Design of 3D Integrated Circuits and Systems
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9

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Published By CRC Press

9781315215709

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Low-Power Testing for 2D/3D Devices and Systems

Design of 3D Integrated Circuits and Systems ◽

10.1201/9781315215709-9 ◽

2018 ◽

pp. 235-277

Author(s):

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Keyword(s):

Low Power ◽

Low Power Testing ◽

Power Testing

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Emerging Interconnect Technologies for 3D Networks-on-Chip

Design of 3D Integrated Circuits and Systems ◽

10.1201/9781315215709-6 ◽

2018 ◽

pp. 157-174

Author(s):

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Keyword(s):

Networks On Chip ◽

On Chip ◽

3D Networks

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Electrothermal Simulation of Three-Dimensional Integrated Circuits

Design of 3D Integrated Circuits and Systems ◽

10.1201/9781315215709-4 ◽

2018 ◽

pp. 89-109

Author(s):

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Keyword(s):

Integrated Circuits ◽

Three Dimensional ◽

Electrothermal Simulation

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Integration of Graphics Processing Cores with Microprocessors

Design of 3D Integrated Circuits and Systems ◽

10.1201/9781315215709-3 ◽

2018 ◽

pp. 75-88

Author(s):

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Keyword(s):

Graphics Processing

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Wafer-Level Three-Dimensional ICs for Advanced CMOS Integration

Design of 3D Integrated Circuits and Systems ◽

10.1201/9781315215709-2 ◽

2018 ◽

pp. 57-73

Author(s):

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Keyword(s):

Three Dimensional ◽

Wafer Level

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3D Integration Technology with TSV and IMC Bonding

Design of 3D Integrated Circuits and Systems ◽

10.1201/9781315215709-1 ◽

2018 ◽

pp. 1-55

Author(s):

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Keyword(s):

3D Integration ◽

Integration Technology

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Fabrication and Modeling of Copper and Carbon Nanotube-Based Through-Silicon Via

Design of 3D Integrated Circuits and Systems ◽

10.1201/9781315215709-8 ◽

2018 ◽

pp. 203-233

Author(s):

Sung Kyu Lim

Keyword(s):

Carbon Nanotube ◽

Through Silicon Via

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Thermal Management for 3D ICs/Systems

Design of 3D Integrated Circuits and Systems ◽

10.1201/9781315215709-5 ◽

2018 ◽

pp. 111-155

Author(s):

MISSING-VALUE MISSING-VALUE

Keyword(s):

Thermal Management ◽

3D Ics

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Inductive Coupling ThruChip Interface for 3D Integration

Design of 3D Integrated Circuits and Systems ◽

10.1201/9781315215709-7 ◽

2018 ◽

pp. 175-201

Author(s):

Sung Kyu Lim

Keyword(s):

Inductive Coupling ◽

3D Integration

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