scholarly journals Heuristic Analysis Application for Magnesium Alloys Properties Improvement

Author(s):  
Tomasz Tański ◽  
Krzysztof Labisz ◽  
Anna Dobrzańska-Danikiewicz
1994 ◽  
Vol 4 (10) ◽  
pp. 1999-2012 ◽  
Author(s):  
Nabil Derbel ◽  
Mohamed B.A. Kamoun ◽  
Michel Poloujadoff

2010 ◽  
Vol 41 (01) ◽  
Author(s):  
HP Müller ◽  
A Unrath ◽  
A Riecker ◽  
AC Ludolph ◽  
J Kassubek

Author(s):  
Kulwant Singh ◽  
Gurbhinder Singh ◽  
Harmeet Singh

The weight reduction concept is most effective to reduce the emissions of greenhouse gases from vehicles, which also improves fuel efficiency. Amongst lightweight materials, magnesium alloys are attractive to the automotive sector as a structural material. Welding feasibility of magnesium alloys acts as an influential role in its usage for lightweight prospects. Friction stir welding (FSW) is an appropriate technique as compared to other welding techniques to join magnesium alloys. Field of friction stir welding is emerging in the current scenario. The friction stir welding technique has been selected to weld AZ91 magnesium alloys in the current research work. The microstructure and mechanical characteristics of the produced FSW butt joints have been investigated. Further, the influence of post welding heat treatment (at 260 °C for 1 h) on these properties has also been examined. Post welding heat treatment (PWHT) resulted in the improvement of the grain structure of weld zones which affected the mechanical performance of the joints. After heat treatment, the tensile strength and elongation of the joint increased by 12.6 % and 31.9 % respectively. It is proven that after PWHT, the microhardness of the stir zone reduced and a comparatively smoothened microhardness profile of the FSW joint obtained. No considerable variation in the location of the tensile fracture was witnessed after PWHT. The results show that the impact toughness of the weld joints further decreases after post welding heat treatment.


2018 ◽  
pp. 27-31
Author(s):  
I.A. Gvozdkov ◽  
◽  
V.A. Belyaev ◽  
S.N. Potapov ◽  
V.N. Verbetsky ◽  
...  
Keyword(s):  

2013 ◽  
Vol 3 (1) ◽  
pp. 45-50
Author(s):  
Dwi Dian Praptanto ◽  
Kurnia Herlina Dewi ◽  
Bosman Sidebang

The purpose of this study is to examine the effect of drying time in weight and water content, combination effect of drying time and size of the material, and consumer acceptance to the product in the wet processing of chili blocks production. Method used in the research is completely randomized design (CRD) with two factorials are material size and drying time. Data were analyzed using ANOVA and further analysis using DMRT at 5% significance level. Organoleptic test result was analyzed using the Kruskal-Wallis and Tukey test for further analysis. Application of the equal drying time to two different size of material: rough and finest block chili, showed the result that water content of the rough block chili is lower than the finest block chilli. Application of the different drying time duration to the same size of chili showed the lower water content with increasing duration of drying time. The water content of the material tends to decrease with increasing duration of drying time. The level of consumer’s preferences to the product of wet processing of chili blocks production is equal for scents, but it’s different for color, texture and overall preferences.


2015 ◽  
Vol 57 (2) ◽  
pp. 126-130
Author(s):  
Dorothea Amberger ◽  
Tina Blickle ◽  
Heinz Werner Höppel ◽  
Mathias Göken

Author(s):  
Bilal Abd-AlRahman ◽  
Corey Lewis ◽  
Todd Simons

Abstract A failure analysis application utilizing scanning acoustic microscopy (SAM) and time domain reflectometry (TDR) for failure analysis has been developed to isolate broken stitch bonds in thin shrink small outline package (TSSOP) devices. Open circuit failures have occurred in this package due to excessive bending of the leads during assembly. The tools and their specific application to this technique as well as the limitations of C-SAM, TDR and radiographic analyses are discussed. By coupling C-SAM and TDR, a failure analyst can confidently determine whether the cause of an open circuit in a TSSOP package is located at the stitch bond. The root cause of the failure was determined to be abnormal mechanical stress placed on the pins during the lead forming operation. While C-SAM and TDR had proven useful in the analysis of TSSOP packages, it can potentially be expanded to other wire-bonded packages.


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