Experimental Analysis for Optimization of Thermal Performance of a Server in Single Phase Immersion Cooling

2019 ◽  
Author(s):  
Pravin A. Shinde ◽  
Pratik V. Bansode ◽  
Satyam Saini ◽  
Rajesh Kasukurthy ◽  
Tushar Chauhan ◽  
...  
Keyword(s):  
Power Consumption ◽  
Thermal Performance ◽  
Heat Dissipation ◽  
Operating Cost ◽  
Heat Removal ◽  
Dielectric Fluid ◽  
Inlet Temperature ◽  
Processing Unit ◽  
Central Processing ◽  
Immersion Cooling

Abstract Liquid immersion cooling of servers in synthetic dielectric fluids is an emerging technology which offers significant cooling energy savings and increased power densities for data centers. A noteworthy advantage of using immersion cooling is high heat dissipation capacity which is roughly 1200 times greater than air. Other advantages of dielectric fluid immersion cooling include high rack density, better server performance, even temperature profile, reduction in noise etc. The enhanced thermal properties of oil lead to the considerable savings in both upfront and operating cost over traditional methods. In this study, a server is completely submerged in a synthetic dielectric fluid. Experiments are conducted to observe the effects of varying the volumetric flow rate and oil inlet temperature on thermal performance and power consumption of the server. Various parameters like total server power consumption, the temperature of all heat generating components like Central Processing Unit (CPU), Dual in Line Memory Module (DIMM), input/output hub (IOH) chip, Platform Controller Hub (PCH), Network Interface Controller (NIC) are measured at steady state. Since this is an air-cooled server, the results obtained from the experiments will help in proposing better heat removal strategies like heat sink optimization, better ducting and server architecture. Assessment has been made on the effect of thermal shadowing caused by the two CPUs on the nearby components like DIMMs and PCH.

Computational Analysis for Thermal Optimization of Server for Single Phase Immersion Cooling

2019 ◽  
Author(s):  
Dhruvkumar Gandhi ◽  
Uschas Chowdhury ◽  
Tushar Chauhan ◽  
Pratik Bansode ◽  
Satyam Saini ◽  
...  
Keyword(s):  
Thermal Performance ◽  
Single Phase ◽  
Data Centers ◽  
Dielectric Fluid ◽  
Air Cooling ◽  
Processing Unit ◽  
Input Output ◽  
Dielectric Fluids ◽  
Immersion Cooling ◽  
Oil Immersion

Abstract Complete immersion of servers in synthetic dielectric fluids is rapidly becoming a popular technique to minimize the energy consumed by data centers for cooling purposes. In general, immersion cooling offers noteworthy advantages over conventional air-cooling methods as synthetic dielectric fluids have high heat dissipation capacities which are roughly about 1200 times greater than air. Other advantages of dielectric fluid immersion cooling include even thermal profile on chips, reduction in noise and addressing reliability and operational enhancements like whisker formation and electrochemical migration. Nevertheless, lack of data published and availability of long-term reliability data on immersion cooling is insufficient which makes most of data centers operators reluctant to implement this technique. The first part of this paper will compare thermal performance of single-phase oil immersion cooled HP ProLiant DL160 G6 server against air cooled server using computational fluid dynamics on 6SigmaET®. Focus of the study are major components of the server like Central Processing Unit (CPU), Dual in Line Memory Module (DIMM), Input/output Hub (IOH) chip and Input/output controller Hub (ICH). The second part of this paper focuses on thermal performance optimization of oil immersion cooled servers by varying inlet oil temperature, flow rate and using different fluid.

scholarly journals A Hardware Approach of a Low-Power IoT Communication Interface by NXP FlexIO Module

