Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses
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Published By Springer US

9781402071935, 9781461511656

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Low-κ Interlevel Dielectrics

Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses ◽

10.1007/978-1-4615-1165-6_2 ◽

2002 ◽

pp. 17-43

Author(s):

Christopher L. Borst ◽

William N. Gill ◽

Ronald J. Gutmann

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CMP of BCB and Silk Polymers

Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses ◽

10.1007/978-1-4615-1165-6_4 ◽

2002 ◽

pp. 71-95 ◽

Cited By ~ 1

Author(s):

Christopher L. Borst ◽

William N. Gill ◽

Ronald J. Gutmann

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Chemical-Mechanical Planarization (CMP)

Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses ◽

10.1007/978-1-4615-1165-6_3 ◽

2002 ◽

pp. 45-69

Author(s):

Christopher L. Borst ◽

William N. Gill ◽

Ronald J. Gutmann

Keyword(s):

Chemical Mechanical Planarization

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Overview of IC Interconnects

Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses ◽

10.1007/978-1-4615-1165-6_1 ◽

2002 ◽

pp. 1-16

Author(s):

Christopher L. Borst ◽

William N. Gill ◽

Ronald J. Gutmann

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Future Directions in IC Interconnects and Related Low-κ Ild Planarization Issues

Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses ◽

10.1007/978-1-4615-1165-6_8 ◽

2002 ◽

pp. 181-201

Author(s):

Christopher L. Borst ◽

William N. Gill ◽

Ronald J. Gutmann

Keyword(s):

Future Directions

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Low-κ CMP Model Based on Surface Kinetics

Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses ◽

10.1007/978-1-4615-1165-6_6 ◽

2002 ◽

pp. 119-159

Author(s):

Christopher L. Borst ◽

William N. Gill ◽

Ronald J. Gutmann

Keyword(s):

Surface Kinetics ◽

Model Based ◽

Cmp Model

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Copper CMP Model Based Upon Fluid Mechanics and Surface Kinetics

Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses ◽

10.1007/978-1-4615-1165-6_7 ◽

2002 ◽

pp. 161-180

Author(s):

Christopher L. Borst ◽

William N. Gill ◽

Ronald J. Gutmann

Keyword(s):

Fluid Mechanics ◽

Surface Kinetics ◽

Model Based ◽

Copper Cmp ◽

Cmp Model

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CMP of Organosilicate Glasses

Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses ◽

10.1007/978-1-4615-1165-6_5 ◽

2002 ◽

pp. 97-118

Author(s):

Christopher L. Borst ◽

William N. Gill ◽

Ronald J. Gutmann

Keyword(s):

Organosilicate Glasses

Download Full-text

Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate GlassesLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By Springer US

Low-κ Interlevel Dielectrics

CMP of BCB and Silk Polymers

Chemical-Mechanical Planarization (CMP)

Overview of IC Interconnects

Future Directions in IC Interconnects and Related Low-κ Ild Planarization Issues

Low-κ CMP Model Based on Surface Kinetics

Copper CMP Model Based Upon Fluid Mechanics and Surface Kinetics

CMP of Organosilicate Glasses

Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses
Latest Publications