scholarly journals Pulse Electrodeposition of Lead-Free Tin-Based Composites for Microelectronic Packaging

10.5772/62036 ◽  
2016 ◽  
Author(s):  
Ashutosh Sharma ◽  
Siddhartha Das ◽  
Karabi Das
Keyword(s):  
Pulse Electrodeposition ◽  
Lead Free ◽  
Microelectronic Packaging

Effect of Current Density on the Nucleation and Growth of Crystal Facets during Pulse Electrodeposition of Sn–Cu Lead-Free Solder

2014 ◽  
Vol 14 (12) ◽  
pp. 6542-6549 ◽  
Author(s):  
Manila Mallik ◽  
Arijit Mitra ◽  
Srijan Sengupta ◽  
Karabi Das ◽  
Rabindra N. Ghosh ◽  
...  
Keyword(s):  
Current Density ◽  
Nucleation And Growth ◽  
Pulse Electrodeposition ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

scholarly journals Effect of Nanoparticles Addition on the Microstructure and Properties of Lead-Free Solders: A Review

2019 ◽  
Vol 9 (10) ◽  
pp. 2044 ◽  
Author(s):  
Peng Zhang ◽  
Songbai Xue ◽  
Jianhao Wang ◽  
Peng Xue ◽  
Sujuan Zhong ◽  
...  
Keyword(s):  
Composite Solder ◽  
High Surface ◽  
Lead Free ◽  
Microelectronic Packaging ◽  
Specific Service ◽  
Service Environment ◽  
Microstructure And Properties ◽  
High Surface Energy ◽  
Lead Free Solders ◽  
Ic Package

With the development of microelectronic packaging and increasingly specific service environment of solder joints, much stricter requirements have been placed on the properties of lead-free solders. On account of small size effect and high surface energy, nanoparticles have been widely used to improve the microstructure and properties of lead-free solders. Therefore, the composite solders bearing nanoparticles have recently attracted wide attention. This article reviewed the recent research on SnAgCu, SnBi, and SnZn composite solder alloys and introduced the effect of nanoparticles on their microstructure, mechanical properties, wettability, and reliability. The mechanism of nanoparticles strengthening was analyzed and summarized. In addition, the shortcomings and future development trends of nanoparticle-reinforced lead-free solders were discussed, which is expected to provide some theoretical reference for the application of these composite solder in 3D IC package.

scholarly journals Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data

2014 ◽  
Vol 2014 ◽  
pp. 1-11 ◽  
Author(s):  
Jinhua Mi ◽  
Yan-Feng Li ◽  
Yuan-Jian Yang ◽  
Weiwen Peng ◽  
Hong-Zhong Huang
Keyword(s):  
Solder Joint ◽  
Thermal Cycling ◽  
Censored Data ◽  
Life Prediction ◽  
Ball Grid Array ◽  
Lead Free ◽  
Microelectronic Packaging ◽  
Type I ◽  
Lead Free Solder ◽  
Free Solder

Because solder joint interconnections are the weaknesses of microelectronic packaging, their reliability has great influence on the reliability of the entire packaging structure. Based on an accelerated life test the reliability assessment and life prediction of lead-free solder joints using Weibull distribution are investigated. The type-I interval censored lifetime data were collected from a thermal cycling test, which was implemented on microelectronic packaging with lead-free ball grid array (BGA) and fine-pitch ball grid array (FBGA) interconnection structures. The number of cycles to failure of lead-free solder joints is predicted by using a modified Engelmaier fatigue life model and a type-I censored data processing method. Then, the Pan model is employed to calculate the acceleration factor of this test. A comparison of life predictions between the proposed method and the ones calculated directly by Matlab and Minitab is conducted to demonstrate the practicability and effectiveness of the proposed method. At last, failure analysis and microstructure evolution of lead-free solders are carried out to provide useful guidance for the regular maintenance, replacement of substructure, and subsequent processing of electronic products.

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