2019 ◽  
Vol 25 (6) ◽  
pp. 35-39
Author(s):  
Libor Chrastecky ◽  
Jaromir Konecny ◽  
Martin Stankus ◽  
Michal Prauzek
Keyword(s):  
Power Consumption ◽  
Low Power ◽  
Total Power ◽  
Processing Unit ◽  
Embedded Devices ◽  
Communication Interface ◽  
Result Section ◽  
Central Processing ◽  
Total Power Consumption ◽  
Software And Hardware

This article describes implementation possibilities of specialized microcontroller peripherals, as hardware solution for Internet of Things (IoT) low-power communication, interfaces. In this contribution, authors use the NXP FlexIO periphery. Meanwhile, RFC1662 is used as a reference communication standard. Implementation of RFC1662 is performed by software and hardware approaches. The total power consumption is measured during experiments. In the result section, authors evaluate a time-consumption trade-off between the software approach running in Central Processing Unit (CPU) and hardware implementation using NXP FlexIO periphery. The results confirm that the hardware-based approach is effective in terms of power consumption. This method is applicable in IoT embedded devices.

scholarly journals Power Efficient Frequency Scaled and Thermal-Aware Control Unit Design on FPGA

2019 ◽  
Vol 8 (9S2) ◽  
pp. 530-533
Keyword(s):  
Power Consumption ◽  
Energy Efficient ◽  
Field Programmable Gate Array ◽  
Control Unit ◽  
Processing Unit ◽  
Power Efficient ◽  
Central Processing ◽  
Unit Design ◽  
Efficient Control ◽  
Field Programmable

These works describe the implementation of a control unit which is an important part of Central Processing Unit (CPU) with the Field Programmable Gate Array (FPGA). In this work a frequency scaled and thermal aware energy-efficient control unit is designed with the help of 28 nanometer (nm) technology based FPGA. Frequency varies from 100MHz to 5GHz and the rise in frequency also gives rise in power consumption of control unit with FPGA. The thermal properties of FPGA also increase with increment in frequency. This whole experiment is done on Xilinx 14.1 ISE Design Suit and it is observed that lower the frequency, lower will be the power consumption of FPGA.

Novel Immersion Cooling Technique for a 3D Chip Stack

2013 ◽  
Author(s):  
Ashish Sinha ◽  
Krishna Kota ◽  
Pablo Hidalgo ◽  
Yogendra Joshi ◽  
Ari Glezer
Keyword(s):  
Heat Transfer ◽  
Heat Dissipation ◽  
Power Input ◽  
Synthetic Jet ◽  
Total Power ◽  
Dielectric Fluid ◽  
Immersion Cooling ◽  
Fluid Convection ◽  
Enhancing Heat Transfer ◽  
Jet Fan

An experimental investigation of a scheme for cooling electronics packaged in a 3D stack arrangement will be presented in this paper. The scheme utilizes immersion cooling of the stacked electronics in an enclosure filled with a dielectric fluid. Convection and conduction within the dielectric fluid drive heat from the 3D stack to the walls of the enclosure from where a ‘synthetic jet /fan air-cooled heat sink’ ultimately dissipates heat to the ambient. Four layers of thick film heaters embedded in FR-4 sheets, each attached to thin copper plates (innovatively stacked in a pyramidal arrangement for conducting heat laterally to the dielectric fluid and simultaneously promoting natural convection in the fluid), were used to simulate a 3D stack of electronics. For a comparative study, several runs were carried out, where the enclosure was filled with dielectric fluid (FC-770), FC-770 in combination with copper wool (with a goal of enhancing heat transfer in FC-770), and water. For a 40 W total power input to the stack, it was observed that the thermal resistance for heat dissipation to ambient from the four heaters varied from 1.67 K/W to 1.96 K/W with FC-770, 1.47 K/W to 1.87 K/W with FC-770 combined with copper wool, and 1.06 K/W to 1.50 K/W with water. The proposed cooling solution is passive and scalable, and is demonstrated to be practicable and effective in cooling 3D stacked electronics.

