Effect of board and package attributes on solder joint reliability of FCBGA packages based on IPC9701 characterization

Author(s):  
Jagadeesh Radhakrishnan
2014 ◽  
Vol 54 (5) ◽  
pp. 939-944 ◽  
Author(s):  
Ye Tian ◽  
Xi Liu ◽  
Justin Chow ◽  
Yi Ping Wu ◽  
Suresh K. Sitaraman

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