2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits
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Published By IEEE

9781424410149, 9781424410156

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

A Simple and Direct Method for Interface Characterization of OFETs

2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2007.4378107 ◽

2007 ◽

Author(s):

P Srinivas ◽

S.P. Tiwari ◽

Harshil N. Raval ◽

R.N Ramesh ◽

T. Cahyadi ◽

...

Keyword(s):

Direct Method ◽

Interface Characterization

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Trends in memory technology - reliability perspectives, challenges and opportunities

2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2007.4378072 ◽

2007 ◽

Cited By ~ 4

Author(s):

C. Mouli ◽

K. Prall ◽

C. Roberts

Keyword(s):

Challenges And Opportunities

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ESD protection for sub-45 nm MugFET technology

2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2007.4378077 ◽

2007 ◽

Cited By ~ 1

Author(s):

M.I. Natarajan ◽

S. Thijs ◽

D. Tremouilles ◽

D. Linten ◽

N. Collaert ◽

...

Keyword(s):

Esd Protection

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Reliability Challenges in Analog and Mixed Signal Technologies

2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2007.4378073 ◽

2007 ◽

Cited By ~ 3

Author(s):

Prasad Chaparala ◽

Douglas Brisbin ◽

Jonggook Kim ◽

Barry OConnell

Keyword(s):

Mixed Signal

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IC Debug and Defect Localization using Dynamic Laser Stimulation and Time-Resolved Emission

2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2007.4378090 ◽

2007 ◽

Cited By ~ 1

Author(s):

Julie Ferrigno ◽

Philippe Perdu ◽

Kevin Sanchez ◽

Dean Lewis ◽

Michel Vallet ◽

...

Keyword(s):

Time Resolved ◽

Laser Stimulation ◽

Defect Localization

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The Defects of Silicon Reacted with Carbon Content Vapour in ULSI Nano-meter-Generation Technology

2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2007.4378101 ◽

2007 ◽

Author(s):

Po-Ying Chen ◽

Shen-Li Chen ◽

Ming-Hsiung Tsai ◽

M. H. Jing ◽

T.-C. Lin ◽

...

Keyword(s):

Carbon Content ◽

Generation Technology

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Failure Analysis on Low Pull Strength of Thermo-sonic Wedge Bond between Gold Wire and Gold Substrate of MEMS Device

2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2007.4378106 ◽

2007 ◽

Author(s):

Sanjay Kumar Thakur ◽

Gan Tai Kwee

Keyword(s):

Failure Analysis ◽

Gold Wire ◽

Gold Substrate ◽

Pull Strength ◽

Mems Device

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Degradation- and Failure Mode Analysis of III-V Nitride Devices

2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2007.4378102 ◽

2007 ◽

Cited By ~ 5

Author(s):

Joy Tharian

Keyword(s):

Failure Mode ◽

Mode Analysis ◽

Failure Mode Analysis

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Beyond scaling - teaching the old dog some new tricks [Semiconductor technology]

2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2007.4378071 ◽

2007 ◽

Author(s):

S.S. Iyer

Keyword(s):

Semiconductor Technology

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Reliability Analysis of Torsional Varactor

2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2007.4378069 ◽

2007 ◽

Author(s):

C. Venkatesh ◽

Navakanta Bhat

Keyword(s):

Reliability Analysis

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2007 14th International Symposium on the Physical and Failure Analysis of Integrated CircuitsLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

A Simple and Direct Method for Interface Characterization of OFETs

Trends in memory technology - reliability perspectives, challenges and opportunities

ESD protection for sub-45 nm MugFET technology

Reliability Challenges in Analog and Mixed Signal Technologies

IC Debug and Defect Localization using Dynamic Laser Stimulation and Time-Resolved Emission

The Defects of Silicon Reacted with Carbon Content Vapour in ULSI Nano-meter-Generation Technology

Failure Analysis on Low Pull Strength of Thermo-sonic Wedge Bond between Gold Wire and Gold Substrate of MEMS Device

Degradation- and Failure Mode Analysis of III-V Nitride Devices

Beyond scaling - teaching the old dog some new tricks [Semiconductor technology]

Reliability Analysis of Torsional Varactor

2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits
Latest Publications