Thermal Power of Mobile Application Processor

2012 ◽  
Vol 2012 (1) ◽  
pp. 000866-000872
Author(s):  
Heung Kyu Kwon ◽  
Jugnwook Hwang ◽  
Hyunkwon Chung ◽  
Munsik Kang ◽  
Hyun Duk Cho ◽  
...  
Keyword(s):  
Mobile Application ◽  
Heat Dissipation ◽  
Thermal Power ◽  
Low Frequency ◽  
Critical Issue ◽  
Junction Temperature ◽  
Processing Unit ◽  
Power Performance ◽  
Central Processing ◽  
Application Processor

Until recently, heat dissipation performance of the conventional mobile AP (Application Processor) and mobile phone hasen't been a critical issue because the level of heat generated from a low-frequency, single core AP was insignificant. However, as the mobile AP consumes more power by adopting high frequency multi-core CPU (Central Processing Unit) and GPU (Graphic Processing Unit), the heat dissipation performance of its application set, such as smart phone and tablet PC (Personal Computer) became a critical issue. The conventional stand alone type applications sets such as desktop PCs and servers could afford additional thermal management tools such as heat sink, heat pipe and cooling fan to improve thermal performances. On the contrary, the limited inside space of mobile set doesn't allow the use of conventional cooling methods so that the feasible thermal solutions for the mobile AP and mobile sets are limited. In addition, since mobile set is normally in contact with human skin during its operation, the criterion, Tcsmax (Maximum Case Skin Temperature) which determines the thermal power per-formance of the mobile set is different from the conventional criterion, Tjmax (Maximum Junction Temperature) of CPU. Therefore, the thermal performance of mobile AP and its mobile set should be carefully determined to satisfy the Tcsmax by considering AP operation power and heat dissipating performance of the its application set. This paper shows how to define the thermal power performance of mobile AP and its mobile application set and which technologies are important for future mobile AP and its application sets.

Effects of Spatial Distribution of Heat and Grip Areas for Tablet Computer Use

2017 ◽  
Vol 61 (1) ◽  
pp. 362-366
Author(s):  
Han Zhang ◽  
Alan Hedge
Keyword(s):  
Spatial Distribution ◽  
Power Consumption ◽  
Thermal Comfort ◽  
Back Surface ◽  
Limiting Factor ◽  
Tablet Computer ◽  
Processing Unit ◽  
Heat Distribution ◽  
Central Processing ◽  
Spatial Layouts

The dissipation of heat from a tablet computer can be a limiting factor for hardware design, and this is affected by power consumption, the central processing unit (CPU) and the thickness of the casing. If the tablet casing gets too hot it affects user’s thermal comfort and may even cause skin burns. Consequently, this study investigated the effect of different spatial layouts of heat distribution on user thermal comfort. The areas that are less frequently contacted by fingers were identified on the back surface of a simulated tablet computer.

Onboard Device Encapsulation With Two-Phase Cooling

2017 ◽  
Vol 10 (2) ◽  
Author(s):  
S. J. Young ◽  
D. Janssen ◽  
E. A. Wenzel ◽  
B. M. Shadakofsky ◽  
F. A. Kulacki
Keyword(s):  
Heat Transfer ◽  
Pressure Drop ◽  
Integrated Circuit ◽  
Flow Boiling ◽  
Heat Removal ◽  
Coolant Flow ◽  
Coefficient Of Performance ◽  
Processing Unit ◽  
Two Phase ◽  
Central Processing

