High Speed, High Density Separable Interconnect - 1000 plus I/O ultra-low profile interfaces

HSIO Technologies has developed several interconnect technologies that enable very high speed, fine pitch separable interconnect between a semiconductor package, flex cable or printed circuit assembly and a system level printed circuit board. In basic terms, connector technology has been produced that allows of direct socketing of the SoC, PoP, CPU, RF Module or Memory device directly in a mobile platform in an ultra-low profile interface that also extends to a ganged RF capable interface for flex cable and board to board applications. The technology revolves around matching very small metallic contacts with fusion bonded Liquid Crystal Polymer materials to create a high speed interface on very fine pitch. Applications to be detailed are socketing of mobile processors, memory devices, and RF modules directly in a cell phone handset, tablet and notebook computer. Emerging complexity with mobile platforms dictates that traditional methods of validating platform performance is not adequate with significant value in the ability to plug packaged IC devices into the actual consumer platform to validate silicon and performance. The paper will document the package substrate to connector interface as well as introduce very high performance connector and flex cable interconnects on 0.35 mm pitch area array for mobile, desktop, and server applications.

Modification for the Mechanical Model of Flex Cable in Hard Disk Drives With an External Electric Field

The demand of raising recording density for hard disk has increased these years to achieve higher storage capacity of hard disk drive. This promotes the diminution in track size of hard disk nowadays to only hundreds of nanometers. Thus, more precisely-operated and robust actuation system for read/write heads in HDDs has been the research and development focus. Among mechanical contributors, Chang [1] indicated that flexible circuit in HDDs has been found to be a problematic vibration source that can interfere and reduce the operation accuracy of read/write arm. To perfectly eliminate the dynamic responses of flex cable, piezo-electric (PZT) film was adopted by attaching it onto flex cable to achieve the goal of vibration control. When an external electric field is applied to this PZT film, piezoelectricity effect is then taken place which results in induction of mechanical shear force in flex cable. The cable’s vibrations can then be controlled by this mechanism with the additional PZT film on the flex cable. With energized PZT film, this means that flex cable will turn harder and its stiffness will become larger, which makes the dynamic behavior of flex cable becomes an uncertainty. The mechanical model built in previous work [2] then fails to predict the dynamic response of the flex cable. Due to the problems mentioned above, modification for the mechanical model is imperative and it was elaborated by considering the shear effects produced by PZT in this paper. As reported by Kenji Uchino [4], Henno Allik [5] and many other researchers [6–8], finite element methods have been applied to many piezoelectric applications. Piezoelectricity includes electrical and mechanical behaviors of a material. Therefore, the piezoelectric constitutive equations were conducted in this paper to consider this combined electroelastic effects from PZT.