scholarly journals CONTROLLING Au/n-Si SCHOTTKY BARRIER CONTAI-NING HYDROGEN BY ZERO BIAS ANNEALING AND REVERSE BIAS ANNEALING

1994 ◽  
Vol 43 (6) ◽  
pp. 1017
Author(s):  
YUAN MIN-HUA ◽  
QIAO YONG-PING ◽  
SONG HAI-ZHI ◽  
JIN SI-XIAN ◽  
QIN GUO-GANG
Keyword(s):  
Schottky Barrier ◽  
Reverse Bias ◽  
Zero Bias

Effect of reverse-bias annealing and zero-bias annealing on a hydrogen-containing Au/(n-type GaAs) Schottky barrier

1993 ◽  
Vol 48 (24) ◽  
pp. 17986-17994 ◽  
Author(s):  
M. H. Yuan ◽  
H. Z. Song ◽  
S. X. Jin ◽  
H. P. Wang ◽  
Y. P. Qiao ◽  
...  
Keyword(s):  
Schottky Barrier ◽  
Reverse Bias ◽  
Zero Bias

Bias Annealing Effect on Hydrogen-Containing Au/N-Silicon Schottky Barrier

1993 ◽  
Vol 319 ◽  
Author(s):  
M.H. Yuan ◽  
Y.Q. Jia ◽  
G.G. Qin
Keyword(s):  
Schottky Barrier ◽  
Reverse Bias ◽  
Annealing Temperature ◽  
Interface States ◽  
Annealing Effect ◽  
Reversible Change ◽  
Semiconductor Interface ◽  
Zero Bias ◽  
Hydrogen Incorporation

AbstractAu/n-Si Schottky barrier (SB) incorporated by hydrogen has a 0.13 eV lower SB height (SBH) than that without hydrogen incorporation. For the hydrogen-containing SB, zero bias annealing (ZBA) decreases the SBH while reverse bias annealing (RBA) increases it. Besides, the ZBA and RBA cycling experiments reveal a reversible change of the SBH with in at least three cycles. The higher annealing temperature of RBA results in higher SBH. We interpret the above experimental facts as that hydrogen has an effect on metal-semiconductor interface states and then on the SBH, and both the bias on SB and temperature of annealing can influence the hydrogen effects on metal-semiconductor interface states.

Evaluation of Buried Grid JBS Diodes

2014 ◽  
Vol 778-780 ◽  
pp. 804-807 ◽  
Author(s):  
Jang Kwon Lim ◽  
Dimosthenis Peftitsis ◽  
Diane Perle Sadik ◽  
Mietek Bakowski ◽  
Hans Peter Nee
Keyword(s):  
High Temperature ◽  
Schottky Barrier ◽  
Reverse Bias ◽  
Schottky Contact ◽  
Grid Spacing ◽  
Zero Bias ◽  
Recovery Behavior ◽  
Anode Area ◽  
High Temperature Operation ◽  
Best Fit

The 4H-SiC Schottky barrier diodes for high temperature operation over 200 °C have been developed using buried grids formed by implantation. Compared to a conventional JBS-type SBD with surface grid (SG), JBS-type SBD with buried grid (BG) has significantly reduced leakage current at reverse bias due to a better field shielding of the Schottky contact. By introducing the BG technology, the 1.7 kV diodes with an anode area 0.0024 cm2(1 A) and 0.024 cm2(10 A) were successfully fabricated, encapsulated in TO220 packages, and electrically evaluated. Two types of buried grid arrangement with different grid spacing dimensions were investigated. The measured I-V characteristics were compared with simulation. The best fit was obtained with an active area of approximately 60 % and 70 % of the anode area in large and small devices, respectively. The measured values of the device capacitances were 1000 pF in large devices and 100 pF in small devices at zero bias. The capacitance values are proportional to the device area. The recovery behavior of big devices was measured in a double pulse tester and simulated. The recovery charge, Qc, was 18 nC and 24 nC in simulation and measurement, respectively. The fabricated BG JBS-type SBDs have a smaller maximum reverse recovery current compared to the commercial devices. No influence of the different grid spacing on the recovery charge was observed.