Onboard liquid cooling of electronic devices is demonstrated with liquid delivered externally to the point of heat removal through a conformal encapsulation. The encapsulation creates a flat microgap above the integrated circuit (IC) and delivers a uniform inlet coolant flow over the device. The coolant is Novec™ 7200, and the electronics are simulated with a resistance heater on a 1:1 scale. Thermal performance is demonstrated at power densities of ∼1 kW/cm3 in the microgap. Parameters investigated are pressure drop, average device temperature, heat transfer coefficient, and coefficient of performance (COP). Nusselt numbers for gap sizes of 0.25, 0.5, and 0.75 mm are reduced to a dimensionless correlation. With low coolant inlet subcooling, two-phase heat transfer is seen at all mass flows. Device temperatures reach 95 °C for power dissipation of 50–80 W (0.67–1.08 kW/cm3) depending on coolant flow for a gap of 0.5 mm. Coefficients of performance of ∼100 to 70,000 are determined via measured pressure drop and demonstrate a low pumping penalty at the device level within the range of power and coolant flow considered. The encapsulation with microgap flow boiling provides a means for use of higher power central processing unit and graphics processing unit devices and thereby enables higher computing performance, for example, in embedded airborne computers.

Measurement of the Thermal Performance of a Single-Phase Immersion Cooled Server at Elevated Temperatures for Prolonged Time

2018 ◽  
Author(s):  
Pratik V. Bansode ◽  
Jimil M. Shah ◽  
Gautam Gupta ◽  
Dereje Agonafer ◽  
Harsh Patel ◽  
...  
Keyword(s):  
Thermal Performance ◽  
Single Phase ◽  
Elevated Temperatures ◽  
Operating Cost ◽  
Failure Criteria ◽  
Climatic Conditions ◽  
Temperature Cycling ◽  
Dielectric Fluid ◽  
Air Cooling ◽  
Power Draw

Fully immersion of servers in electrically nonconductive (dielectric) fluid has recently become a promising technique for minimizing cooling energy consumption in data centers. The improved thermal properties of these dielectric fluids facilitate considerable savings in both upfront and operating cost over traditional air-cooling. This technology provides an opportunity for accommodating increased power densities. It also minimizes the common operational issues of air cooling technique like overheating and temperature swing in the system, fan failures, dust, air quality, and corrosion. This paper presents various data about the thermal performance of a fully single-phase dielectric fluid immersed server over wide temperature ranges (environment temperatures) from 25°C to 55°C for prolonged periods in an environmental chamber. This work explores the effects of high temperatures on the performance of a server and other components like pump, along with potential issues associated with extreme climatic conditions. The experimental data serves as a means to determine failure criteria for the server and pump by subjecting the system to accelerated thermal aging conditions i.e. around 55°C, consequently simulating the most extreme environmental condition that the server may encounter. Connector seals are inspected for expected degradation upon temperature cycling typically at such extreme conditions. Throttling limit for the server and pump power draw for different temperatures was determined to assess pump performance. Determining the relations between component behavior and operating temperature provides an accurate measure of lifetime of a server. The scope of this paper can be expanded by reviewing the effects of low temperatures on server and component performance. Changes to various performance parameters like power draw of pump and server at the higher and the lower operating temperatures and an understanding of issues like condensation can be used to quantify upper and lower limits for pump and server performance.

scholarly journals Energy Aware Virtual Machine Scheduling in Data Centers

Energies ◽  
2019 ◽  
Vol 12 (4) ◽  
pp. 646 ◽  
Author(s):  
Yeliang Qiu ◽  
Congfeng Jiang ◽  
Yumei Wang ◽  
Dongyang Ou ◽  
Youhuizi Li ◽  
...  
Keyword(s):  
Energy Efficiency ◽  
Power Consumption ◽  
Virtual Machine ◽  
Completion Time ◽  
Data Centers ◽  
Primary Concern ◽  
Processing Unit ◽  
Energy Aware ◽  
Average Completion Time ◽  
Central Processing

