Video Segmentation Algorithm Based on Improved Kirsch Edge Operator and Three-Frame Difference

For the most commonly used method of are susceptible to noise, it is difficult to extract a complete moving target . Aiming at this problem, we propose a video segmentation algorithm through the combination of an improved Kirsch edge operator and the three-frame difference. Firstly, we got a moving region through a differential by the three consecutive image frames, and then got the edge on the current frame using an improved Kirsch edge detection operator, Synthesis of the two test results, we got a more accurate moving object edges. Then using the edge connector algorithm to complete the connection of the fracture edge, and finally, got moving target mask image through regional filling, thereby dividing the complete moving target, thus dividing the complete moving target. Experimental results show that the algorithm has a certain robustness, and can accurately detect moving targets.

Analysis of Defects Generated by the Reflow Soldering in SMT (Surface Mount Technology) Assembly Applying the Six Sigma Method

The Six Sigma method using the DMAIC methodology is being applied for analyzing the reflow soldering process in an SMT assembly line. The Define phase (D) and Measure phase (M) were concluded, the Analysis (A) phase is being implemented, and the Improve (I) and Control (C) phases will be the next ones. Defects generated during the reflow process were classified and measured both on assembled memory modules and on virgin laminates that were passed through the oven during the reflow of these modules. Spots of solder and flux were found on the edge connector of the modules and also on the surface of the virgin laminates. It was found that these defects are generated inside the reflow oven, indicating that the oven is contaminated. Two solder pastes were analyzed and consequently, two temperature profiles were used. The amount of defects generated by the oven was found to be independent on the temperature profile. On the other hand the amount of defects depends on the solder paste that is used. The FMEA (Failure Mode and Effect Analysis) was also accomplished. As a result, the main failure modes of the reflow process were determined, namely, the heating rate, the soak temperature, the conveyor velocity, the reflow temperature, the reflow time, and the cooling rate.