Automatic Segmentation Method for Segmenting PBGA Package and PWB Regions During Warpage Measurement of Unpainted PWB Assembly

2015 ◽  
Vol 12 (2) ◽  
pp. 104-110
Author(s):  
Sungbum Kang ◽  
I. Charles Ume
Keyword(s):  
Automatic Segmentation ◽  
Measurement Techniques ◽  
Region Growing ◽  
Sample Surface ◽  
Printed Wiring Boards ◽  
Segmentation Method ◽  
Full Field ◽  
Digital Fringe Projection ◽  
Plastic Ball ◽  
Plastic Ball Grid Array

Among the various warpage measurement techniques, digital fringe projection (DFP) technique is recent trend because of its noncontact, full-field, and high-resolution measurement capabilities for measuring the warpage of chip packages, printed wiring boards (PWBs), and PWB assemblies (PWBAs). When using the DFP technique, reflective painting is generally sprayed on a sample surface to ensure uniform surface reflectance and to obtain better image contrast for the measurement process. However, because painted samples may no longer be reused, and the spray-painting process is not suitable inline, warpage measurement of unpainted chip packages, PWBs, and PWBAs using the DFP technique is required. One of the important tasks for measuring the warpage of unpainted PWBAs is segmentation of the chip package and PWB regions in unpainted PWBA images so that separate warpage of the chip packages and the PWBs can be determined. This paper presents a novel automatic segmentation method, region-growing method (RGM), which segments plastic-ball grid array (PBGA) packages and PWB regions in unpainted PWBA images. The experimental results show that the RGM successfully segments the PBGA package and PWB regions in unpainted PWBA images. The results also show that the RGM can be used in a DFP system to measures the warpage of PBGA packages and PWBs in unpainted PWBAs.

Automatic Segmentation Method for Segmenting PBGA Package and PWB Regions during Warpage Measurement of Unpainted PWB Assembly

2014 ◽  
Vol 2014 (1) ◽  
pp. 000574-000579 ◽  
Author(s):  
Sungbum Kang ◽  
I. Charles Ume
Keyword(s):  
Measurement Errors ◽  
Automatic Segmentation ◽  
Measurement Techniques ◽  
Sample Surface ◽  
Printed Wiring Boards ◽  
Segmentation Method ◽  
Full Field ◽  
Digital Fringe Projection ◽  
Plastic Ball ◽  
Plastic Ball Grid Array

Among the various warpage measurement techniques, the digital fringe projection (DFP) technique is recent trend because of its noncontact, full-field, and high-resolution measurement capabilities for measuring the warpage of chip packages, printed wiring boards (PWBs), and PWB assemblies (PWBAs). When using the DFP technique, reflective painting is generally sprayed on a sample surface to ensure uniform surface reflectance and to obtain better image contrast for the measurement process. However, because painted samples may no longer be re-used, and the spray-painting process is not suitable inline, warpage measurement of unpainted chip packages, PWBs, and PWBAs using the DFP technique is required. One of the important tasks for measuring unpainted PWBAs is segmentation of the chip package and PWB regions in unpainted PWBA images so that separate warpage of the chip package(s) and the PWB can be determined. In this paper, an automatic image segmentation method that is used to segment plastic ball grid array (PBGA) package and PWB regions in unpainted PWBA images is presented. Because the patterns such as the copper patterns and traces, and inscriptions on a PWBA can cause measurement errors, the patterns and inscriptions are automatically masked out during the segmentation. The method is experimentally tested by segmenting the PBGA package and PWB regions in three different PWBA samples and measuring the warpage of the PBGA packages and the PWB in an unpainted PWBA.

A Hybrid Approach for Fast 3D Segmentation of Brain Tumor

2020 ◽  
Vol 17 (1) ◽  
pp. 340-346
Author(s):  
Ankur Biswas ◽  
Nitai Debnath ◽  
Debasish Datta ◽  
Sushanta Das ◽  
Paritosh Bhattacharya
Keyword(s):  
Brain Tumor ◽  
Human Brain ◽  
Spatial Data ◽  
Automatic Segmentation ◽  
Hybrid Approach ◽  
Region Growing ◽  
Tumor Segmentation ◽  
Segmentation Method ◽  
Brain Tumor Segmentation ◽  
Need To Evaluate

Brain tumor segmentation and its study are tricky assignments of medical image processing due to complexity and variance of tumors however, forms a decisive factor for quantitative exploration of the spatial data in magnetic resonance imaging of human brain. In that mode, this modality of image has developed into a valuable investigative means in medicinal domain for detecting irregularity and discrepancy in human brain. The accuracy of segmentation method relies on its capability to discriminate different tissue, classes, discretely. Consequently there is an essential need to evaluate this capability prior to employing the segmentation method on medical images. In this paper, a semi-automatic segmentation technique is proposed to carry out the analysis and study of proficient pathologies of brain tumor of human brain. The task of segmentation is carried out integrating region growing with active contour methodologies. The evaluation of proposed methodology has been carried out on multislice image of MRI data and compared with other semi automatic and automatic techniques. It is observed by the experimental results that proposed system has the ability to accomplish fast segmentation and exact modeling of tumors in brain with a gratifying accuracy in order to support future treatment planning.

