scholarly journals Infrared Spectroscopic Ellipsometry for Ion-Implanted Silicon Wafers

Author(s):  
Li ◽  
Xianming Liu
2010 ◽  
Vol 59 (3) ◽  
pp. 1632
Author(s):  
Liu Xian-Ming ◽  
Li Bin-Cheng ◽  
Gao Wei-Dong ◽  
Han Yan-Ling

1997 ◽  
Author(s):  
Takuya Sakamoto ◽  
Hiroyuki Nakano ◽  
Yoshinari Kamakura ◽  
Kenji Taniguchi ◽  
Kenji Nishi ◽  
...  

2014 ◽  
Vol 98 ◽  
pp. 7-13 ◽  
Author(s):  
M. Šiljegović ◽  
Z.M. Kačarević-Popović ◽  
M. Stchakovsky ◽  
A.N. Radosavljević ◽  
S. Korica ◽  
...  

Sensors ◽  
2019 ◽  
Vol 19 (9) ◽  
pp. 2073 ◽  
Author(s):  
Kazunari Kurita ◽  
Takeshi Kadono ◽  
Satoshi Shigematsu ◽  
Ryo Hirose ◽  
Ryosuke Okuyama ◽  
...  

We developed silicon epitaxial wafers with high gettering capability by using hydrocarbon–molecular–ion implantation. These wafers also have the effect of hydrogen passivation on process-induced defects and a barrier to out-diffusion of oxygen of the Czochralski silicon (CZ) substrate bulk during Complementary metal-oxide-semiconductor (CMOS) device fabrication processes. We evaluated the electrical device performance of CMOS image sensor fabricated on this type of wafer by using dark current spectroscopy. We found fewer white spot defects compared with those of intrinsic gettering (IG) silicon wafers. We believe that these hydrocarbon–molecular–ion–implanted silicon epitaxial wafers will improve the device performance of CMOS image sensors.


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