High Performance Computing Package With Chip Module on Substrate Solutions

With die size increasing and bump pitch decreasing on FCBGA (flip chip ball grid array), warpage is the first challenge that processes of package assembly and SMT (surface mount technology) will have. The main factor is CTE (coefficient of thermal expansion) mismatch between chip and substrate. The larger die size, the more significant elongation difference which could cause warpage. Furthermore, serious warpage can cause manufacture difficulties, such as bump bridge, bump non-wet and underfill (UF) void. As the result, in order to control package warpage, additional force, such as high modulus UF or metal heat sink are usually applied to restrict package deformation. However, the more additional force is applied, the more stress may be transferred to chip and causes chip corner or UF crack where easily cause stress concentration. In this paper, large package > 70 * 70 mm is studied for the challenges of on substrate process and reliability, meanwhile simulation is performed for stress prediction. In addition, possible solutions from material and process are discussed and studied.

The Effects of Snack Exposure, Package Size, and Variety on Subsequent Energy Intake in Healthy Adults

Objectives The purpose of this study was to examine whether snack exposure, package size, and variety influence subsequent energy intake and food choice in healthy adults. Methods Thirty-one healthy young adults (age: 23.6 ± 0.7y; BMI: 23.0 ± 0.5 kg/m2) participated in a randomized crossover study. At baseline, participants completed a 3-day snack recall in which they reported any snack foods or beverages consumed outside of breakfast, lunch, and dinner eating occasions (Control). Following baseline, the participants were provided, in randomized order, with the following isocaloric pack-out coolers to consume for 3 non-consecutive days/pack-out type: 1) Standard: containing 11 commonly consumed snacks (e.g., salty snacks, desserts & candy, fruit, vegetables, etc.); 2) Large Package: containing the same snacks at Standard but in larger package sizes; and 3) Variety: containing the same types of snacks as Standard plus an additional eight snacks. During the Control and pack-out assessment periods, standardized breakfasts, lunches, and dinners were provided. Three-day averaged ad libitum snack energy intake and food choices were assessed. Results Three-day average snack intake from Control was 747 ± 59 kcal, Standard was 1121 ± 111 kcal, Large Package was 1274 ± 138 kcal, and Variety was 1110 ± 103 kcal. Regardless of type, the exposure to free, snack pack-outs increased snack energy intake compared to Control (all, P < 0.005). Large Package increased snack energy intake vs. Standard (P = 0.01) and Variety (P = 0.02). Further, Large Package increased consumption of desserts & candy, high fat, high sugar, and salty snacks vs. Standard (all, P < 0.03) and Variety (P < 0.02 to P = 0.06). Alternately, Variety increased consumption of fruits and vegetables compared to Large Package (P = 0.01) and Standard (P < 0.005). No other differences were observed. Conclusions Exposure to free, highly palatable snacks provided in larger package sizes led to greater energy consumption, especially from energy-dense snacks, in healthy adults, whereas snack variety increased nutrient-dense snacking without increased energy consumption. These results suggest that snack exposure, package size, and variety should be considered when developing dietary strategies to promote energy balance and healthy eating habits. Funding Sources Sabra Dipping Company and Internal Funds.

Understanding consumer perceptions of quality based on package size: the moderating role of the evaluation context

PurposeEmpirical research on the influence of package size on consumers' quality perception has been scarce. Yan et al. (2014), an initial study focusing on this topic, showed that a small package generates higher perceived quality than a large package of the same brand. To cultivate a deeper understanding of such an effect, this paper aims to extend that study by examining the process by incorporating the evaluation context as a moderator.Design/methodology/approachTwo experiments were carried out. In Study 1 (n = 380), the effect of package size on perceived quality was investigated by comparing a standalone context in which a single package size was presented and a context in which two different package sizes were shown. In Study 2 (n = 436), a standalone context was compared with another context in which participants viewed two different sizes but directed their attention to only one.FindingsThe findings indicate that the package size effect is not universal, and that it generally appears in a standalone context. In the contexts where two sizes were presented, it appears when consumers' attention is directed to only one size, whereas the effect does not manifest when consumers focus equal attention on both. The impact of the evaluation context is also stronger for small packages than for large packages.Originality/valueThis paper adds knowledge to packaging and cue-utilisation literature by clarifying a boundary condition of the impact of package size on consumers' quality perception.

Segmentation of Polish Households Taking into Account Food Waste

Currently, food waste is estimated at more than one-third of all food produced, and the primary responsibility for this phenomenon is attributed to households. Therefore, it seems reasonable to take action to limit food waste and to raise awareness about this link in the chain. To develop and implement educational programs addressed at consumers it is necessary to understand the factors determining food waste in households. Segmentation is a tool that can help effectively reach consumers who are to the greatest extent wasting food which identifies homogeneous clusters of consumers. The aim of this study was to perform segmentation to identify consumer groups with similar behaviors in relation to food, with particular emphasis on food wastage. We carried out segmentation on a representative sample of Polish people over 18 years of age and to identified three clusters of consumers. The three consumer segments diagnosed differed in sociodemographic terms, i.e., number of adults, number of children, subjective assessment of the financial situation, and percentage of spending on food. The segment exhibiting a high frequency of discarding food due to too large package size included single and double households.

Republic of Congo

The Republic of Congo was hit hard by the oil price shock and delayed fiscal adjustment, amidst governance challenges and unsustainable debt. While program negotiations were long and complex, the authorities made decisive progress in 2018 and early 2019 with decisive fiscal consolidation, and the implementation of a large package of structural reforms, including two rounds of prior actions to improve governance and transparency. In addition, financing assurances have been secured.

Temperature and Process Dependent Material Characterization and Multiscale Stress Evolution Analysis for Performance and Reliability Management under Chip Package Interaction

Distinct temperature and process dependent deformation behaviors under packaging temperature cycles are characterized for various packaging materials. Substrate and underfill deformations are described using Maxwell viscoelasticity model. Solder bump deformation is represented by incremental plasticity model. Anisotropic deformation in silicon and orthotropic deformation in substrate are also considered. The material deformation effects on stress evolutions during fabrication and under chip package interaction (CPI) are analyzed for a large package structure. Complex geometries spread over a large range of length scales are simulated using multi-level and multiscale sequential submodeling technique. Global package simulations show that substrate orthotropy has a significant impact on the package warpage during the assembly process. Sequential package assembly simulations are performed to examine the residual stresses at package, bump and interconnect scales. The results show that the package material behaviors during the assembly process affect not only the residual stresses in the large package structure but also in the local bump regions and the interconnect structures. The temperature dependent material non-linear behaviors under operating conditions also affect residual stresses and carrier mobility. This work demonstrates that developing performance and reliability management strategies under CPI should consider temperature and process dependent material deformations during fabrication and packaging.