2011 IEEE International Conference on IC Design & Technology
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9781424490196

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Sleeve page

2011 IEEE International Conference on IC Design & Technology ◽

10.1109/icicdt.2011.5783198 ◽

2011 ◽

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An ultra-low power K-band low-noise amplifier co-designed with ESD protection in 40-nm CMOS

2011 IEEE International Conference on IC Design & Technology ◽

10.1109/icicdt.2011.5783220 ◽

2011 ◽

Cited By ~ 3

Author(s):

Ming-Hsien Tsai ◽

Shawn S. H. Hsu ◽

Fu-Lung Hsueh ◽

Chewn-Pu Jou ◽

Tzu-Jin Yeh ◽

...

Keyword(s):

Low Power ◽

Low Noise ◽

Low Noise Amplifier ◽

Ultra Low Power ◽

Esd Protection ◽

Noise Amplifier ◽

K Band

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Silicon quantum well light-emitting diode

2011 IEEE International Conference on IC Design & Technology ◽

10.1109/icicdt.2011.5783240 ◽

2011 ◽

Author(s):

S. Saito

Keyword(s):

Quantum Well ◽

Light Emitting Diode ◽

Light Emitting

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Beta-Matrix ESD network: Throughout end of placement rules?

2011 IEEE International Conference on IC Design & Technology ◽

10.1109/icicdt.2011.5783235 ◽

2011 ◽

Cited By ~ 1

Author(s):

J. Bourgeat ◽

P. Galy ◽

B. Jacquier

Keyword(s):

Beta Matrix

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Evolution of embedded flash memory technology for MCU

2011 IEEE International Conference on IC Design & Technology ◽

10.1109/icicdt.2011.5783209 ◽

2011 ◽

Cited By ~ 19

Author(s):

Hideto Hidaka

Keyword(s):

Flash Memory ◽

Embedded Flash

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An ultra-low energy capacitive DAC array switching scheme for SAR ADC in biomedical applications

2011 IEEE International Conference on IC Design & Technology ◽

10.1109/icicdt.2011.5783223 ◽

2011 ◽

Cited By ~ 4

Author(s):

Chao Yuan ◽

Yvonne Y. H. Lam

Keyword(s):

Biomedical Applications ◽

Sar Adc ◽

Low Energy ◽

Switching Scheme ◽

Capacitive Dac

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Low-cost embedded Flash memory technology

2011 IEEE International Conference on IC Design & Technology ◽

10.1109/icicdt.2011.5783211 ◽

2011 ◽

Cited By ~ 5

Author(s):

Wein-Town Sun ◽

Cheng-Jye Liu ◽

Chun-Yuan Lo ◽

Yun-Jen Ting ◽

Ying-Je Chen ◽

...

Keyword(s):

Flash Memory ◽

Low Cost ◽

Embedded Flash

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Program page

2011 IEEE International Conference on IC Design & Technology ◽

10.1109/icicdt.2011.5783246 ◽

2011 ◽

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A single TSV-rail 3D quasi delay insensitive asynchronous signaling

2011 IEEE International Conference on IC Design & Technology ◽

10.1109/icicdt.2011.5783201 ◽

2011 ◽

Author(s):

M. Belleville ◽

E. Beigne ◽

A. Valentian

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Through Silicon Via technology using tungsten metallization

2011 IEEE International Conference on IC Design & Technology ◽

10.1109/icicdt.2011.5783204 ◽

2011 ◽

Cited By ~ 16

Author(s):

G. Pares ◽

N. Bresson ◽

S. Minoret ◽

V. Lapras ◽

P. Brianceau ◽

...

Keyword(s):

Through Silicon Via

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2011 IEEE International Conference on IC Design & TechnologyLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Sleeve page

An ultra-low power K-band low-noise amplifier co-designed with ESD protection in 40-nm CMOS

Silicon quantum well light-emitting diode

Beta-Matrix ESD network: Throughout end of placement rules?

Evolution of embedded flash memory technology for MCU

An ultra-low energy capacitive DAC array switching scheme for SAR ADC in biomedical applications

Low-cost embedded Flash memory technology

Program page

A single TSV-rail 3D quasi delay insensitive asynchronous signaling

Through Silicon Via technology using tungsten metallization

2011 IEEE International Conference on IC Design & Technology
Latest Publications