scholarly journals Matrix-Dependent Strain Distributions of Au and Ag Nanoparticles in a Metal-Oxide-Semiconductor-Based Nonvolatile Memory Device

10.5772/61395 ◽  
2015 ◽  
Vol 5 ◽  
pp. 27 ◽  
Author(s):  
Honghua Huang ◽  
Ying Zhang ◽  
Wenyan Wei ◽  
Ting Yu ◽  
Xingfang Luo ◽  
...  
2002 ◽  
Vol 80 (18) ◽  
pp. 3421-3423 ◽  
Author(s):  
Sima Dimitrijev ◽  
Kuan Yew Cheong ◽  
Jisheng Han ◽  
H. Barry Harrison

2013 ◽  
Vol 114 (8) ◽  
pp. 084509 ◽  
Author(s):  
Souvik Kundu ◽  
Sankara Rao Gollu ◽  
Ramakant Sharma ◽  
Nripendra. N Halder ◽  
Pranab Biswas ◽  
...  

2015 ◽  
Vol 24 (03n04) ◽  
pp. 1550003 ◽  
Author(s):  
Murali Lingalugari ◽  
Pik-Yiu Chan ◽  
Evan Heller ◽  
Faquir Jain

In this paper, we are experimentally demonstrating the multi-bit storage of a nonvolatile memory device with cladded quantum dots as the floating gate. These quantum dot nonvolatile memory (QDNVM) devices were fabricated by using standard complementary metal-oxide-semiconductor (CMOS) process. The quantum dots in the floating gate region assembled using site-specific selfassembly (SSA) technique. Quantum mechanical simulations of this device structure are also presented. The experimental results show that the voltage separation between the bits was 0.15V and the voltage pulses required to write these bits were 11.7V and 30V. These devices demonstrated the larger write voltage separation between the bits.


2012 ◽  
Vol 26 (31) ◽  
pp. 1250191 ◽  
Author(s):  
ALI BAHARI ◽  
REZA GHOLIPUR

To investigate characterization of Zr x La 1-x O y nanocrystallites as a buffer oxide in forming the metal-oxide-semiconductor field effect transistors (MOSFETs) structure, we synthesized Zr x La 1-x O y nanocrystallites by sol–gel method. Moreover, from the solution prepared, thin films on silicon wafer substrates have been realized by "dip-coating" with a pulling out speed of 5 cm min -1. The structure, morphology, electrical properties of thin film was examined by X-ray diffraction (XRD), scanning electron microscopy (SEM), atomic force microscopy (AFM) and transmission electron microscopy (TEM) techniques. Electrical property characterization was performed with metal-oxide-semiconductor (MOS) structures through capacitance–voltage (C–V) and current density–voltage (J–V) measurements. The leakage current density was below 1.0 ×10-6 A/cm 2 at 1 MV/cm.


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