Fabrication of bilayer resin-bonded fixed abrasive wires using the pultrusion process

2018 ◽  
Vol 38 (2) ◽  
pp. 187-195
Author(s):  
Yi-Shien Liou ◽  
Shenq-Yih Luo
Keyword(s):  
Cross Section ◽  
Phenolic Resin ◽  
Surface Pretreatment ◽  
Diamond Wire ◽  
Pultrusion Process ◽  
Impregnated Resin ◽  
Fixed Diamond Wire ◽  
Modified Epoxy ◽  
Fixed Abrasive ◽  
Piano Wire

Abstract The fabrication of resin-bonded abrasive composite materials with constant cross-section was achieved by wire pultrusion wherein a piano wire of diameter 120 μm used as a core was pulled through a surface pretreatment, resin bath and into a die orifice and oven, where the impregnated resin slurry was cured at a moderate temperature. The bilayer resin-bonded fixed diamond wire with a diameter of about 191–205 μm with an inner layer of phenolic-modified epoxy resin and an outer layer of phenolic resin through the pultrusion method was presented. The results showed that when liquid resin slurry with higher diamond concentration during the pultrusion process was used, a larger wire diameter, less diamond spacing and higher diamond protrusion were obtained.

Study on Manufacturing Technology of Resin Bonded Diamond Wire Saw

2012 ◽  
Vol 602-604 ◽  
pp. 2054-2058
Author(s):  
Dong Mei Xu ◽  
Hai Bo Zhang ◽  
Jun Gao ◽  
Ming Hui Cong
Keyword(s):  
Environmental Pollution ◽  
Manufacturing Technology ◽  
Cutting Efficiency ◽  
Preparation Technology ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
Fixed Diamond Wire ◽  
Fixed Abrasive ◽  
Bonded Method

Slicing of silicon, quartz crystal and other hard brittle materials mainly use dissociated abrasive multi-wire saw slicing technology, which exists some shortcomings, such as severe environmental pollution, lower cutting efficiency, etc. So it is bound to be replaced by fixed abrasive diamond wire saw in the future. At present, generally, the manufacturing technology of fixed diamond wire saw includes electroplating method and resin bonded method. Compared with electroplating diamond wire saw, the resin bonded diamond wire saw has obvious advantages, such as simpler production technique, lower cost, higher cutting efficiency, less environmental pollution, etc. In this paper, the polyurethane was chosen as matrix resin of resin bonded, and phenolic resin was chosen as curing agent, the preparation technology of thermosetting resin bonded diamond wire saw, is researched in this paper. Firstly, the effects of various compositions on resin bonded, are researched, then the optimal fomula and the manufacturing technology are determined

Study on Removal Mechanism of Fixed-Abrasive Diamond Wire Saw Slicing Monocrystalline Silicon

2007 ◽  
Vol 359-360 ◽  
pp. 450-454 ◽  
Author(s):  
Yu Fei Gao ◽  
Pei Qi Ge ◽  
Zhi Jian Hou
Keyword(s):  
Monocrystalline Silicon ◽  
Wafer Surface ◽  
Removal Mechanism ◽  
Surface Formation ◽  
Diamond Wire ◽  
Brittle Ductile Transition ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
The Wire ◽  
Fixed Abrasive

The physical model of fixed-abrasive diamond wire-sawing monocrystalline silicon was founded to analyze the elastic deformation of the wire, supposing that every grit was connected to the surface of the wire by a spring. Ignoring lateral vibration of the wire, the geometrical model of wire-sawing was founded; the average cut depth of single grit was calculated theoretically. Based the indentation fracture mechanics and investigations on brittle-ductile transition of machining monocrystalline silicon, the removal mechanism and surface formation was studied theoretically. It shows that in the case of wire-sawing velocity of 10m/s or higher, infeed velocity of 0.20mm/s and diamond grain size of 64μm or smaller, the chip formation and material removal is in a brittle regime mainly, but the silicon wafer surface formation is sawed in a ductile regime. The size of the abrasives, the wire-saw velocity and infeed velocity can influence the sawing process obviously.

The Progress of Fixed Abrasive Wire Saws in the Last Decade

2010 ◽  
Vol 97-101 ◽  
pp. 15-18 ◽  
Author(s):  
Chun Yan Yao ◽  
Ming Huan Wang ◽  
Wei Peng
Keyword(s):  
Research Progress ◽  
Machining Performance ◽  
Diamond Wire ◽  
The Past ◽  
Technical Developments ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
Different Types ◽  
Metallic Bonding ◽  
Fixed Abrasive

Diamond wire saw is the leading technology for use in slicing hard brittle material. This paper provides a brief review of its research progress in the most recent years. According to the bonding material kinds of diamond wire saw, it can be classified into three main categories, i.e. metallic bonding materials, organic bonding materials, and resin bonding materials. In the past decade, several new major technical developments in fixed abrasive diamond wire saw have emerged. This paper investigates the related literature on four different types of fixed abrasive diamond wire saws, presents their manufacturing processes and machining performance, and compares the tension and anti-abrasion of the wire saws, removal efficiency of slicing, and their applications in silicon slicing.

