PROTEIN INFLUENCE ON THE MECHANICAL PROPERTIES OF NR

ABSTRACT Protein effect on vulcanization of NR, obtained from Hevea brasiliensis, was investigated by analyzing the crosslinking structure of the resulting vulcanizates prepared from untreated NR, deproteinized natural rubber (DPNR), and protein-free natural rubber (PFNR) by swelling methods and rubber-state NMR spectroscopy. The proteins present in NR were removed by three methods: deproteinization with enzyme, urea, or urea–acetone in the presence of sodium dodecyl sulfate. The amount of proteins present in NR, approximately 0.238 w/w%, was reduced to 0.000 w/w% by urea–acetone deproteinization, whereas it was reduced to approximately 0.003 and 0.019 w/w% by enzyme and urea deproteinizations, respectively. Hardness, swelling degree, and crosslinking structure depended on the amount of proteins. Changes in mechanical properties for the vulcanizates prepared from not only non-filler compounds but also carbon black–filled and silica-filled compounds were attributed to the amount of proteins.

Cure Kinetics of High Performance Epoxy Molding Compounds

The reaction of EMCs with the triphenylphosphine-1,4-benzoquinone (TPP-BQ) latent catalyst also had a higher temperature sensitivity compared to the reaction of EMCs with triphenylphosphine (TPP) catalyst. In resin transfer molding, EMCs containing the TPP-BQ thermal latency accelerator are least active at a low temperature. Consequently, EMCs have a low melt viscosity before gelation, and the resins and filler are evenly mixed in the kneading process. Additionally, the rheological property, flowability, is increased before the EMC form a network structure in the molding process. The proposed kinetic model adequately describes curing behavior in EMCs cured with two different organophosphine catalysts up to the rubber state in the progress of curing.

Thermal and Cure Kinetics of Epoxy Molding Compounds Cured with Thermal Latency Accelerators

The cure kinetics and mechanisms of a biphenyl type epoxy molding compounds (EMCs) with thermal latency organophosphine accelerators were studied using differential scanning calorimetry (DSC). Although the use of triphenylphosphine-1,4-benzoquinone (TPP-BQ) and triphenylphosphine (TPP) catalysts in biphenyl type EMCs exhibited autocatalytic mechanisms, thermal latency was higher in the TPP-BQ catalyst in EMCs than in the TPP catalyst in EMCs. Analyses of thermal characteristics indicated that TPP-BQ is inactive at low temperatures. At high temperatures, however, TPP-BQ increases the curing rate of EMC in dynamic and isothermal curing experiments. The reaction of EMCs with the TPP-BQ latent catalyst also had a higher temperature sensitivity compared to the reaction of EMCs with TPP catalyst. In resin transfer molding, EMCs containing the TPP-BQ thermal latency accelerator are least active at a low temperature. Consequently, EMCs have a low melt viscosity before gelation, and the resins and filler are evenly mixed in the kneading process. Additionally, flowability is increased before the EMCs form a network structure in the molding process. The proposed kinetic model adequately describes curing behavior in EMCs cured with two different organophosphine catalysts up to the rubber state in the progress of curing.

THERMOMECHANICAL PROPERTY OF EPOXY SHAPE MEMORY POLYMERS

Epoxy shape memory polymers (SMPs) were preparation and their mechanical properties are focused on. Full shape recovery is observed at 150 °C for each polymer, and the SMP with lower hardener content shows a quicker shape recovery speed. In addition to a good thermal stability, glass transition temperature of the polymers increases with increasing hardener content. Of particular attention of DMA test is that the epoxy SMPs show a high storage modulus not only in glass state but also in rubber state. The tension test indicates that both stress at break and corresponding elastic modulus vary with a peak value for the polymers.