Thermal Power of Mobile Application Processor

2012 ◽  
Vol 2012 (1) ◽  
pp. 000866-000872
Author(s):  
Heung Kyu Kwon ◽  
Jugnwook Hwang ◽  
Hyunkwon Chung ◽  
Munsik Kang ◽  
Hyun Duk Cho ◽  
...  
Keyword(s):  
Mobile Application ◽  
Heat Dissipation ◽  
Thermal Power ◽  
Low Frequency ◽  
Critical Issue ◽  
Junction Temperature ◽  
Processing Unit ◽  
Power Performance ◽  
Central Processing ◽  
Application Processor

Until recently, heat dissipation performance of the conventional mobile AP (Application Processor) and mobile phone hasen't been a critical issue because the level of heat generated from a low-frequency, single core AP was insignificant. However, as the mobile AP consumes more power by adopting high frequency multi-core CPU (Central Processing Unit) and GPU (Graphic Processing Unit), the heat dissipation performance of its application set, such as smart phone and tablet PC (Personal Computer) became a critical issue. The conventional stand alone type applications sets such as desktop PCs and servers could afford additional thermal management tools such as heat sink, heat pipe and cooling fan to improve thermal performances. On the contrary, the limited inside space of mobile set doesn't allow the use of conventional cooling methods so that the feasible thermal solutions for the mobile AP and mobile sets are limited. In addition, since mobile set is normally in contact with human skin during its operation, the criterion, Tcsmax (Maximum Case Skin Temperature) which determines the thermal power per-formance of the mobile set is different from the conventional criterion, Tjmax (Maximum Junction Temperature) of CPU. Therefore, the thermal performance of mobile AP and its mobile set should be carefully determined to satisfy the Tcsmax by considering AP operation power and heat dissipating performance of the its application set. This paper shows how to define the thermal power performance of mobile AP and its mobile application set and which technologies are important for future mobile AP and its application sets.

Experimental Analysis for Optimization of Thermal Performance of a Server in Single Phase Immersion Cooling

2019 ◽  
Author(s):  
Pravin A. Shinde ◽  
Pratik V. Bansode ◽  
Satyam Saini ◽  
Rajesh Kasukurthy ◽  
Tushar Chauhan ◽  
...  
Keyword(s):  
Power Consumption ◽  
Thermal Performance ◽  
Heat Dissipation ◽  
Operating Cost ◽  
Heat Removal ◽  
Dielectric Fluid ◽  
Inlet Temperature ◽  
Processing Unit ◽  
Central Processing ◽  
Immersion Cooling

Abstract Liquid immersion cooling of servers in synthetic dielectric fluids is an emerging technology which offers significant cooling energy savings and increased power densities for data centers. A noteworthy advantage of using immersion cooling is high heat dissipation capacity which is roughly 1200 times greater than air. Other advantages of dielectric fluid immersion cooling include high rack density, better server performance, even temperature profile, reduction in noise etc. The enhanced thermal properties of oil lead to the considerable savings in both upfront and operating cost over traditional methods. In this study, a server is completely submerged in a synthetic dielectric fluid. Experiments are conducted to observe the effects of varying the volumetric flow rate and oil inlet temperature on thermal performance and power consumption of the server. Various parameters like total server power consumption, the temperature of all heat generating components like Central Processing Unit (CPU), Dual in Line Memory Module (DIMM), input/output hub (IOH) chip, Platform Controller Hub (PCH), Network Interface Controller (NIC) are measured at steady state. Since this is an air-cooled server, the results obtained from the experiments will help in proposing better heat removal strategies like heat sink optimization, better ducting and server architecture. Assessment has been made on the effect of thermal shadowing caused by the two CPUs on the nearby components like DIMMs and PCH.

scholarly journals Central Processing Unit Binary Cooling System using Tetrafluoroethane as Refrigerant

2019 ◽  
Vol 9 (2) ◽  
pp. 1607-1612
Keyword(s):  
Performance Index ◽  
Heat Dissipation ◽  
Cooling System ◽  
Electronic Devices ◽  
Processing Unit ◽  
Vapor Compression ◽  
Refrigeration System ◽  
Desktop Computer ◽  
Central Processing ◽  
Vapor Compression Refrigeration

