Thermal fatigue reliability enhancement of plastic ball grid array (PBGA) packages

2002 ◽  
Author(s):  
A.R. Syed
Keyword(s):  
Thermal Fatigue ◽  
Ball Grid Array ◽  
Fatigue Reliability ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Reliability Enhancement

BGA Solder Life Prediction under Combined Power and Temperature Cycling Condition

2012 ◽  
Vol 2012 (1) ◽  
pp. 000531-000534 ◽  
Author(s):  
Fei Chai ◽  
Michael Osterman ◽  
Michael Pecht
Keyword(s):  
Ball Grid Array ◽  
Temperature Cycling ◽  
Temperature Cycle ◽  
Fatigue Reliability ◽  
Sac305 Solder ◽  
Cycling Test ◽  
Solder Interconnect ◽  
Power Cycling ◽  
Plastic Ball ◽  
Plastic Ball Grid Array

Solder interconnect failure is a known life limiting failure mechanism that is induced by cyclic temperature excursions. Thermal fatigue reliability of solder interconnects is conventionally assessed by simple temperature cycling test, which applies a constant temperature range, fixed dwell times and ramp rates during the test. However, due to the user controlled power cycles, non-constant workloads, and changes in the surrounding environment, electronics in the field often experience a complex combination of temperature and power cycling. In this study, the effect of power cycling superposed on a simple temperature cycling is experimentally examined. Furthermore, a scheme for modeling the solder interconnect fatigue life of Plastic Ball Grid Array (PBGA) parts under the concurrent power and temperature cycling. Damage, defined as the number of applied cycles over the number of survivable cycles, from the simple temperature cycle and the power cycle are linearly added using Miner's rule, and compared with the concurrent temperature and power cycling test. Cycles to failure of each condition is derived by life testing conducted on Plastic Ball Grid Array (PBGA) assembled with eutectic and SAC305 solder.

Effect of Lid Materials on the Solder Ball Reliability of Thermally Enhanced Flip-Chip Plastic Ball Grid Array Packages

2006 ◽  
Vol 306-308 ◽  
pp. 1043-1048
Author(s):  
Yi-Ming Jen ◽  
Hsi Hsin Chien ◽  
Tsung-Shu Lin ◽  
Shih Hsiang Huang
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Ball ◽  
Flip Chip ◽  
Ball Grid Array ◽  
Stress Strain ◽  
Thermal Fatigue Life ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Solder Balls

This research studied the thermal fatigue life for eutectic solder balls of thermally enhanced flip-chip plastic ball grid array (FC-PBGA) packages with different lid materials under thermal cycling tests. Three FC-PBGA packages with different lid materials, i.e., Al, AlSiC, and Cu, were utilized to examine the lid material effect on solder ball reliability. The cyclic stress/strain behavior for the packages was estimated by using the nonlinear finite element method. The eutectic solder was assumed to be elastic-plastic-creep. The stable stress/strain results obtained from FEM analysis were utilized to predict the thermal fatigue life of solder balls by using the Coffin-Manson prediction model. Simulation results showed that the fatigue life of the FC-PBGA package with a Cu lid was much shorter than FC-PBGA packages with other lid materials. The relatively shorter fatigue life for the FC-PBGA package with a Cu lid was due to the complex constrained behavior caused by the thermal mismatch between the lid, substrate and the printed circuit board. The difference was insignificant in the fatigue lives between the package with an Al lid and the conventional package.

A Systematic Approach for Determining the Thermal Fatigue-Life of Plastic Ball Grid Array (PBGA) Lead-Free Solder Joints

2005 ◽  
Author(s):  
John Lau ◽  
Ricky Lee ◽  
Walter Dauksher ◽  
Dongkai Shangguan ◽  
Fubin Song ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Ball Grid Array ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermal Fatigue Life ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Free Solder

Reliability of plastic ball grid array (PBGA) SnAgCu lead-free solder joints is investigated. Emphasis is placed on the design for reliability (DFR) of lead-free solder joints. In particular, the thermal-fatigue life of the lead-free solder joints of a PBGA package assembly is predicted and compared with thermal cycling test results.

Backside Application of Acoustic Micro Imaging (AMI) on Plastic Ball Grid Array (PBGA) and Plastic Quad Flat Pack (PQFP) Packages

2004 ◽  
Author(s):  
Luis A. Curiel ◽  
Andrew J. Komrowski ◽  
Daniel J.D. Sullivan
Keyword(s):  
Ball Grid Array ◽  
Acoustic Microscopy ◽  
Electronic Packages ◽  
Nondestructive Technique ◽  
Molding Compound ◽  
Microscopy Technique ◽  
Plastic Ball ◽  
Die Surface ◽  
Plastic Ball Grid Array ◽  
Bond Pads

Abstract Acoustic Micro Imaging (AMI) is an established nondestructive technique for evaluation of electronic packages. Non-destructive evaluation of electronic packages is often a critical first step in the Failure Analysis (FA) process of semiconductor devices [1]. The molding compound to die surface interface of the Plastic Ball Grid Array (PBGA) and Plastic Quad Flat Pack (PQFP) packages is an important interface to acquire for the FA process. Occasionally, with these packages, the standard acoustic microscopy technique fails to identify defects at the molding compound to die surface interface. The hard to identify defects are found at the edge of the die next to the bond pads or under the bonds wires. This paper will present a technique, Backside Acoustic Micro Imaging (BAMI) analysis, which can better resolve the molding compound to die surface interface at the die edge by sending the acoustic signal through the backside of the PBGA and PQFP packages.

The Effect of Ball Pad Metallurgy and Ball Composition on Solder Ball Integrity of Plastic Ball Grid Array Packages

1998 ◽  
Author(s):  
C.H. Zhong ◽  
Sung Yi
Keyword(s):  
Failure Mode ◽  
Barrier Layer ◽  
Shear Force ◽  
Solder Ball ◽  
Ball Grid Array ◽  
Reliability Test ◽  
Shear Forces ◽  
Ball Shear ◽  
Plastic Ball ◽  
Plastic Ball Grid Array

Abstract Ball shear forces of plastic ball grid array (PBGA) packages are found to decrease after reliability test. Packages with different ball pad metallurgy form different intermetallic compounds (IMC) thus ball shear forces and failure modes are different. The characteristic and dynamic process of IMC formed are decided by ball pad metallurgy which includes Ni barrier layer and Au layer thickness. Solder ball composition also affects IMC formation dynamic process. There is basically no difference in ball shear force and failure mode for packages with different under ball pad metallurgy before reliability test. However shear force decreased and failure mode changed after reliability test, especially when packages exposed to high temperature. Major difference in ball shear force and failure mode was found for ball pad metallurgy of Ni barrier layer including Ni-P, pure Ni and Ni-Co. Solder ball composition was found to affect the IMC formation rate.

Plastic Ball Grid Array

2001 ◽  
pp. 577-613
Author(s):  
Mark J. Kuzawinski ◽  
Thomas R. Homa
Keyword(s):  
Ball Grid Array ◽  
Plastic Ball ◽  
Plastic Ball Grid Array
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