Evidence For Non-Correlation Between The 0.15 eV And 0.44 eV Cu-Related Acceptor Levels In GaAs

1996 ◽  
Vol 442 ◽  
Author(s):  
K. Leosson ◽  
H. P. Gislason
Keyword(s):  
Reverse Bias ◽  
Deep Level ◽  
Current Transient ◽  
Zero Bias ◽  
Lithium Diffusion ◽  
Transient Spectroscopy ◽  
Plasma Hydrogenation

AbstractWe present investigations on the two dominating acceptor levels observed in Cu-diffused GaAs which have frequently been attributed to the two ionization levels of a double CuGa acceptor. We employed plasma hydrogenation and lithium diffusion followed by reverse-bias and zero-bias annealing to passivate and subsequently reactivate the Cu-related acceptor levels. Deep-level current-transient spectroscopy measurements reveal that the two levels are independently reactivated, strongly indicating that they arise from different defects.

DLTS studies of defects produced in n-type silicon by hydrogen implantation at low temperature

2002 ◽  
Vol 744 ◽  
Author(s):  
Takahide Sugiyama ◽  
Masayasu Ishiko ◽  
Shigeki Kanazawa ◽  
Yutaka Tokuda
Keyword(s):  
Activation Energy ◽  
Low Temperature ◽  
Room Temperature ◽  
Reverse Bias ◽  
Thermal Emission ◽  
Sample Temperature ◽  
Zero Bias ◽  
Type Silicon ◽  
Projected Range ◽  
Hydrogen Implantation

ABSTRACTMetastable defects are discovered in hydrogen-implanted n-type silicon. Hydrogen implantation was performed with the energy of 80 keV to a dose of 2×10 cm- at 109 K. After implantation, the sample temperature was raised to room temperature. DLTS measurements were carried out in the temperature range 80–290 K for fabricated diodes. When the sample is reverse-biased at 10V for 10 min at room temperature and then is cooled down to 80 K, three new peaks labeled EM1, EM2 and EM3 appear around 150, 190 and 240 K, respectively. The introduction of metastable defects is found to be characteristic of low temperature implantation. We have evaluated properties of EM1 in detail. EM1 with thermal emission activation energy of 0.29 eV has a peak in concentration around the depth of 0.64 μ m, which corresponds to the projected range of 80 keV hydrogen. EM1 is regenerated with the reverse bias applied around 270 K and is removed with the zero bias around 220 K.

Analysis of temperature-dependent Schottky barrier parameters of Cu–Au Schottky contacts to n-InP

2012 ◽  
Vol 90 (1) ◽  
pp. 73-81 ◽  
Author(s):  
V. Lakshmi Devi ◽  
I. Jyothi ◽  
V. Rajagopal Reddy
Keyword(s):  
Schottky Barrier ◽  
Barrier Height ◽  
Gaussian Distribution ◽  
Ideality Factor ◽  
Thermionic Emission ◽  
Schottky Contacts ◽  
Temperature Dependent ◽  
Semiconductor Interface ◽  
Zero Bias ◽  
Barrier Heights

In this work, we have investigated the electrical characteristics of Au–Cu–n-InP Schottky contacts by current–voltage (I–V) and capacitance–voltage (C–V) measurements in the temperature range 260–420 K in steps of 20 K. The diode parameters, such as the ideality factor, n, and zero-bias barrier height, Φb0, have been found to be strongly temperature dependent. It has been found that the zero-bias barrier height, Φb0(I–V), increases and the ideality factor, n, decreases with an increase in temperature. The forward I–V characteristics are analyzed on the basis of standard thermionic emission (TE) theory and the assumption of gaussian distribution of barrier heights, due to barrier inhomogeneities that prevail at the metal–semiconductor interface. The zero-bias barrier height Φb0 versus 1/2kT plot has been drawn to obtain the evidence of a gaussian distribution of the barrier heights. The corresponding values are Φb0 = 1.16 eV and σ0 = 159 meV for the mean barrier height and standard deviation, respectively. The modified Richardson plot has given mean barrier height, Φb0, and Richardson constant, A**, as 1.15 eV and 7.34 Acm−2K−2, respectively, which is close to the theoretical value of 9.4 Acm−2K−2. Barrier heights obtained from C–V measurements are higher than those obtained from I–V measurements. This inconsistency between Schottky barrier heights (SBHs) obtained from I–V and C–V measurements was also interpreted. The temperature dependence of the I–V characteristics of the Au–Cu–n-InP Schottky diode has been explained on the basis of TE mechanism with gaussian distribution of the SBHs.