Electronic devices and instruments generate heat that can cause serious damage and low efficiency towards its components. The heat that the different electronic elements and components emit can decrease both efficiency and life capacity of the device. And with the increase of use of electronic devices in industries and processes, heat dissipation in electronic devices should be taken into strict consideration. This study aims to develop a cooling system under vapor compression refrigeration system. The prototype fabricated was designed for the cooling system of two Central Processing Units of desktop computer which can be as good equivalent for the electronic devices in industries. Though ventilation was present in the processing units, certain condition such as condition in surroundings can be of great help to improve the device efficiency. This study also aims to analyze the CPU’s efficiency in relation to lowering ventilation temperatures. The vapor compression refrigeration system will be the main device used for lowering and maintaining a suitable temperature inside the CPU casing. The system works like a centralized air-conditioning system wherein the air from the surroundings will be cooled down by the evaporator in the vapor compression refrigeration system. The cooled air will then be delivered to the CPU through the installed air ducting connections. The recording of CPU’s efficiency is provided by the installed software. It also measures the air conditioned parameters and computation of the CPU power consumption. The results from the test and the analysis of the gathered data showed that 165 watts of heat dissipated was removed by the cooling system and the CPU performance index rose up from 424 to 446 with a discharge air temperature of 29.67 oC. Based from the result, the fabricated binary cooling system is efficient enough to increase the performance index of the CPU and absorbing heat dissipated by the device

Perangkat keras komputer

2020 ◽  
Author(s):  
Roudati jannah
Keyword(s):  
Data Storage ◽  
Central Processing Unit ◽  
External Memory ◽  
Storage Device ◽  
Input Device ◽  
Processing Unit ◽  
Central Processing ◽  
Output Device

Perangkat keras komputer adalah bagian dari sistem komputer sebagai perangkat yang dapat diraba, dilihat secara fisik, dan bertindak untuk menjalankan instruksi dari perangkat lunak (software). Perangkat keras komputer juga disebut dengan hardware. Hardware berperan secara menyeluruh terhadap kinerja suatu sistem komputer. Prinsipnya sistem komputer selalu memiliki perangkat keras masukan (input/input device system) – perangkat keras premprosesan (processing/central processing unit) – perangkat keras luaran (output/output device system) – perangkat tambahan yang sifatnya opsional (peripheral) dan tempat penyimpanan data (storage device system/external memory).

CENTRAL PROCESSING UNIT (CPU)

2020 ◽  
Author(s):  
Ika Milia wahyunu Siregar
Keyword(s):  
Processing System ◽  
Central Processing Unit ◽  
Processing Unit ◽  
Central Processing

Perkembangan IT di dunia sangat pesat, mulai dari perkembangan sofware hingga hardware. Teknologi sekarang telah mendominasi sebagian besar di permukaan bumi ini. Karena semakin cepatnya perkembangan Teknologi, kita sebagai pengguna bisa ketinggalan informasi mengenai teknologi baru apabila kita tidak up to date dalam pengetahuan teknologi ini. Hal itu dapat membuat kita mudah tergiur dan tertipu dengan berbagai iklan teknologi tanpa memikirkan sisi negatifnya. Sebagai pengguna dari komputer, kita sebaiknya tahu seputar mengenai komponen-komponen komputer. Komputer adalah serangkaian mesin elektronik yang terdiri dari jutaan komponen yang dapat saling bekerja sama, serta membentuk sebuah sistem kerja yang rapi dan teliti. Sistem ini kemudian digunakan untuk dapat melaksanakan pekerjaan secara otomatis, berdasarkan instruksi (program) yang diberikan kepadanya. Istilah Hardware komputer atau perangkat keras komputer, merupakan benda yang secara fisik dapat dipegang, dipindahkan dan dilihat. Central Processing System/ Central Processing Unit (CPU) adalah salah satu jenis perangkat keras yang berfungsi sebagai tempat untuk pengolahan data atau juga dapat dikatakan sebagai otak dari segala aktivitas pengolahan seperti penghitungan, pengurutan, pencarian, penulisan, pembacaan dan sebagainya.

