scholarly journals Molded Interconnect Devices in Japan

2020 ◽  
Vol 71 (4) ◽  
pp. 286-287
Author(s):  
Norikazu TSUKADA
Keyword(s):  
Molded Interconnect Devices

MEMS Packaging with 3D-MID Technology

2011 ◽  
Vol 2011 (1) ◽  
pp. 000484-000490
Author(s):  
Nouhad Bachnak
Keyword(s):  
Mobile Phone ◽  
Electronic Circuit ◽  
Three Dimensional ◽  
Industrial Technology ◽  
Mems Packaging ◽  
Optical Circuits ◽  
Molded Interconnect Devices ◽  
Function Density

3D-MID (three dimensional molded interconnect devices) technology (which is already broadly used for 3D-MID mobile phone antennas) is also used for MEMS packaging and sensors applications. 3D-MID allows miniaturization by the integration of mechanical and electronic functions in one part. The 3D electronic circuit is integrated into a 3D plastic casing or carrier, making it possible to achieve much more compact construction and much greater function density. More and more applications involving electrical and electro-optical circuits are made using 3D-MID technology. Typical 3D-MID applications are: Sensor packaging, LED packaging, security casings, RFIDs and Antennas. The main areas of application are in the automotive, medical, industrial technology and telecommunications sectors.

Novel Approach for the Implementation of 3D-MID Compatible Routing Functionalities into Computer-Aided Design Tools

2014 ◽  
Vol 1038 ◽  
pp. 11-17 ◽  
Author(s):  
Jochen Zeitler ◽  
Bernhard Götze ◽  
Christian Fischer ◽  
Jörg Franke
Keyword(s):  
Computer Aided Design ◽  
Routing Algorithms ◽  
Cad Tools ◽  
Novel Approach ◽  
Attractive Option ◽  
High Standards ◽  
Aided Design ◽  
Electrical Components ◽  
Development Methods ◽  
Molded Interconnect Devices

Molded Interconnect Devices can be considered as attractive option for the integration of electronic functions into mechanical systems. While development methods and procedures reached high standards, CAD tools still drag behind. This paper focusses the necessary software structure for implementing of automated routing algorithms or other MID specific extensions into CAD tools. An innovative three-layer model will be introduced and explained in detail. This paper also describes a method for mapping electrical components on unfolded surfaces for the further implementation of the automated routing algorithms.

A Multilayer Process for the Connection of Fine-Pitch-Devices on Molded Interconnect Devices (MIDs)

2008 ◽  
Author(s):  
Thomas Leneke ◽  
Soeren Hirsch ◽  
Bertram Schmidt
Keyword(s):  
Flip Chip ◽  
Three Dimensional ◽  
Area Array ◽  
Fine Pitch ◽  
Key Factor ◽  
Functional Features ◽  
Escape Routing ◽  
Electrical Connections ◽  
Molded Interconnect Devices ◽  
Metallization Process

A key factor for the propagation of technological applications is the miniaturization of respective components, subsystems and overall systems. To meet future requirements in such size decreasing environments the packaging and mounting technology needs new impulses. 3D-MIDs (three-dimensional molded interconnect devices) exhibit a high potential for smart packages and assemblies. A three-dimensional shaped circuit carrier allows the integration of various functional features (e.g. electrical connections, housing, thermal management, mechanical support). This combination makes a further system shrinking possible. Yet, the mounting of high-density area-array fine-pitch packaged semiconductors (BGA, CSP, MCM) or bare dies to 3D-MIDs is problematic. The lack of a three-dimensional multilayer technology makes a collision free escape routing for devices with a high I/O count difficult. Therefore a new 3D-MID multilayer process was developed and combined with an established 3D-MID metallization process. A demonstrator with three metallization layers, capable, e.g., for flip-chip mounting of area-array packages, is fabricated. The multilayer structure of the demonstrator is investigated with respect to the mechanical and electrical behavior.

Design and Simulation of Molded Interconnect Devices with Two Shot Molding

2011 ◽  
Vol 295-297 ◽  
pp. 1651-1655
Author(s):  
Yong Zhuo ◽  
Juan Peng ◽  
Yan Jun Wu
Keyword(s):  
Optimal Design ◽  
Three Dimensional ◽  
Manufacturing Processes ◽  
Specific Design ◽  
Product Model ◽  
Simulation Tools ◽  
Integrated Environment ◽  
Feature Technology ◽  
Effective Design ◽  
Molded Interconnect Devices

Three Dimensional Molded Interconnect Devices (3D-MID) has enormous potential for rationalization in both manufacturing process and the freedom to design of mechatronic products. Two shot molding is one of the most important and commonly used methods among the various MID manufacturing processes. Currently, there is a lack of effective design and simulation tools that can be used for MID with two shot molding. In this paper, an integrated product model using feature technology, some MID-specific design functions, and one special interface based on the API of Moldflow Plastics Insight (MPI) and the COM-Technology are presented. These developed product model, functions and interface increase the efficiency of the MID design process, and the design and simulation integrated environment also towards the rational and optimal design of MID products with two shot molding.

scholarly journals A fast and flexible method for manufacturing 3D molded interconnect devices by the use of a rapid prototyping technology

2010 ◽  
Vol 5 ◽  
pp. 561-572 ◽  
Author(s):  
P. Amend ◽  
C. Pscherer ◽  
T. Rechtenwald ◽  
T. Frick ◽  
M. Schmidt
Keyword(s):  
Rapid Prototyping ◽  
Molded Interconnect Devices
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