Power consumption is a primary concern in modern servers and data centers. Due to varying in workload types and intensities, different servers may have a different energy efficiency (EE) and energy proportionality (EP) even while having the same hardware configuration (i.e., central processing unit (CPU) generation and memory installation). For example, CPU frequency scaling and memory modules voltage scaling can significantly affect the server’s energy efficiency. In conventional virtualized data centers, the virtual machine (VM) scheduler packs VMs to servers until they saturate, without considering their energy efficiency and EP differences. In this paper we propose EASE, the Energy efficiency and proportionality Aware VM SchEduling framework containing data collection and scheduling algorithms. In the EASE framework, each server’s energy efficiency and EP characteristics are first identified by executing customized computing intensive, memory intensive, and hybrid benchmarks. Servers will be labelled and categorized with their affinity for different incoming requests according to their EP and EE characteristics. Then for each VM, EASE will undergo workload characterization procedure by tracing and monitoring their resource usage including CPU, memory, disk, and network and determine whether it is computing intensive, memory intensive, or a hybrid workload. Finally, EASE schedules VMs to servers by matching the VM’s workload type and the server’s EP and EE preference. The rationale of EASE is to schedule VMs to servers to keep them working around their peak energy efficiency point, i.e., the near optimal working range. When workload fluctuates, EASE re-schedules or migrates VMs to other servers to make sure that all the servers are running as near their optimal working range as they possibly can. The experimental results on real clusters show that EASE can save servers’ power consumption as much as 37.07%–49.98% in both homogeneous and heterogeneous clusters, while the average completion time of the computing intensive VMs increases only 0.31%–8.49%. In the heterogeneous nodes, the power consumption of the computing intensive VMs can be reduced by 44.22%. The job completion time can be saved by 53.80%.

Pengaruh Nano Fluida terhadap Temperatur Kondensor Cascade Straight Heat Pipe

Jurnal METTEK ◽  
2020 ◽  
Vol 5 (2) ◽  
pp. 79
Author(s):  
I Gusti Agung Ayu Desy Wulandari
Keyword(s):  
Heat Pipe ◽  
Thermal Performance ◽  
Maximum Load ◽  
Central Processing Unit ◽  
Working Fluid ◽  
Processing Unit ◽  
Temperature Decrease ◽  
Plate Temperature ◽  
Central Processing ◽  
Smart Technologies

Perkembangan teknologi Central Processing Unit (CPU) pada komputer telah mengarah pada smart technologies yaitu memiliki kinerja yang semakin baik namun dengan dimensi yang diperkecil. Dengan pengurangan dimensi tersebut, maka dapat menyebabkan peningkatan daya yang sangat signifikan dan peningkatan fluks kalor pada CPU yang tinggi. Pada penelitian ini, cascade straight heat pipe dirancang untuk sistem pendingin CPU yang lebih baik tanpa memerlukan tambahan daya dalam pengoperasiannya. Dari data penelitian yang didapat, kinerja termal terbaik ada pada cascade straight heat pipe dengan fluida kerja Al2O3 – TiO2 – air, dengan penurunan temperatur plat simulator sebesar 41,872 % pada beban maksimum dan temperatur keluaran kondensor yang tertinggi. Kinerja termal terbaik kedua adalah pada penggunaan fluida kerja Al2O3 – air dengan penurunan temperatur plat simulator sebesar 35,243 % pada beban maksimum. Kinerja termal yang kurang baik ada pada penggunaan fluida kerja air dengan penurunan temperatur plat simulator sebesar 28,648 % dan temperatur keluaran kondensor yang terendah. The technology development of Central Processing Unit (CPU) on computers has led into smart technologies, which have better performance but with smaller dimensions. With the reduction of the dimensions, it can cause a very significant increase in power and high increasement of heat flux in the CPU. In this research, cascade straight heat pipe is designed for better CPU cooling systems without the need of additional power for the operation. From the data obtained, the best thermal performance is cascade straight heat pipe with the working fluid of Al2O3 - TiO2 - water, with a simulator plate temperature decrease of 41.872 % at maximum load and the highest condenser output temperature. The second best thermal performance is on the use of Al2O3 - water with the simulator plate temperature decrease of 35,243 % at maximum load. The poor thermal performance is on the use of water with the simulator plate temperature decrease of 28,648 % and the lowest condenser output temperature.

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