slurry characterization
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Novel micro-encapsulated phase change materials with low melting point slurry: Characterization and cementing application

Energy ◽  
2019 ◽  
Vol 186 ◽  
pp. 115920 ◽  
Author(s):  
Jin-hua Huo ◽  
Zhi-gang Peng ◽  
Kun Xu ◽  
Qian Feng ◽  
De-yang Xu
Keyword(s):  
Melting Point ◽  
Phase Change ◽  
Phase Change Materials ◽  
Slurry Characterization

Swine Slurry Characterization and Prediction Equations for Nutrients on South Korean Farms

2009 ◽  
Vol 52 (1) ◽  
pp. 267-273 ◽  
Author(s):  
A. Suresh ◽  
H. L. Choi ◽  
J. H. Lee ◽  
K. Zhu ◽  
H. Q. Yao ◽  
...  
Keyword(s):  
Prediction Equations ◽  
Swine Slurry ◽  
South Korean ◽  
Slurry Characterization

Slurry characterization by hydrostatic pressure measurement — analysis based on apparent weight flux ratio

2006 ◽  
Vol 17 (3) ◽  
pp. 319-332 ◽  
Author(s):  
Takamasa Mori ◽  
Kiyohito Kiyohito ◽  
Makoto Makoto ◽  
Junichiro Junichiro ◽  
Tomohiro Tomohiro
Keyword(s):  
Hydrostatic Pressure ◽  
Pressure Measurement ◽  
Flux Ratio ◽  
Measurement Analysis ◽  
Apparent Weight ◽  
Slurry Characterization

scholarly journals Development of Slurry Characterization Method by Constant Pressure Filtration

2005 ◽  
Vol 113 (1324) ◽  
pp. 761-767 ◽  
Author(s):  
Hyo-Jung KIM ◽  
Takamasa MORI ◽  
JunIchiro TSUBAKI
Keyword(s):  
Constant Pressure ◽  
Pressure Filtration ◽  
Slurry Characterization

20710 An Approach to Slurry Characterization for CMP

2005 ◽  
Vol 2005.11 (0) ◽  
pp. 281-282
Author(s):  
Yoshitaka MORIOKA ◽  
Masaharu KINOSHITA ◽  
Shinichi HABA
Keyword(s):  
Slurry Characterization

In-Situ Chronoamperometry for CMP Slurry Investigations

2005 ◽  
Vol 867 ◽  
Author(s):  
Jian Zhang ◽  
Steven Grumbine ◽  
Phillip W. Carter ◽  
Thomas Werts
Keyword(s):  
Film Formation ◽  
Surface Film ◽  
Surface Reactivity ◽  
Current Response ◽  
Applied Potential ◽  
Exponential Equation ◽  
Kinetics Of ◽  
Fitting Parameters ◽  
Slurry Characterization

AbstractA new application of the electrochemical method, in situ chronoamperometry, has been developed and used as a tool for CMP slurry characterization. The measured current response, i, resulting from a small applied potential is fit to an exponential equation, i = io + A1exp(-t/tD). The fitting parameters serve as a measure of surface reactivity (io), surface film robustness (A1), and the kinetics of film formation (tD). A description of the method and correlations to polishing performance are discussed in this paper.

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