Development of Resin Bonded Diamond Wire Saw and Slicing Experiments

2009 ◽  
Vol 416 ◽  
pp. 321-326 ◽  
Author(s):  
Pei Qi Ge ◽  
Zhi Jian Hou ◽  
Shao Jie Li
Keyword(s):  
Epoxy Resin ◽  
Phenolic Resin ◽  
Orthogonal Experiment ◽  
Silicon Crystal ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
Mixed Material ◽  
Diamond Grain ◽  
Peeling Off

Because its advantages of lower manufacture cost and higher slicing quality, the resin bonded diamond wire saw is supposed to be used widely in the future for slicing hard-brittle materials such as silicon crystal. In this paper, based on the research of the resin bonded diamond wire saw manufacturing technology and slicing process, we select Φ0.2mm SWPB piano string as core wire, 20-30m (800#) diamond grain as abrasive, liquid phenolic resin mixed with epoxy resin as adhesive, the nanometer powders as additive to improve the adhesive holding strength of abrasive grains and heat resistance. By orthogonal experiment, we find the resin bonded diamond wire saw has optimizing performance as the additives is 10% in adhesive, the epoxy resin is 30% in resin, the diamond is 50% in whole mixed material. Slicing experiments proves that the resin bonded diamond wire saw manufactured in this study has better slicing performance. The failure forms of the resin bonded diamond wire saw are wear out of resin adhesive, falling off of diamond grains and the partial peeling off of the resin bond.

Key Factors in Ultraviolet-Curing Wire Saw

2007 ◽  
Author(s):  
Fuqing Liu ◽  
Chunyan Yao ◽  
Wei Peng
Keyword(s):  
Key Factors ◽  
Ultraviolet Curing ◽  
Diamond Wire ◽  
Abrasive Grains ◽  
Manufacture Process ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
Low Efficiency ◽  
Electroplating Process ◽  
Fixed Abrasive

Wire saw, with its ability to cut hard brittle material, such as silicon ingots, crystals and quartz, has emerged as a leading technology for production in semiconductor and photovoltaic industry. There are some defects in conventional loose abrasive wire saw such as significant industrial waste, low machining efficiency, high running costs, etc. As a countermeasure to these problems, some fixed-abrasive diamond wire saws are produced by electroplating process, bonding with resin agent or mechanical embedding of abrasive grains into piano wires. Nevertheless, there still exist disadvantages such as low efficiency of bonding process and high manufacture cost. For this reason, in the research, an idea of making fixed-abrasive diamond wire saw bonded with ultraviolet-curing resin is proposed. In manufacture process, generally, the preparation of materials, improvement of adhesion, and the art of ultraviolet curing determine what technologies is most effective. Therefore, to attain a specific set of properties in the cured wire saw and to achieve an efficient ultraviolet-curing process, the factors that influence the photopolymerization should be well understood. In this paper, the manufacturing process of an ultraviolet-curing resin wire saw is illustrated. Moreover, slicing experiments are deduced to evaluate the results of the study.

A new method of determining the slicing parameters for fixed diamond wire saw

2020 ◽  
Vol 120 ◽  
pp. 105252
Author(s):  
Tengyun Liu ◽  
Peiqi Ge ◽  
Wenbo Bi ◽  
Yufei Gao
Keyword(s):  
New Method ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
Fixed Diamond Wire

scholarly journals Optimizing the thermal gradient and the pulling speed in a thermoplastic pultrusion process of PET/E glass fibers using finite element method

10.30544/367 ◽  
2018 ◽  
Vol 24 (2) ◽  
pp. 103-112 ◽  
Author(s):  
Nataša Z Tomić ◽  
Marija Vuksanović ◽  
Bojan Međo ◽  
Marko Rakin ◽  
Dejan Trifunović ◽  
...  
Keyword(s):  
Finite Element ◽  
Cross Section ◽  
Thermal Gradient ◽  
Ethylene Terephthalate ◽  
Glass Fibers ◽  
Element Analysis ◽  
Pultrusion Process ◽  
Poly Ethylene Terephthalate ◽  
Poly Ethylene ◽  
Two Parameters

A thermoplastic pultrusion process was examined using commercial fiber roving of PET/E glass, to determine the optimum pulling speed and optimal zonal temperatures. Finite element analysis predicted heat transfer through the commingled fibers and air in the pultrusion die. The cross-section of obtained rods was examined, and image analysis was carried out to obtain information about the degree of fiber impregnation, number of voids and uniformity of fiber distribution. Optimizing the temperature field for the pultrusion of poly (ethylene terephthalate) is of significant importance. The pulling speed has the same importance. These two parameters are closely related as evidenced by the analysis of images.

Preparation and Tribological Behavior of Carbon Fiber Reinforced Pantograph Slide Plate

2012 ◽  
Vol 430-432 ◽  
pp. 378-382 ◽  
Author(s):  
Hua Yuan ◽  
Cheng Guo Wang ◽  
Wen Bo Lu ◽  
Shan Zhang
Keyword(s):  
Carbon Fiber ◽  
Cross Section ◽  
Mass Fraction ◽  
Phenolic Resin ◽  
Adhesive Wear ◽  
Tribological Behavior ◽  
Structural Characteristics ◽  
Electric Resistance ◽  
Continuous Carbon Fiber ◽  
The Impact

The carbon fiber (CF) reinforced pantograph sliding plates were fabricated by hot pressing with modified phenolic resin as bonder, and the continuous carbon fiber, copper and graphite respectively were reinforcing phase, electric conductive phase and lubricating phase, respectively. The impact toughness, electric resistance and wear resistance of the slide plate were tested. The structural characteristics of the pantograph sliding plates were investigated by scanning electron microscopy (SEM). The results show that the addition of CF mass fraction can increase impact strength and density; while resistivity has a lower trend; the volume abrasion loss and friction coefficient are decreased then increased dramatically. The fiber and resin interface adhesion is good for specimen impact cross section smooth. In addition, adhesive wear and abrasive wear are the main wear form of pantograph slide plates.

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