International Conference on Electromagnetic Compatibility
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Published By IEE

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Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Transient analysis of printed circuit board structures using a time domain solution of Kirchoff's network equations

International Conference on Electromagnetic Compatibility ◽

10.1049/cp:19971129 ◽

1997 ◽

Author(s):

C.J. Railton

Keyword(s):

Time Domain ◽

Transient Analysis ◽

Printed Circuit Board ◽

Circuit Board ◽

Printed Circuit

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Analysis of lightning-induced voltages in a network of conductors using the ATP-EMTP program

International Conference on Electromagnetic Compatibility ◽

10.1049/cp:19971136 ◽

1997 ◽

Author(s):

A. Galvan

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Development of the RF HIRF environment

International Conference on Electromagnetic Compatibility ◽

10.1049/cp:19971111 ◽

1997 ◽

Author(s):

D.A. Bull

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A study into the potential effects of ISM emissions on cellular radio equipment

International Conference on Electromagnetic Compatibility ◽

10.1049/cp:19971110 ◽

1997 ◽

Author(s):

P.B. Kenington

Keyword(s):

Cellular Radio ◽

Radio Equipment

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Screening of multi-pin connectors - suggested measuring techniques

International Conference on Electromagnetic Compatibility ◽

10.1049/cp:19971134 ◽

1997 ◽

Author(s):

E.P. Fowler

Keyword(s):

Measuring Techniques

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Conducted emission improvement of AC variable speed drives

International Conference on Electromagnetic Compatibility ◽

10.1049/cp:19971116 ◽

1997 ◽

Author(s):

M.H. Nagrial

Keyword(s):

Variable Speed ◽

Variable Speed Drives ◽

Conducted Emission

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Aspects of GTEM to OATS measurement correlation

International Conference on Electromagnetic Compatibility ◽

10.1049/cp:19971139 ◽

1997 ◽

Cited By ~ 1

Author(s):

A. Nothofer

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Substrate noise issues in mixed-signal chip designs using Spice

International Conference on Electromagnetic Compatibility ◽

10.1049/cp:19971128 ◽

1997 ◽

Cited By ~ 1

Author(s):

R. Singh

Keyword(s):

Substrate Noise ◽

Mixed Signal

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Coupling of magnetic fields from power cables to grounding loops

International Conference on Electromagnetic Compatibility ◽

10.1049/cp:19971113 ◽

1997 ◽

Author(s):

B.W. Jaekel

Keyword(s):

Magnetic Fields ◽

Power Cables

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Modelling as a tool for analysing handling effects in structured wire cabling

International Conference on Electromagnetic Compatibility ◽

10.1049/cp:19971132 ◽

1997 ◽

Cited By ~ 1

Author(s):

M.M. Al-Asadi

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International Conference on Electromagnetic CompatibilityLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEE

Transient analysis of printed circuit board structures using a time domain solution of Kirchoff's network equations

Analysis of lightning-induced voltages in a network of conductors using the ATP-EMTP program

Development of the RF HIRF environment

A study into the potential effects of ISM emissions on cellular radio equipment

Screening of multi-pin connectors - suggested measuring techniques

Conducted emission improvement of AC variable speed drives

Aspects of GTEM to OATS measurement correlation

Substrate noise issues in mixed-signal chip designs using Spice

Coupling of magnetic fields from power cables to grounding loops

Modelling as a tool for analysing handling effects in structured wire cabling

International Conference on Electromagnetic Compatibility
Latest Publications