Perangkat lunak komputer

2020 ◽  
Author(s):  
Intan khadijah simatupang
Keyword(s):  
Data Storage ◽  
Central Processing Unit ◽  
External Memory ◽  
Storage Device ◽  
Input Device ◽  
Processing Unit ◽  
Central Processing ◽  
Output Device

Komputer adalah serangkaian mesin elektronik yang terdiri dari jutaan komponen yang dapat saling bekerja sama, serta membentuk sebuah sistem kerja yang rapi dan teliti. Sistem ini kemudian digunakan untuk dapat melaksanakan pekerjaan secara otomatis, berdasarkan instruksi (program) yang diberikan kepadanya. Istilah Hardware computer atau perangkat keras komputer, merupakan benda yang secara fisik dapat dipegang, dipindahkan dan dilihat. Software komputer atau perangkat lunak komputer merupakan kumpulan instruksi (program/prosedur) untuk dapat melaksanakan pekerjaan secara otomatis dengan cara mengolah atau memproses kumpulan instruksi (data) yang diberikan. Pada prinsipnya sistem komputer selalu memiliki perangkat keras masukan (input/input device system) – perangkat keras pemprosesan (processing/ central processing unit) – perangkat keras keluaran (output/output device system), perangkat tambahan yang sifatnya opsional (peripheral) dan tempat penyimpanan data (Storage device system/external memory).

PERANGKAT KERAS ( HARDWARE ) PADA KOMPUTER

2020 ◽  
Author(s):  
Siti Kumala Dewi
Keyword(s):  
Processing System ◽  
Central Processing Unit ◽  
Input Device ◽  
Processing Unit ◽  
Central Processing ◽  
Output Device ◽  
System P ◽  
System 2

Perangkat keras komputer adalah bagian dari sistem komputer sebagai perangkat yang dapat diraba, dilihat secara fisik, dan bertindak untuk menjalankan instruksi dari perangkat lunak (software). Perangkat keras komputer juga disebut dengan hardware. Hardware berperan secara menyeluruh terhadap kinerja suatu sistem komputer. Berdasarkan fungsinya, perangkat keras terbagi menjadi :1.Sistem Perangkat Keras Masukan (Input Device System )2.Sistem Pemrosesan ( Central Processing System/ Central Processing Unit(CPU)3.Sistem Perangkat Keras Keluaran ( Output Device System )4.Sistem Perangkat Keras Tambahan (Peripheral/Accessories Device System)

scholarly journals Numerical simulation of flattened heat pipe with double heat sources for CPU and GPU cooling application in laptop computers

2020 ◽  
Author(s):  
Wisoot Sanhan ◽  
Kambiz Vafai ◽  
Niti Kammuang-Lue ◽  
Pradit Terdtoon ◽  
Phrut Sakulchangsatjatai
Keyword(s):  
Experimental Data ◽  
Heat Pipe ◽  
Graphics Processing Unit ◽  
Processing Unit ◽  
Heat Sources ◽  
Final Thickness ◽  
Laptop Computers ◽  
Central Processing ◽  
Graphics Processing ◽  
Good Agreement

Abstract An investigation of the effect of the thermal performance of the flattened heat pipe on its double heat sources acting as central processing unit and graphics processing unit in laptop computers is presented in this work. A finite element method is used for predicting the flattening effect of the heat pipe. The cylindrical heat pipe with a diameter of 6 mm and the total length of 200 mm is flattened into three final thicknesses of 2, 3, and 4 mm. The heat pipe is placed under a horizontal configuration and heated with heater 1 and heater 2, 40 W in combination. The numerical model shows good agreement compared with the experimental data with the standard deviation of 1.85%. The results also show that flattening the cylindrical heat pipe to 66.7 and 41.7% of its original diameter could reduce its normalized thermal resistance by 5.2%. The optimized final thickness or the best design final thickness for the heat pipe is found to be 2.5 mm.

ILIS--An integrated laboratory information system. I. Biochemistry and hematology.

1982 ◽  
Vol 28 (2) ◽  
pp. 271-276 ◽  
Author(s):  
S U Deshpande
Keyword(s):  
Medical Records ◽  
Data Entry ◽  
Large Data ◽  
Work Load ◽  
Processing Unit ◽  
Patient Identification ◽  
Central Processing ◽  
Cathode Ray Tubes ◽  
Clinical Laboratories ◽  
On Line

Abstract IBM System 34 (central processing unit, 128 kilobytes; fixed disks, 128.4 megabytes) with seven cathode-ray tubes has been used by our clinical laboratories for the last 30 months. All data-entry programs are in a conversational mode, for on-line corrections of possible errors in patient identification and results. Daily reports are removed from the medical records after temporary and permanent cumulative weekly reports are received, which keep a three-month track of the results. The main advantages of the system are: (a) the increasing laboratory work load can be handled with the same staff; (b) the volume of the medical record files on the patients is decreased; (c) an easily retrievable large data base of results is formed for research purposes; (d) faster billing; and (e) the computer system is run without engaging any additional staff.

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