New, High Efficiency, Low Cost Liquid Heat Exchanger for Cooling Power Semiconductor Devices

2001 ◽  
Author(s):  
Clifford C. Wright ◽  
Lloyd F. Wright
Keyword(s):  
Heat Exchanger ◽  
High Efficiency ◽  
Low Cost ◽  
Semiconductor Devices ◽  
Cooling Power ◽  
Power Semiconductor ◽  
Power Semiconductor Devices ◽  
Liquid Heat

scholarly journals Non-Dissipative Snubber Circuit Based SEPIC Converter for High Static Gain Applications

2020 ◽  
Vol 8 (6) ◽  
pp. 754-757
Keyword(s):  
High Efficiency ◽  
Semiconductor Device ◽  
Semiconductor Devices ◽  
Sudden Change ◽  
The Other ◽  
Efficient Operation ◽  
Power Semiconductor ◽  
Turn On ◽  
Power Semiconductor Devices ◽  
Snubber Circuit

In this paper different non-dissipative snubber circuits in which RCD snubber circuit, CD snubber circuit, LCD snubber circuit and proposed LCD snubber circuit are implemented in SEPIC converter to obtain high static gain. The snubber circuit is used for the protection of the power semiconductor devices. The requirement of high static gain is necessary in different applications of dc-dc converters, so that efficient operation of the system can be obtained. The basic idea of the snubber circuit used in this paper is to reduce the turn-on and turn-off losses at the time of switching processes. For this purpose, inductor and capacitor combination is required so that during turn-on process, sudden change in current through semiconductor device which is used as a switch, can be reduced. Similarly, during turn-off process, sudden change in voltage across switch can be minimized. Here, different snubber circuit based SEPIC converters are analyzed with the help of MATLAB simulink and results of output voltages and currents are obtained. The results are summarized which clearly shows that the proposed SEPIC converter has high static gain in comparison of the others topologies. Hence non-dissipative snubber circuit based SEPIC converter provides high efficiency than the other modifications in SEPIC converter.

Residual Voids in Degassing Process of Encapsulation Gel for Power Semiconductor Devices

2014 ◽  
Vol 134 (6) ◽  
pp. 432-433
Author(s):  
Masahiro Sato ◽  
Akiko Kumada ◽  
Kunihiko Hidaka ◽  
Keisuke Yamashiro ◽  
Yuji Hayase ◽  
...  
Keyword(s):  
Semiconductor Devices ◽  
Power Semiconductor ◽  
Power Semiconductor Devices
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