Prolonging the Lifetime of PEEK Packages for Implantable Electronic Devices Using Commercially Available Vacuum Thin Film Coatings

2014 ◽  
Vol 11 (3) ◽  
pp. 128-136
Author(s):  
Nathaniel Dahan ◽  
Nick Donaldson ◽  
Stephen Taylor ◽  
Nuno Sereno

For short term applications (less than three years), it may be possible to replace traditional long term packaging materials such as titanium with a biocompatible polymer such as PEEK. This paper investigates the use of commercially available thin films to decrease the water vapor permeation rate through the walls of a PEEK package. It was found that most physical vapor deposition (PVD) and plasma assisted chemical vapor deposition (PaCVD) coatings tested did not provide a significant improvement in lifetime, due to the porosity of the films produced. This is mostly linked to the morphology of the films (i.e., growth in columns which are poorly bonded together, creating a porous structure) and is exacerbated by the high surface roughness of the machined substrates. Applying a lacquer before coating reduces this effect significantly, and we found that the time constant of our coated packages was improved by a factor of 2.3. Based on the findings of our group's previous work and this paper, the maximum achievable lifetime of PEEK packages with a thin film coating and desiccant is presented. As an example, a coated cylindrical PEEK package (using atomic layer deposition, ALD) with a uniform wall thickness of 2 mm, an internal cavity size of 1.5 cm3, filled with 20% of desiccant, has a lifetime of 18.8 mo (27.2 mo with 30% of desiccant). This would be sufficient for a range of applications and provide a cheaper and more versatile packaging alternative to traditional packages.

2012 ◽  
Vol 1 (1) ◽  
pp. 46 ◽  
Author(s):  
Amir Mahyar Khorasani ◽  
Mohammad Reza Solymany yazdi ◽  
Mehdi Faraji ◽  
Alex Kootsookos

Thin-film coating plays a prominent role on the manufacture of many industrial devices. Coating can increase material performance due to the deposition process. Having adequate and precise model that can predict the hardness of PVD and CVD processes is so helpful for manufacturers and engineers to choose suitable parameters in order to obtain the best hardness and decreasing cost and time of industrial productions. This paper proposes the estimation of hardness of titanium thin-film layers as protective industrial tools by using multi-layer perceptron (MLP) neural network. Based on the experimental data that was obtained during the process of chemical vapor deposition (CVD) and physical vapor deposition (PVD), the modeling of the coating variables for predicting hardness of titanium thin-film layers, is performed. Then, the obtained results are experimentally verified and very accurate outcomes had been attained.


2019 ◽  
Vol 16 (12) ◽  
pp. 1900127 ◽  
Author(s):  
Morteza Aghaee ◽  
Joerie Verheyen ◽  
Alquin A. E. Stevens ◽  
Wilhelmus M. M. Kessels ◽  
Mariadriana Creatore

MRS Advances ◽  
2021 ◽  
Author(s):  
David Lehninger ◽  
Konstantin Mertens ◽  
Lukas Gerlich ◽  
Maximilian Lederer ◽  
Tarek Ali ◽  
...  

Abstract Zirconium-doped hafnium oxide (HZO) crystallizes at low temperatures and is thus ideal to implement ferroelectric (FE) functionalities into the back end of line (BEoL). Therefore, metal-ferroelectric-metal (MFM) capacitors are of great interest. Placed in the BEoL, they can be connected either to the drain- or the gate-contact of a standard logic device to realize different emerging FE-embedded non-volatile memory (eNVM) concepts. However, the low crystallization temperature increases also the risk for a premature crystallization of the HZO films during the growth of the top electrode (TE), in particular, if high-temperature processes like atomic layer deposition (ALD) or chemical vapor deposition (CVD) are used. Herein, the TE is deposited at room temperature via physical vapor deposition (PVD). The impact of different process gas flows on the FE properties of the HZO films is studied by X-ray diffraction and polarization versus electric field measurements. Graphic abstract


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