Electrical Performance of Electronic Packaging,
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84

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8

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Published By IEEE

0780374517

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

"Giga-HZ, giga-bit, and giga-transistors"

Electrical Performance of Electronic Packaging, ◽

10.1109/epep.2002.1057870 ◽

2005 ◽

Author(s):

B. Siu

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A general balanced lossy transmission line model for SPICE

Electrical Performance of Electronic Packaging, ◽

10.1109/epep.2002.1057899 ◽

2003 ◽

Author(s):

D. Quint ◽

K. Bois

Keyword(s):

Transmission Line ◽

Transmission Line Model ◽

Line Model ◽

Lossy Transmission ◽

Lossy Transmission Line

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Efficient representation of multi-bit data bus structures by symmetric two-line models

Electrical Performance of Electronic Packaging, ◽

10.1109/epep.2002.1057901 ◽

2003 ◽

Author(s):

Kyung Suk Oh ◽

Ching-Chao Huang

Keyword(s):

Efficient Representation ◽

Data Bus

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Computing self and mutual capacitance and inductance using even and odd TDR measurements

Electrical Performance of Electronic Packaging, ◽

10.1109/epep.2002.1057896 ◽

2003 ◽

Cited By ~ 1

Author(s):

D.A. Smolyansky ◽

S.D. Corey

Keyword(s):

Mutual Capacitance

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Improved latency insertion method for simulation of large networks with low latency

Electrical Performance of Electronic Packaging, ◽

10.1109/epep.2002.1057878 ◽

2003 ◽

Cited By ~ 8

Author(s):

R. Gao ◽

J.E. Schutt-Aine

Keyword(s):

Low Latency ◽

Large Networks ◽

Insertion Method ◽

Latency Insertion

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High-Q inductors in a MAPBGA package substrate

Electrical Performance of Electronic Packaging, ◽

10.1109/epep.2002.1057883 ◽

2003 ◽

Author(s):

Chi-Taou Tsai ◽

J. Andrews

Keyword(s):

High Q

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Calculating partial inductance of vias for printed circuit board modeling

Electrical Performance of Electronic Packaging, ◽

10.1109/epep.2002.1057897 ◽

2003 ◽

Cited By ~ 1

Author(s):

J.R. Miller ◽

I. Novak ◽

Tai-yu Chou

Keyword(s):

Printed Circuit Board ◽

Circuit Board ◽

Printed Circuit

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MCM-D technology for realisation of low cost system-on-package concept at 60-80 GHz

Electrical Performance of Electronic Packaging, ◽

10.1109/epep.2002.1057882 ◽

2003 ◽

Cited By ~ 3

Author(s):

J. Grzyb ◽

I. Ruiz ◽

M. Klemm ◽

G. Troster

Keyword(s):

Low Cost ◽

Cost System

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40 Gbit/s "fish ladder" signal path and connectorized signal path in ceramic and organic packages for OC768 applications

Electrical Performance of Electronic Packaging, ◽

10.1109/epep.2002.1057923 ◽

2003 ◽

Cited By ~ 1

Author(s):

E.R. Pillai

Keyword(s):

Fish Ladder ◽

Organic Packages ◽

Signal Path

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Design and modeling of a 3.2 Gbps/pair memory channel

Electrical Performance of Electronic Packaging, ◽

10.1109/epep.2002.1057920 ◽

2003 ◽

Cited By ~ 5

Author(s):

Chuck Yuan ◽

W. Beyene ◽

N. Cheng ◽

Hao Shi

Keyword(s):

Memory Channel

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