High Temperature I-V and C-V Characteristics of a Al/n-GaAs/In Schottky Barrier Type Device

1995 ◽  
Vol 378 ◽  
Author(s):  
A. Singh ◽  
N. Marcano
Keyword(s):  
Space Charge ◽  
Schottky Barrier ◽  
Barrier Height ◽  
Thermionic Emission ◽  
Electrical Current ◽  
Polished Surface ◽  
Zero Bias ◽  
Thermal Deposition ◽  
Temperature Range ◽  
Barrier Type

AbstractAl/n-GaAs Schottky barrier type diode was fabricated by thermal deposition of Al on chemically etched polished surface of (100) n-GaAs at a pressure of 4×10−6 Torr. Back ohmic contact to n-GaAs was prepared by thermal deposition of In, followed by a 90 min. anneal in Ar atmosphere at 390° C. The C−2 vs V characteristics were quite linear for reverse bias voltages in the range 0-4 V. Over the temperature range 300–360 K, the values of the barrier height and the net carrier density (Nd-Na), obtained from the C−2-V data, were in the range 1.33–1.26 V and 4.3×l0−16-5.0×l0−16 cm−3, respectively. The forward I-V data over the temperature range 300–400 K, indicated that the electrical current across the Al/n-GaAs Schottky junction was transported by the mechanisms of generation-combination (GR) in the space charge, thermionic emission (TE) and ohmic leak current. A value of (1.20±0.04) V for the zero bias barrier height was deduced from the temperature dependence of the TE reverse saturation current. The barrier height deduced from the I-V data was practically independent of temperature. The 20% change in Nd-Na with temperature, obtained from the C-V data, and important contributions of the GR and leak currents to the total forward current, suggested the presence of defect levels in the surface space charge layer in n-GaAs, which may be responsible for the discrepancy in the values of the barrier height obtained from the I-V and C-V data.

Modeling the spectral responsivity of ultraviolet GaN Schottky barrier photodetectors under reverse bias

2015 ◽  
Vol 117 (13) ◽  
pp. 134503 ◽  
Author(s):  
Mahmoud R. M. Atalla ◽  
Zhenyu Jiang ◽  
Jie Liu ◽  
Li Wang ◽  
S. Ashok ◽  
...  
Keyword(s):  
Schottky Barrier ◽  
Reverse Bias ◽  
Spectral Responsivity

Schottky Barrier Diode Fabricated by MOCVD-Grown Epilayer Using Bis-Trimethylsilylmethane Precursor

2008 ◽  
Vol 600-603 ◽  
pp. 971-974
Author(s):  
Ho Keun Song ◽  
Jong Ho Lee ◽  
Myeong Sook Oh ◽  
Jeong Hyun Moon ◽  
Han Seok Seo ◽  
...  
Keyword(s):  
Electrical Properties ◽  
Grain Boundaries ◽  
Schottky Barrier ◽  
Leakage Current ◽  
Reverse Bias ◽  
Schottky Barrier Diode ◽  
High Quality ◽  
Ohmic Behavior ◽  
Leakage Path ◽  
Crystallographic Characteristics

Schottky barrier diode (SBD) was fabricated by MOCVD using bistrimethylsilylmethane (BTMSM, C7H20Si2) precursor. The 4H-SiC substrates which had different crystallographic characteristics were used for the comparison of the crystallinity effect on the electrical properties of the SBDs. From the measurement of the reverse I-V characteristics of the SBDs with micropipes, it is shown that the origin of the main leakage path and early breakdown (or ohmic behavior in reverse bias) in 4H-SiC SBDs is the grain boundaries caused by the inclusions or other defects. The best performance of SBD were shown in the epilayer grown at 1440 oC using high quality substrate, and the breakdown voltage and reverse leakage current were about 450 V and 10-9 A/cm2, respectively.

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