scholarly journals Low Cost Halogen-Free Materials for Printed Wiring Board

2013 ◽  
Vol 2 (1) ◽  
pp. 26-30
Author(s):  
Akihiko HAPPOYA ◽  
Sadahiro TAMAI ◽  
Robert HUANG ◽  
Stephen WANG ◽  
Paul LEE ◽  
...  
MRS Bulletin ◽  
2006 ◽  
Vol 31 (6) ◽  
pp. 471-475 ◽  
Author(s):  
Marc Chason ◽  
Daniel R. Gamota ◽  
Paul W. Brazis ◽  
Krishna Kalyanasundaram ◽  
Jie Zhang ◽  
...  

AbstractDevelopments originally targeted toward economical manufacturing of telecommunications products have planted the seeds for new opportunities such as low-cost, large-area electronics based on printing technologies. Organic-based materials systems for printed wiring board (PWB) construction have opened up unique opportunities for materials research in the fabrication of modular electronic systems.The realization of successful consumer products has been driven by materials developments that expand PWB functionality through embedded passive components, novel MEMS structures (e.g., meso-MEMS, in which the PWB-based structures are at the milliscale instead of the microscale), and microfluidics within the PWB. Furthermore, materials research is opening up a new world of printed electronics technology, where active devices are being realized through the convergence of printing technologies and microelectronics.


2004 ◽  
Vol 127 (2) ◽  
pp. 185-188
Author(s):  
J. Cepeda-Rizo ◽  
Hsien-Yang Yeh

The paper presents a study of creep behavior of a printed wiring board caused by the mechanical fastening of separable connector, known as a land grid array. Time-temperature superposition method was employed to predict the lifetime creep behavior. A low-cost testing method based on the ASTM D790 three-point bending procedure was developed to predict and characterize creep of polymeric materials under low temperature, low stress, and large elapsed times.


2013 ◽  
Vol 2013 (1) ◽  
pp. 000825-000830 ◽  
Author(s):  
Yoichiro Sato ◽  
Bruce Chou ◽  
Vijay Sukumaran ◽  
Junki Min ◽  
Motoshi Ono ◽  
...  

3D Integrated Passive and Actives Component (IPAC) is a new concept of ultra-miniaturized and highly functional sub-systems, which enables one to achieve higher RF functionality in a single module. As the first step, this paper demonstrates the concept of integrating passive components using 100μm ultra-thin glass and small Through Package Vias (TPVs) by ArF excimer laser. Passive low pass filters (LPF) for WLAN in thin dielectrics on glass were designed using circuit simulator and EM solver. The LPFs were fabricated using low-cost panel based processes, and then assembled onto the Printed Wiring Board (PWB). The filters on either side of the glass interposer were measured at the board level, and the results corroborated well with EM simulations. The measurement results showed low insertion loss (about −1dB) and high rejection (<−20dB). The integration of passive components using double-side and ultra-thin glass interposers with small TPVs, enables one to shrink RF module size.


2001 ◽  
Vol 118 (1-3) ◽  
pp. 436-441 ◽  
Author(s):  
Eiichi Aoyama ◽  
Hiromich Nobe ◽  
Toshiki Hirogaki

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