2018 IEEE CPMT Symposium Japan (ICSJ)
Latest Publications

TOTAL DOCUMENTS

62

(FIVE YEARS 0)

H-INDEX

2

(FIVE YEARS 0)

Published By IEEE

9781538654422

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Development of Standalone Deep Learning Module for Right Mobile Feature Memory Logic Conjugated System (MLCS)

2018 IEEE CPMT Symposium Japan (ICSJ) ◽

10.1109/icsj.2018.8602894 ◽

2018 ◽

Author(s):

Kanji Otsuka ◽

Daisuke Ogawa ◽

Kenji Ueda ◽

Kazuyoshi Oshima ◽

Yoichi Sato

Keyword(s):

Deep Learning ◽

Learning Module ◽

Feature Memory

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400G Multi-Mode and Single-Mode Optical Transmitter Realized by Hybrid-Integrated Silicon Interposer for Data Center Application

2018 IEEE CPMT Symposium Japan (ICSJ) ◽

10.1109/icsj.2018.8602507 ◽

2018 ◽

Cited By ~ 1

Author(s):

Hsiao-Chin Lan ◽

Chin-Ta Chen ◽

Po-Kuan Shen ◽

Hsin-Chieh Wu ◽

Yu-Chun Wang ◽

...

Keyword(s):

Data Center ◽

Single Mode ◽

Optical Transmitter ◽

Multi Mode

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Wavelength matching of resonance reflection and guided-wave launching for high-performance CRIGF

2018 IEEE CPMT Symposium Japan (ICSJ) ◽

10.1109/icsj.2018.8602491 ◽

2018 ◽

Author(s):

Toshiki Kusuura ◽

Atsushi Tsuji ◽

Junichi Inoue ◽

Naoto Takishita ◽

Kenzo Nishio ◽

...

Keyword(s):

High Performance ◽

Guided Wave ◽

Resonance Reflection

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Substrate Shrinkage Effect on Warpage Evaluation for High Bandwidth Package on Package

2018 IEEE CPMT Symposium Japan (ICSJ) ◽

10.1109/icsj.2018.8602768 ◽

2018 ◽

Cited By ~ 1

Author(s):

Ming-Han Wang ◽

Ian Hu ◽

Charles Tsai ◽

Amigo Shao ◽

Meng-Kai Shih ◽

...

Keyword(s):

Shrinkage Effect ◽

High Bandwidth

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A Concept of A Large Scale Multi-Chip-Module in which High Speed Data Transmission Among the Chips is Done by T-Hz Radio Communication.

2018 IEEE CPMT Symposium Japan (ICSJ) ◽

10.1109/icsj.2018.8602837 ◽

2018 ◽

Author(s):

Katsuhiko Ohsaki

Keyword(s):

Data Transmission ◽

High Speed ◽

Large Scale ◽

Radio Communication ◽

High Speed Data ◽

Speed Data Transmission

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Micro-Cables out of High-Speed Communication Chip through Embedded Wires in the Package Substrate

2018 IEEE CPMT Symposium Japan (ICSJ) ◽

10.1109/icsj.2018.8602849 ◽

2018 ◽

Author(s):

Boping Wu

Keyword(s):

High Speed

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Fabrication and Evaluation for Polymer Waveguide Coupler Devices Using the Imprint Method

2018 IEEE CPMT Symposium Japan (ICSJ) ◽

10.1109/icsj.2018.8602661 ◽

2018 ◽

Cited By ~ 2

Author(s):

Fukino Nakazaki ◽

Takaaki Ishigure

Keyword(s):

Waveguide Coupler ◽

Polymer Waveguide

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Silicide based integration approach for fabricating highly reliable, hermitically sealed on-chip, low form factor-microfluidics for 3D IC cooling applications

2018 IEEE CPMT Symposium Japan (ICSJ) ◽

10.1109/icsj.2018.8602734 ◽

2018 ◽

Author(s):

C. Hemanth Kumar ◽

Satish Bonam ◽

Siva Rama Krishna Vanjari ◽

Shiv Govind Singh

Keyword(s):

Form Factor ◽

3D Ic ◽

Integration Approach ◽

On Chip ◽

Ic Cooling

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Beyond Norm Package Interconnects Crosstalk Radiation Analysis and Optimization

2018 IEEE CPMT Symposium Japan (ICSJ) ◽

10.1109/icsj.2018.8602724 ◽

2018 ◽

Author(s):

Wong Chin Pheing

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2.4 GHz Slot Antenna Integrated in Small Shielded Module

2018 IEEE CPMT Symposium Japan (ICSJ) ◽

10.1109/icsj.2018.8602918 ◽

2018 ◽

Author(s):

Keiju Yamada ◽

Makoto Sano ◽

Makoto Higaki ◽

Akihiko Happoya

Keyword(s):

Slot Antenna

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