Three-Dimensional Molded Interconnect Devices (3D-MID)
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Published By Carl Hanser Verlag Gmbh & Co. KG

9781569905517, 9781569905524
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

MID Prototyping

2014 ◽  
pp. 201-215
Author(s):  
W. Eberhardt ◽  
P. Buckmüller ◽  
H. Kück

Integrative Development of MID

2014 ◽  
pp. 217-273
Author(s):  
C. Jürgenhake ◽  
T. Schierbaum ◽  
C. Fischer ◽  
R. Dumitrescu
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