ◽

Cited By ~ 1

Author(s):

Toru Nakura ◽

Masahiro Kano ◽

Masamitsu Yoshizawa ◽

Seisei Oyamada ◽

Atsunori Hattori ◽

...

Keyword(s):

Noise Reduction ◽

Power Supply ◽

Power Supply Noise ◽

Decoupling Capacitors ◽

Supply Noise

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2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Fast and accurate technique to decompose jitter for very long pattern length waveform

A case study of BGA package for high speed channel with non-ideal ground induced resonance conditions

Null field preconditioner for fast 3D full-wave MoM package-board extraction

Fast incremental 3D full-wave analysis for package-board design iterations via eigen-GCR

Silicon-package power delivery co-simulation with Fully Integrated Voltage Regulators on microprocessors

Eye-height/width prediction from S-Parameters using bounded size training set for ANN

Indirect contact probing method for characterizing via arrays in electronic packaging

Impact of sockets in Package-On-Package electrical validation & design considerations

High-speed data transmission system using half mode substrate integrated waveguide

Resonant power supply noise reduction using on-die decoupling capacitors embedded in organic interposer

2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)
Latest Publications