Backside Application of Acoustic Micro Imaging (AMI) on Plastic Ball Grid Array (PBGA) and Plastic Quad Flat Pack (PQFP) Packages

2004 ◽  
Author(s):  
Luis A. Curiel ◽  
Andrew J. Komrowski ◽  
Daniel J.D. Sullivan
Keyword(s):  
Ball Grid Array ◽  
Acoustic Microscopy ◽  
Electronic Packages ◽  
Nondestructive Technique ◽  
Molding Compound ◽  
Microscopy Technique ◽  
Plastic Ball ◽  
Die Surface ◽  
Plastic Ball Grid Array ◽  
Bond Pads

Abstract Acoustic Micro Imaging (AMI) is an established nondestructive technique for evaluation of electronic packages. Non-destructive evaluation of electronic packages is often a critical first step in the Failure Analysis (FA) process of semiconductor devices [1]. The molding compound to die surface interface of the Plastic Ball Grid Array (PBGA) and Plastic Quad Flat Pack (PQFP) packages is an important interface to acquire for the FA process. Occasionally, with these packages, the standard acoustic microscopy technique fails to identify defects at the molding compound to die surface interface. The hard to identify defects are found at the edge of the die next to the bond pads or under the bonds wires. This paper will present a technique, Backside Acoustic Micro Imaging (BAMI) analysis, which can better resolve the molding compound to die surface interface at the die edge by sending the acoustic signal through the backside of the PBGA and PQFP packages.

The Effect of Ball Pad Metallurgy and Ball Composition on Solder Ball Integrity of Plastic Ball Grid Array Packages

1998 ◽  
Author(s):  
C.H. Zhong ◽  
Sung Yi
Keyword(s):  
Failure Mode ◽  
Barrier Layer ◽  
Shear Force ◽  
Solder Ball ◽  
Ball Grid Array ◽  
Reliability Test ◽  
Shear Forces ◽  
Ball Shear ◽  
Plastic Ball ◽  
Plastic Ball Grid Array

Abstract Ball shear forces of plastic ball grid array (PBGA) packages are found to decrease after reliability test. Packages with different ball pad metallurgy form different intermetallic compounds (IMC) thus ball shear forces and failure modes are different. The characteristic and dynamic process of IMC formed are decided by ball pad metallurgy which includes Ni barrier layer and Au layer thickness. Solder ball composition also affects IMC formation dynamic process. There is basically no difference in ball shear force and failure mode for packages with different under ball pad metallurgy before reliability test. However shear force decreased and failure mode changed after reliability test, especially when packages exposed to high temperature. Major difference in ball shear force and failure mode was found for ball pad metallurgy of Ni barrier layer including Ni-P, pure Ni and Ni-Co. Solder ball composition was found to affect the IMC formation rate.

Assessment of automatic segmentation accuracy with various point cloud density

2020 ◽  
Vol 961 (7) ◽  
pp. 47-55
Author(s):  
A.G. Yunusov ◽  
A.J. Jdeed ◽  
N.S. Begliarov ◽  
M.A. Elshewy
Keyword(s):  
Point Cloud ◽  
Laser Scanning ◽  
Reference Data ◽  
Automatic Segmentation ◽  
Geometric Accuracy ◽  
Segmentation Method ◽  
Segmentation Methods ◽  
Segmentation Accuracy ◽  
Number Of Segments ◽  
Cloud Density

Laser scanning is considered as one of the most useful and fast technologies for modelling. On the other hand, the size of scan results can vary from hundreds to several million points. As a result, the large volume of the obtained clouds leads to complication at processing the results and increases the time costs. One way to reduce the volume of a point cloud is segmentation, which reduces the amount of data from several million points to a limited number of segments. In this article, we evaluated effect on the performance, the accuracy of various segmentation methods and the geometric accuracy of the obtained models at density changes taking into account the processing time. The results of our experiment were compared with reference data in a form of comparative analysis. As a conclusion, some recommendations for choosing the best segmentation method were proposed.

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