scholarly journals Effect of Nanoparticles Addition on the Microstructure and Properties of Lead-Free Solders: A Review

2019 ◽  
Vol 9 (10) ◽  
pp. 2044 ◽  
Author(s):  
Peng Zhang ◽  
Songbai Xue ◽  
Jianhao Wang ◽  
Peng Xue ◽  
Sujuan Zhong ◽  
...  
Keyword(s):  
Composite Solder ◽  
High Surface ◽  
Lead Free ◽  
Microelectronic Packaging ◽  
Specific Service ◽  
Service Environment ◽  
Microstructure And Properties ◽  
High Surface Energy ◽  
Lead Free Solders ◽  
Ic Package

With the development of microelectronic packaging and increasingly specific service environment of solder joints, much stricter requirements have been placed on the properties of lead-free solders. On account of small size effect and high surface energy, nanoparticles have been widely used to improve the microstructure and properties of lead-free solders. Therefore, the composite solders bearing nanoparticles have recently attracted wide attention. This article reviewed the recent research on SnAgCu, SnBi, and SnZn composite solder alloys and introduced the effect of nanoparticles on their microstructure, mechanical properties, wettability, and reliability. The mechanism of nanoparticles strengthening was analyzed and summarized. In addition, the shortcomings and future development trends of nanoparticle-reinforced lead-free solders were discussed, which is expected to provide some theoretical reference for the application of these composite solder in 3D IC package.

scholarly journals Microstructures and Properties of Sn2.5Ag0.7Cu0.1RE Composite Solders Reinforced with Cu-Coated Graphene Nanosheets Synthesized by Pyrolysis

Materials ◽  
2019 ◽  
Vol 12 (2) ◽  
pp. 289 ◽  
Author(s):  
Meng Zhang ◽  
Ke-ke Zhang ◽  
Fu-peng Huo ◽  
Hui-gai Wang ◽  
Yang Wang
Keyword(s):  
Composite Solder ◽  
Load Transfer ◽  
Graphene Nanosheets ◽  
Eutectic Phase ◽  
Lead Free ◽  
Cu Nanoparticles ◽  
Mean Size ◽  
Free Solder ◽  
Lead Free Solders ◽  
Phase Proportion

Composite solder is a promising route to improve the properties and reliability of Sn-based lead-free solder. In this study, Cu-coated graphene nanosheets (Cu-GNSs) were synthesized using pyrolysis. Cu-GNSs reinforced Sn2.5Ag0.7Cu0.1RE composite lead-free solders were prepared via powder metallurgy. The size, distribution, and adsorption type of Cu nanoparticles on the GNSs were studied. The relation of the Cu-GNSs content and microstructure to the physical, wettability, and mechanical properties of composite solders was discussed. The results show that Cu nanoparticles (with a mean size of 13 nm) present uniform distribution and effective chemisorptions on the GNS. Microstructural evolution of composite solders is dependent on the addition of Cu-GNSs. With increasing Cu-GNSs addition, β-Sn grains become finer and the eutectic phase proportion becomes larger, while the morphology of the eutectic phase transforms from dispersion to network-type. The improvement of the tensile strength of the composite solder can be attributed to grain refinement and load transfer. While the existence of Cu-GNSs can effectively improve the wettability and slightly change the melting point, it can also lead to the decline of elongation and electrical conductivity of the composite solder.

Non-Metal Reinforced Lead-Free Composite Solder Fabrication Methods and its Reinforcing Effects to the Suppression of Intermetallic Formation: Short Review

2013 ◽  
Vol 421 ◽  
pp. 260-266 ◽  
Author(s):  
M.A.A. Mohd Salleh ◽  
Stuart McDonald ◽  
Kazuhiro Nogita
Keyword(s):  
Intermetallic Compound ◽  
Solder Joint ◽  
Composite Solder ◽  
Short Review ◽  
Lead Free ◽  
Nanoparticle Size ◽  
Intermetallic Formation ◽  
Reinforcing Effects ◽  
Lead Free Solders

To increase the solder joint robustness, researches and studies on composite solder carried out by many researchers in an effort to develop viable lead-free solders which can replace the conventional lead-based solders.This paper reviews the fabrication processes of the lead-free composite solder and its non-metal reinforcing effects to the suppression of intermetallic formation. Most researchers using different solder fabrication methods have found that byadditions of non-metal reinforcement from micron up to nanoparticle size had suppressed the intermetallic compound formations of lead-free composite solders.

scholarly journals Research Status of Evolution of Microstructure and Properties of Sn-Based Lead-Free Composite Solder Alloys

2020 ◽  
Vol 2020 ◽  
pp. 1-25
Author(s):  
Shuai Li ◽  
Xingxing Wang ◽  
Zhongying Liu ◽  
Feng Mao ◽  
Yongtao Jiu ◽  
...  
Keyword(s):  
Composite Solder ◽  
Lead Free ◽  
Research Progress ◽  
The Novel ◽  
Solder Alloys ◽  
New Novel ◽  
Microstructure Morphology ◽  
Evolution Of Microstructure ◽  
Lead Free Solders ◽  
Recent Research Progress

With the miniaturization of solder joints and deterioration of serving environment, much effort had been taken to improve the properties of Sn-based lead-free solders. And the fabrication of Sn-based lead-free composite solder alloys by the addition of nanoparticles is one of the effective ways to enhance the properties. In this paper, the recent research progress on the Sn-based lead-free composite solder alloys is reviewed by summarizing the relevant results in representative ones of Sn-Ag-Cu (SAC), Sn-Bi, and other multielement lead-free composite solder alloys. Specifically speaking, the effect of the added nanoparticles on the evolution of wettability, microstructure morphology, and mechanical properties of Sn-based lead-free composite solder alloys are summarized. It is hoped that this paper could supply some beneficial suggestions in developing the novel Sn-based lead-free composite solder alloys. Additionally, the existed issues and future development trends in the exploitation of new novel Sn-based lead-free composite solder alloys are proposed.

Microstructure and properties of Sn-3.8Ag-0.7Cu-xCe lead-free solders with liquid-liquid structure transition and Ce addition

2019 ◽  
Vol 6 (11) ◽  
pp. 1165b8 ◽  
Author(s):  
Liu Xiaoguang ◽  
Jiang Xiaoming ◽  
Cao Lichao ◽  
Zhai Wengang ◽  
Li Xianfen ◽  
...  
Keyword(s):  
Liquid Structure ◽  
Lead Free ◽  
Structure Transition ◽  
Microstructure And Properties ◽  
Lead Free Solders
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