scholarly journals Thermal expansion of alpha and of beta brass between 0 and 600 degrees C, in relation to the mechanical properties of heterogeneous brasses of the Muntz metal type

1919 ◽  
Vol 14 (4) ◽  
pp. 571 ◽  
Author(s):  
P. D. Merica ◽  
L. W. Schad
Metals ◽  
2021 ◽  
Vol 11 (3) ◽  
pp. 513
Author(s):  
Jae Won Kim ◽  
Jae-Deuk Kim ◽  
Jooyoung Cheon ◽  
Changwook Ji

This study observed the effect of filler metal type on mechanical properties of NAB (NiAl-bronze) material fabricated using wire arc additive manufacturing (WAAM) technology. The selection of filler metal type is must consider the field condition, mechanical properties required by customers, and economics. This study analyzed the bead shape for representative two kind of filler metal types use to maintenance and fabricated a two-dimensional bulk NAB material. The cold metal transfer (CMT) mode of gas metal arc welding (GMAW) was used. For a comparison of mechanical properties, the study obtained three specimens per welding direction from the fabricated bulk NAB material. In the tensile test, the NAB material deposited using filler metal wire A showed higher tensile strength and lower elongation (approx. +71 MPa yield strength, +107.1 MPa ultimate tensile strength, −12.4% elongation) than that deposited with filler metal wire B. The reason is that, a mixture of tangled fine α platelets and dense lamellar eutectoid α + κIII structure with β´ phases was observed in the wall made with filler metal wire A. On the other hand, the wall made with filler metal wire B was dominated by coarse α phases and lamellar eutectoid α + κIII structure in between.


1991 ◽  
Vol 6 (7) ◽  
pp. 1498-1501 ◽  
Author(s):  
Paul A. Flinn

Since copper has some advantages relative to aluminum as an interconnection material, it is appropriate to investigate its mechanical properties in order to be prepared in advance for possible problems, such as the cracks and voids that have plagued aluminum interconnect systems. A model previously used to interpret the behavior of aluminum films proves to be, with minor modification, also applicable to copper. Although the thermal expansion of copper is closer to that of silicon and, consequently, the thermally induced strains are smaller, the much larger elastic modulus of copper results in substantially higher stresses. This has implications for the interaction of copper lines with dielectrics.


2018 ◽  
Vol 39 (S3) ◽  
pp. E1821-E1833 ◽  
Author(s):  
Patricia I. Pontón ◽  
Luciana P. Prisco ◽  
Bojan A. Marinkovic

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